JP5129472B2 - 電力回路パッケージ及びその製作方法 - Google Patents
電力回路パッケージ及びその製作方法 Download PDFInfo
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Description
外部結合のために出力コネクタ44がアクセス可能なまま維持された状態で埋込み材料が出力コネクタを部分的に囲むように、埋込み材料58を加える前に形成される。1つの実施例では、出力コネクタ44は、外部プラグ(図示せず)を受けるための出力コネクタ通路46を含む。
11 電力回路パッケージ構成要素
12 ベース
13 ベース通路
14 基板
15 ビア接続部部分
16 回路層
17 ビア接続部部分
18 基板絶縁層
19 ビア接続部部分
20 基板電気的相互接続体
22 ビア接続部
23 ビア接続部
24 ビア接続部
26 電力半導体モジュール
28 電力半導体デバイス
29 シム
30 デバイスパッド
31 裏面接点
32 膜構造体
34 膜絶縁層
35 接着剤
36 膜電気的相互接続体
37 膜ビア
38 表面実装構成要素
39 開始層
40 表面実装構成要素
41 主要層
42 表面実装構成要素
43 仕上げ層
44 出力コネクタ
46 出力コネクタ通路
48 フレーム
50 フレーム通路
52 ハンダ
54 ハンダ
56 ハンダ
58 埋込み材料
60 熱的接合材料
62 熱交換器
70 基板チャネル
Claims (8)
- 基板(14)と、基板電気的相互接続体(20)がパターン形成された基板絶縁層(18)を各々が含む状態で前記基板全体を覆って配置された複数の相互接続回路層(16)と、前記基板の上面から前記基板電気的相互接続体(20)の少なくとも1つまで延びるビア接続部(22、24)とを含むベース(12)と、電力半導体デバイス(28)を備える電力半導体モジュール(26)と、
を含み、
前記電力半導体デバイスの各々が該それぞれの電力半導体デバイスの上面上のデバイスパッド(30)と該それぞれの電力半導体デバイスの下面上の裏面接点(31)とを含み、
前記電力半導体デバイスが、膜構造体(32)に結合され、
前記膜構造体が、膜絶縁層(34)と、前記膜絶縁層全体を覆って配置されかつ選択的に前記デバイスパッドまで延びる膜電気的相互接続体(36)とを含み、
前記裏面接点(31)が、選択した基板電気的相互接続体又はビア接続部に結合され、
前記選択した電気的相互接続体又はビア接続部に結合された表面実装構成要素(38)をさらに含み、
前記電力半導体モジュール及び表面実装構成要素を結合するための少なくとも2つのタイプのハンダをさらに含み、前記電力半導体モジュールを結合するための1つのタイプのハンダ(52)が、少なくとも1つの前記表面実装構成要素を結合するための別のタイプのハンダ(54)よりも高いリフロー温度を有する
ことを特徴とする、電力回路パッケージ(10)。 - 前記表面実装構成要素が、受動表面構成要素及び能動表面構成要素から成る群から選ばれた少なくとも1つの構成要素を含む、請求項1記載の電力回路パッケージ。
- 前記ビア接続部(22)の少なくとも幾つかが、熱的及び電気的結合するように構成される、請求項1記載の電力回路パッケージ。
- 前記電力半導体モジュールを少なくとも部分的に囲む埋込み材料(58)をさらに含む、請求項1記載の電力回路パッケージ。
- 前記選択した電気的相互接続体又はビア接続部に結合されかつ外部結合のためにアクセスできるように前記埋込み材料によって部分的に囲まれた出力コネクタ(44)をさらに含む、請求項4記載の電力回路パッケージ。
- 熱交換器(62)と、前記熱交換器と前記膜構造体の上面とを結合する熱的接合材料(60)とをさらに含む、請求項1記載の電力回路パッケージ。
- 前記基板が金属絶縁基板を含み、前記基板が、その中に埋込まれた冷却チャネル(70)をさらに含む、請求項1記載の電力回路パッケージ。
- 電力回路パッケージ(10)を製作する方法において、
基板(14)と、基板電気的相互接続体(20)がパターン形成された基板絶縁層(18)を各々が含む状態で前記基板全体を覆って配置された複数の相互接続回路層(16)と、前記基板の上面から前記電気的相互接続体の少なくとも1つまで延びるビア接続部(22、24)とを含むベース(12)を準備する段階と、
上面上のデバイスパッド(30)と下面上の裏面接点(31)とを各々が含みかつ膜構造体(32)に結合された電力半導体デバイス(28)を備える電力半導体モジュール(26)であって、前記膜構造体が、膜絶縁層(34)と前記膜絶縁層全体を覆って配置されかつ選択的に前記デバイスパッドまで延びる膜電気的相互接続体(36)とを含む電力半導体モジュール(26)を準備する段階と、
表面実装構成要素(38)を準備する段階と、
前記電力半導体モジュール及び表面実装構成要素を前記ベースの選択した電気的相互接続体又はビア接続部に取付ける段階と、
を含み、
前記電力半導体モジュール及び表面実装構成要素を取付ける段階が、前記電力半導体モジュールを第1のタイプのハンダ(52)でハンダ付けする段階と、次に前記表面実装構成要素を前記第1のハンダ(52)よりも低いリフロー温度を有する第2のタイプのハンダ(54)でハンダ付けする段階とを含む
ことを特徴とする、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/259,992 | 2005-10-26 | ||
US11/259,992 US7518236B2 (en) | 2005-10-26 | 2005-10-26 | Power circuit package and fabrication method |
Publications (2)
Publication Number | Publication Date |
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JP2007123884A JP2007123884A (ja) | 2007-05-17 |
JP5129472B2 true JP5129472B2 (ja) | 2013-01-30 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006288171A Expired - Fee Related JP5129472B2 (ja) | 2005-10-26 | 2006-10-24 | 電力回路パッケージ及びその製作方法 |
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Country | Link |
---|---|
US (1) | US7518236B2 (ja) |
EP (1) | EP1780791B1 (ja) |
JP (1) | JP5129472B2 (ja) |
KR (1) | KR101323416B1 (ja) |
CN (1) | CN100561735C (ja) |
CA (1) | CA2563480C (ja) |
IL (1) | IL178737A0 (ja) |
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US6856009B2 (en) | 2003-03-11 | 2005-02-15 | Micron Technology, Inc. | Techniques for packaging multiple device components |
TW200850127A (en) * | 2007-06-06 | 2008-12-16 | Delta Electronics Inc | Electronic device with passive heat-dissipating mechanism |
US8198460B2 (en) * | 2007-11-28 | 2012-06-12 | Fresenius Kabi Oncology Ltd. | Process for preparation of letrozole and its intermediates |
US8232637B2 (en) * | 2009-04-30 | 2012-07-31 | General Electric Company | Insulated metal substrates incorporating advanced cooling |
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KR20070045122A (ko) | 2007-05-02 |
KR101323416B1 (ko) | 2013-10-30 |
EP1780791B1 (en) | 2019-11-27 |
EP1780791A2 (en) | 2007-05-02 |
JP2007123884A (ja) | 2007-05-17 |
CN100561735C (zh) | 2009-11-18 |
IL178737A0 (en) | 2007-02-11 |
US7518236B2 (en) | 2009-04-14 |
US20070090464A1 (en) | 2007-04-26 |
CA2563480A1 (en) | 2007-04-26 |
CA2563480C (en) | 2016-02-02 |
CN1956192A (zh) | 2007-05-02 |
EP1780791A3 (en) | 2011-01-19 |
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