JP5134791B2 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
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- JP5134791B2 JP5134791B2 JP2006204251A JP2006204251A JP5134791B2 JP 5134791 B2 JP5134791 B2 JP 5134791B2 JP 2006204251 A JP2006204251 A JP 2006204251A JP 2006204251 A JP2006204251 A JP 2006204251A JP 5134791 B2 JP5134791 B2 JP 5134791B2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006204251A JP5134791B2 (ja) | 2006-07-27 | 2006-07-27 | レーザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006204251A JP5134791B2 (ja) | 2006-07-27 | 2006-07-27 | レーザ加工装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011238069A Division JP2012076147A (ja) | 2011-10-29 | 2011-10-29 | レーザ加工装置、レーザ加工データ設定装置、レーザ加工データ設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器 |
| JP2011238070A Division JP2012051032A (ja) | 2011-10-29 | 2011-10-29 | レーザ加工装置、レーザ加工データ設定装置、レーザ加工データ設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008030070A JP2008030070A (ja) | 2008-02-14 |
| JP2008030070A5 JP2008030070A5 (ko) | 2009-05-28 |
| JP5134791B2 true JP5134791B2 (ja) | 2013-01-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006204251A Active JP5134791B2 (ja) | 2006-07-27 | 2006-07-27 | レーザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5134791B2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942452A (zh) * | 2015-05-22 | 2015-09-30 | 广东正业科技股份有限公司 | 一种激光打孔机及利用激光打孔机的打孔方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5635917B2 (ja) * | 2011-01-19 | 2014-12-03 | 株式会社キーエンス | 印字品質評価システム、レーザマーキング装置、印字条件設定装置、印字品質評価装置、印字条件設定プログラム、印字品質評価プログラム、コンピュータで読み取り可能な記録媒体 |
| US10114364B2 (en) | 2013-04-12 | 2018-10-30 | Mitsubishi Electric Corporation | Numerical-control-program editing apparatus, numerical-control-program editing method, and program |
| CN113752252B (zh) * | 2021-08-10 | 2022-12-02 | 中国航发常州兰翔机械有限责任公司 | 一种叶轮的水约束层与激光冲击轨迹的联动方法及系统 |
| JP2023062990A (ja) | 2021-10-22 | 2023-05-09 | パナソニックＩｐマネジメント株式会社 | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124114A (ja) * | 1992-10-09 | 1994-05-06 | Mitsubishi Electric Corp | レーザ加工プログラム編集装置 |
| JP2000339011A (ja) * | 1999-05-26 | 2000-12-08 | Yamazaki Mazak Corp | ３次元線状加工機及び３次元線状加工機における加工プログラムの作成制御方法 |
| JP2004230443A (ja) * | 2003-01-31 | 2004-08-19 | Toppan Forms Co Ltd | カード付きシートのレーザ印字システムおよびこれにより印字されたカード付きシート |
| JP2004298905A (ja) * | 2003-03-31 | 2004-10-28 | Hitachi Ltd | レーザマーキング方法 |
-
2006
- 2006-07-27 JP JP2006204251A patent/JP5134791B2/ja active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942452A (zh) * | 2015-05-22 | 2015-09-30 | 广东正业科技股份有限公司 | 一种激光打孔机及利用激光打孔机的打孔方法 |
| CN104942452B (zh) * | 2015-05-22 | 2018-05-22 | 广东正业科技股份有限公司 | 一种激光打孔机及利用激光打孔机的打孔方法 |
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| Publication number | Publication date |
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| JP2008030070A (ja) | 2008-02-14 |
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