JP5125314B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP5125314B2
JP5125314B2 JP2007215819A JP2007215819A JP5125314B2 JP 5125314 B2 JP5125314 B2 JP 5125314B2 JP 2007215819 A JP2007215819 A JP 2007215819A JP 2007215819 A JP2007215819 A JP 2007215819A JP 5125314 B2 JP5125314 B2 JP 5125314B2
Authority
JP
Japan
Prior art keywords
resin
terminal
bump electrode
electronic component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007215819A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009049285A5 (enrdf_load_stackoverflow
JP2009049285A (ja
Inventor
伸晃 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007215819A priority Critical patent/JP5125314B2/ja
Publication of JP2009049285A publication Critical patent/JP2009049285A/ja
Publication of JP2009049285A5 publication Critical patent/JP2009049285A5/ja
Application granted granted Critical
Publication of JP5125314B2 publication Critical patent/JP5125314B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007215819A 2007-08-22 2007-08-22 電子装置 Active JP5125314B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007215819A JP5125314B2 (ja) 2007-08-22 2007-08-22 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007215819A JP5125314B2 (ja) 2007-08-22 2007-08-22 電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012198288A Division JP2013030789A (ja) 2012-09-10 2012-09-10 実装構造体及び実装構造体の製造方法

Publications (3)

Publication Number Publication Date
JP2009049285A JP2009049285A (ja) 2009-03-05
JP2009049285A5 JP2009049285A5 (enrdf_load_stackoverflow) 2010-10-07
JP5125314B2 true JP5125314B2 (ja) 2013-01-23

Family

ID=40501219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007215819A Active JP5125314B2 (ja) 2007-08-22 2007-08-22 電子装置

Country Status (1)

Country Link
JP (1) JP5125314B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9279060B2 (en) 2012-11-29 2016-03-08 Seiko Epson Corporation Ink composition, ink jet recording apparatus, and ink jet recording system

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011083423A1 (de) * 2011-09-26 2013-03-28 Siemens Aktiengesellschaft Kontaktfederanordnung und Verfahren zur Herstellung derselben
GB2500380A (en) * 2012-03-18 2013-09-25 Effect Photonics B V Arrangement and method of making electrical connections
JP6394904B2 (ja) * 2015-03-10 2018-09-26 セイコーエプソン株式会社 ヘッドの製造方法
JP6394903B2 (ja) * 2015-03-10 2018-09-26 セイコーエプソン株式会社 ヘッド及び液体噴射装置
KR102624624B1 (ko) 2016-06-15 2024-01-12 삼성디스플레이 주식회사 집적 회로 및 그 제조 방법
KR102540850B1 (ko) * 2016-07-29 2023-06-07 삼성디스플레이 주식회사 집적회로 칩 및 이를 포함하는 표시 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293753A (ja) * 1996-04-24 1997-11-11 Canon Inc 電気回路部品及び電気回路部品の製造方法及び導電ボール及び導電接続部材及び導電接続部材の製造方法
JPH10173006A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP4151634B2 (ja) * 2004-09-24 2008-09-17 セイコーエプソン株式会社 半導体装置とその製造方法、回路基板、電気光学装置および電子機器
JP2007115676A (ja) * 2005-09-21 2007-05-10 Sekisui Chem Co Ltd 導電性粒子及び導電接続構造体
JP4784304B2 (ja) * 2005-12-27 2011-10-05 セイコーエプソン株式会社 電子部品、電子部品の製造方法、回路基板及び電子機器
JP2007187777A (ja) * 2006-01-12 2007-07-26 Epson Imaging Devices Corp 電気光学装置、半導体装置、電気光学装置の製造方法及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9279060B2 (en) 2012-11-29 2016-03-08 Seiko Epson Corporation Ink composition, ink jet recording apparatus, and ink jet recording system

Also Published As

Publication number Publication date
JP2009049285A (ja) 2009-03-05

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