JP5117540B2 - 高周波装置 - Google Patents
高周波装置 Download PDFInfo
- Publication number
- JP5117540B2 JP5117540B2 JP2010137097A JP2010137097A JP5117540B2 JP 5117540 B2 JP5117540 B2 JP 5117540B2 JP 2010137097 A JP2010137097 A JP 2010137097A JP 2010137097 A JP2010137097 A JP 2010137097A JP 5117540 B2 JP5117540 B2 JP 5117540B2
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- control signal
- frequency power
- reflected power
- matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 7
- 230000003111 delayed effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 description 26
- 239000003990 capacitor Substances 0.000 description 11
- 239000012071 phase Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000005070 sampling Methods 0.000 description 6
- 230000002123 temporal effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 230000001052 transient effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Landscapes
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Description
11a、11b 高周波電源
12a、12b マッチングボックス
13a、13b 高周波反射電力検知器
14 制御信号発生器
2 負荷
S1、S2 高周波電力供給系
Claims (3)
- 高周波電力を負荷に供給可能な高周波電源と、該高周波電力の電流電圧の位相のチューニング及びインピーダンスの整合を行うマッチングボックスとをスイッチング稼働可能に備えた高周波装置において、
前記高周波電力を供給したときの反射電力を検知する高周波反射電力検知器と、前記高周波電源を稼働させるパルス状の基本制御信号を出力すると共に該基本制御信号の出力から遅れて前記高周波反射電力検知器及びマッチングボックスを稼働させるパルス状の外部制御信号をそれぞれ出力する1つの制御信号発生器とを備え、
前記制御信号発生器から前記高周波反射電力検知器及び前記マッチングボックスにそれぞれ所定のON時間を有する外部制御信号を出力し、この外部制御信号の出力と同期して前記高周波反射電力検知器から前記制御信号発生器に反射電力信号を帰還させ、この帰還させた反射電力信号が最小値となるように、前記制御信号発生器は前記マッチングボックスへの外部制御信号の前記ON時間を調整するように構成したことを特徴とする高周波装置。 - 前記高周波電源、マッチングボックス及び高周波反射電力検知器から構成される高周波電力供給系を複数備え、
前記1つの制御信号発生器は、一の高周波電力供給系の高周波電源に前記基本制御信号を出力すると共に、他の高周波電力供給系の高周波電源と各高周波電極供給系の高周波反射電力検知器及びマッチングボックスとに前記外部制御信号をそれぞれ出力し、各高周波反射電力検知器への前記外部制御信号の出力と同期して各高周波反射電力検知器から前記制御信号発生器に反射電力信号を帰還させ、帰還させた反射電力信号が最小値となるように各マッチングボックスへの前記外部制御信号のON時間を調整するように構成したことを特徴とする請求項1記載の高周波装置。 - 前記一の高周波電力供給系の高周波電源から前記負荷に放電用の高周波電力が供給され、前記他の高周波電力供給系の高周波電源から前記負荷にバイアス用の高周波電力が供給されることを特徴とする請求項2記載の高周波装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010137097A JP5117540B2 (ja) | 2003-10-23 | 2010-06-16 | 高周波装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003363580A JP2005130198A (ja) | 2003-10-23 | 2003-10-23 | 高周波装置 |
JP2010137097A JP5117540B2 (ja) | 2003-10-23 | 2010-06-16 | 高周波装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003363580A Division JP2005130198A (ja) | 2003-10-23 | 2003-10-23 | 高周波装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010288285A JP2010288285A (ja) | 2010-12-24 |
JP5117540B2 true JP5117540B2 (ja) | 2013-01-16 |
Family
ID=34642853
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003363580A Pending JP2005130198A (ja) | 2003-10-23 | 2003-10-23 | 高周波装置 |
JP2010137097A Expired - Lifetime JP5117540B2 (ja) | 2003-10-23 | 2010-06-16 | 高周波装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003363580A Pending JP2005130198A (ja) | 2003-10-23 | 2003-10-23 | 高周波装置 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP2005130198A (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1753011B1 (de) | 2005-08-13 | 2012-10-03 | HÜTTINGER Elektronik GmbH + Co. KG | Verfahren zur Erzeugung von Ansteuersignalen für HF-Leistungsgeneratoren |
JP4145925B2 (ja) * | 2006-01-31 | 2008-09-03 | シャープ株式会社 | プラズマエッチング方法 |
US8192576B2 (en) * | 2006-09-20 | 2012-06-05 | Lam Research Corporation | Methods of and apparatus for measuring and controlling wafer potential in pulsed RF bias processing |
DE102006052061B4 (de) * | 2006-11-04 | 2009-04-23 | Hüttinger Elektronik Gmbh + Co. Kg | Verfahren zur Ansteuerung von zumindest zwei HF-Leistungsgeneratoren |
JP2008210598A (ja) * | 2007-02-26 | 2008-09-11 | Nagano Japan Radio Co | プラズマ処理装置用整合器、プラズマ処理装置、および整合方法 |
JP2010238881A (ja) * | 2009-03-31 | 2010-10-21 | Tokyo Electron Ltd | プラズマ処理装置及びプラズマ処理方法 |
JP2010258605A (ja) * | 2009-04-22 | 2010-11-11 | Japan Radio Co Ltd | パルスディテクタ |
US8501631B2 (en) | 2009-11-19 | 2013-08-06 | Lam Research Corporation | Plasma processing system control based on RF voltage |
JP5977509B2 (ja) * | 2011-12-09 | 2016-08-24 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
