JP5132830B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP5132830B2 JP5132830B2 JP2012145155A JP2012145155A JP5132830B2 JP 5132830 B2 JP5132830 B2 JP 5132830B2 JP 2012145155 A JP2012145155 A JP 2012145155A JP 2012145155 A JP2012145155 A JP 2012145155A JP 5132830 B2 JP5132830 B2 JP 5132830B2
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- JP
- Japan
- Prior art keywords
- polishing
- hole
- polishing pad
- scratches
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
以上の測定結果を表1に示す。
2 研磨面(表面)
3 裏面
4 貫通孔
5 開口エッジ部
Claims (3)
- 研磨面に開口したスラリーを保持する貫通孔を有する研磨パッドにおいて、少なくともその貫通孔の開口のエッジ部にその全周にわたり傾斜が付けられており、
裏面またはこれと平行な線(基準線)と貫通孔内壁面とで挟む角度が90 ° 未満である、
ことを特徴とする研磨パッド。 - 研磨パッドが不織布タイプ、発泡樹脂タイプまたは硬質樹脂タイプのいずれかであることを特徴とする請求項1に記載の研磨パッド。
- 貫通孔は、直線状または曲線状に傾斜して開口している、ことを特徴とする請求項1または2に記載の研磨パッド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012145155A JP5132830B2 (ja) | 2012-06-28 | 2012-06-28 | 研磨パッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012145155A JP5132830B2 (ja) | 2012-06-28 | 2012-06-28 | 研磨パッド |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005174827A Division JP5105391B2 (ja) | 2005-06-15 | 2005-06-15 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012179714A JP2012179714A (ja) | 2012-09-20 |
JP5132830B2 true JP5132830B2 (ja) | 2013-01-30 |
Family
ID=47011379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012145155A Active JP5132830B2 (ja) | 2012-06-28 | 2012-06-28 | 研磨パッド |
Country Status (1)
Country | Link |
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JP (1) | JP5132830B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102950539B (zh) * | 2012-11-28 | 2015-06-24 | 天津市环欧半导体材料技术有限公司 | 磨片机研磨盘下砂口的改良构造 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1177515A (ja) * | 1997-09-10 | 1999-03-23 | Toshiba Mach Co Ltd | 平面研磨装置及び研磨装置に用いる研磨布 |
US6346032B1 (en) * | 1999-09-30 | 2002-02-12 | Vlsi Technology, Inc. | Fluid dispensing fixed abrasive polishing pad |
JP3849593B2 (ja) * | 2002-06-28 | 2006-11-22 | Jsr株式会社 | 研磨パッド及び複層型研磨パッド |
JP2004167605A (ja) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | 研磨パッドおよび研磨装置 |
JP2004186392A (ja) * | 2002-12-03 | 2004-07-02 | Toshiba Ceramics Co Ltd | 研磨布 |
JP2005019669A (ja) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | 研磨パッド、研磨装置、及びウェハの研磨方法 |
JP2005347404A (ja) * | 2004-06-01 | 2005-12-15 | Toyo Tire & Rubber Co Ltd | 半導体cmp用研磨パッド |
-
2012
- 2012-06-28 JP JP2012145155A patent/JP5132830B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2012179714A (ja) | 2012-09-20 |
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