JP5129826B2 - 脆性材料基板のブレイク方法 - Google Patents

脆性材料基板のブレイク方法 Download PDF

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Publication number
JP5129826B2
JP5129826B2 JP2010024311A JP2010024311A JP5129826B2 JP 5129826 B2 JP5129826 B2 JP 5129826B2 JP 2010024311 A JP2010024311 A JP 2010024311A JP 2010024311 A JP2010024311 A JP 2010024311A JP 5129826 B2 JP5129826 B2 JP 5129826B2
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JP
Japan
Prior art keywords
scribe line
breaking
substrate
roller
break
Prior art date
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Expired - Fee Related
Application number
JP2010024311A
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English (en)
Japanese (ja)
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JP2011161674A (ja
Inventor
克則 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010024311A priority Critical patent/JP5129826B2/ja
Priority to PCT/JP2011/052012 priority patent/WO2011096388A1/ja
Priority to TW100104036A priority patent/TWI426059B/zh
Priority to CN201180004547.3A priority patent/CN102596523B/zh
Priority to KR1020127009799A priority patent/KR101323678B1/ko
Publication of JP2011161674A publication Critical patent/JP2011161674A/ja
Application granted granted Critical
Publication of JP5129826B2 publication Critical patent/JP5129826B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
JP2010024311A 2010-02-05 2010-02-05 脆性材料基板のブレイク方法 Expired - Fee Related JP5129826B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010024311A JP5129826B2 (ja) 2010-02-05 2010-02-05 脆性材料基板のブレイク方法
PCT/JP2011/052012 WO2011096388A1 (ja) 2010-02-05 2011-02-01 脆性材料基板のブレイク方法
TW100104036A TWI426059B (zh) 2010-02-05 2011-02-01 Method for disassembling brittle material substrates
CN201180004547.3A CN102596523B (zh) 2010-02-05 2011-02-01 脆性材料基板的断裂方法
KR1020127009799A KR101323678B1 (ko) 2010-02-05 2011-02-01 취성 재료 기판의 브레이크 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010024311A JP5129826B2 (ja) 2010-02-05 2010-02-05 脆性材料基板のブレイク方法

Publications (2)

Publication Number Publication Date
JP2011161674A JP2011161674A (ja) 2011-08-25
JP5129826B2 true JP5129826B2 (ja) 2013-01-30

Family

ID=44355386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010024311A Expired - Fee Related JP5129826B2 (ja) 2010-02-05 2010-02-05 脆性材料基板のブレイク方法

Country Status (5)

Country Link
JP (1) JP5129826B2 (zh)
KR (1) KR101323678B1 (zh)
CN (1) CN102596523B (zh)
TW (1) TWI426059B (zh)
WO (1) WO2011096388A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103412432B (zh) * 2013-08-29 2016-07-06 深圳市华星光电技术有限公司 液晶面板裂片装置及裂片方法
JP2016043505A (ja) * 2014-08-20 2016-04-04 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
JP6413496B2 (ja) 2014-08-29 2018-10-31 三星ダイヤモンド工業株式会社 液晶表示パネルの製造方法
JP2016104683A (ja) 2014-11-19 2016-06-09 坂東機工株式会社 ガラス板の折割方法及びその折割装置
CN104926097A (zh) * 2015-07-08 2015-09-23 常州市金海基机械制造有限公司 一种数控玻璃切割机
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6601388B2 (ja) * 2016-12-28 2019-11-06 坂東機工株式会社 ガラス板の折割方法
CN108162068A (zh) * 2018-01-29 2018-06-15 广东利元亨智能装备有限公司 一种分板装置及分板上料设备
CN111112808A (zh) * 2018-10-30 2020-05-08 三星钻石工业股份有限公司 基板分断装置及基板分断方法
JP2021154502A (ja) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びに基板加工装置
JP2022003001A (ja) * 2020-06-23 2022-01-11 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07138039A (ja) * 1993-11-12 1995-05-30 Fuji Xerox Co Ltd スクライブ装置
JP3810127B2 (ja) * 1996-04-25 2006-08-16 京セラ株式会社 ガラス基板分断方法
KR100789455B1 (ko) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
EP1598163A1 (en) * 2003-02-21 2005-11-23 Mitsuboshi Diamond Industrial Co., Ltd. Substrate-processing table and substrate processing device
KR101003610B1 (ko) * 2003-09-24 2010-12-23 엘지디스플레이 주식회사 액정 표시패널의 절단장치 및 그 절단방법
WO2006070825A1 (ja) * 2004-12-28 2006-07-06 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法および基板分断システム
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP4718546B2 (ja) * 2005-05-30 2011-07-06 三星ダイヤモンド工業株式会社 脆性材料基板分断装置および分断方法
US20060280920A1 (en) * 2005-06-10 2006-12-14 Abbott John S Iii Selective contact with a continuously moving ribbon of brittle material to dampen or reduce propagation or migration of vibrations along the ribbon

Also Published As

Publication number Publication date
KR101323678B1 (ko) 2013-11-04
TW201144243A (en) 2011-12-16
CN102596523A (zh) 2012-07-18
WO2011096388A1 (ja) 2011-08-11
CN102596523B (zh) 2014-10-08
KR20120087920A (ko) 2012-08-07
JP2011161674A (ja) 2011-08-25
TWI426059B (zh) 2014-02-11

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