JP5867701B2 (ja) * | 2011-12-15 | 2016-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US9197196B2 (en) | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
US10325759B2 (en) | 2012-02-22 | 2019-06-18 | Lam Research Corporation | Multiple control modes |
US9530620B2 (en) | 2013-03-15 | 2016-12-27 | Lam Research Corporation | Dual control modes |
US9368329B2 (en) * | 2012-02-22 | 2016-06-14 | Lam Research Corporation | Methods and apparatus for synchronizing RF pulses in a plasma processing system |
US10157729B2 (en) | 2012-02-22 | 2018-12-18 | Lam Research Corporation | Soft pulsing |
US9295148B2 (en) | 2012-12-14 | 2016-03-22 | Lam Research Corporation | Computation of statistics for statistical data decimation |
US9502216B2 (en) | 2013-01-31 | 2016-11-22 | Lam Research Corporation | Using modeling to determine wafer bias associated with a plasma system |
US9842725B2 (en) | 2013-01-31 | 2017-12-12 | Lam Research Corporation | Using modeling to determine ion energy associated with a plasma system |
US9114666B2 (en) | 2012-02-22 | 2015-08-25 | Lam Research Corporation | Methods and apparatus for controlling plasma in a plasma processing system |
US9030101B2 (en) * | 2012-02-22 | 2015-05-12 | Lam Research Corporation | Frequency enhanced impedance dependent power control for multi-frequency RF pulsing |
US9390893B2 (en) | 2012-02-22 | 2016-07-12 | Lam Research Corporation | Sub-pulsing during a state |
US9320126B2 (en) | 2012-12-17 | 2016-04-19 | Lam Research Corporation | Determining a value of a variable on an RF transmission model |
US9171699B2 (en) * | 2012-02-22 | 2015-10-27 | Lam Research Corporation | Impedance-based adjustment of power and frequency |
US10128090B2 (en) | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
US9462672B2 (en) | 2012-02-22 | 2016-10-04 | Lam Research Corporation | Adjustment of power and frequency based on three or more states |
JP5841917B2 (ja) | 2012-08-24 | 2016-01-13 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
US9408288B2 (en) | 2012-09-14 | 2016-08-02 | Lam Research Corporation | Edge ramping |
US9043525B2 (en) | 2012-12-14 | 2015-05-26 | Lam Research Corporation | Optimizing a rate of transfer of data between an RF generator and a host system within a plasma tool |
US9155182B2 (en) * | 2013-01-11 | 2015-10-06 | Lam Research Corporation | Tuning a parameter associated with plasma impedance |
US9779196B2 (en) | 2013-01-31 | 2017-10-03 | Lam Research Corporation | Segmenting a model within a plasma system |
US9620337B2 (en) | 2013-01-31 | 2017-04-11 | Lam Research Corporation | Determining a malfunctioning device in a plasma system |
US9107284B2 (en) | 2013-03-13 | 2015-08-11 | Lam Research Corporation | Chamber matching using voltage control mode |
US9119283B2 (en) | 2013-03-14 | 2015-08-25 | Lam Research Corporation | Chamber matching for power control mode |
KR20140122548A (ko) * | 2013-04-10 | 2014-10-20 | 피에스케이 주식회사 | 전력 공급 장치, 전력 공급 방법, 그리고 그를 이용한 기판 처리 장치 |
US9502221B2 (en) | 2013-07-26 | 2016-11-22 | Lam Research Corporation | Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching |
JP6312405B2 (ja) * | 2013-11-05 | 2018-04-18 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US9594105B2 (en) | 2014-01-10 | 2017-03-14 | Lam Research Corporation | Cable power loss determination for virtual metrology |
US10950421B2 (en) | 2014-04-21 | 2021-03-16 | Lam Research Corporation | Using modeling for identifying a location of a fault in an RF transmission system for a plasma system |
US9536749B2 (en) | 2014-12-15 | 2017-01-03 | Lam Research Corporation | Ion energy control by RF pulse shape |
JP6055537B2 (ja) * | 2015-12-21 | 2016-12-27 | 東京エレクトロン株式会社 | プラズマ処理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3148605B2 (ja) * | 1995-11-15 | 2001-03-19 | 日本電子株式会社 | 高周波装置 |
JP3220394B2 (ja) * | 1996-09-27 | 2001-10-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JPH10312899A (ja) * | 1997-05-15 | 1998-11-24 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及びプラズマ処理装置 |
KR100253080B1 (ko) * | 1997-06-25 | 2000-04-15 | 윤종용 | 반도체 장치의 건식식각 방법 및 그 제조 장치 |
JP2000054125A (ja) * | 1998-08-10 | 2000-02-22 | Nissin Electric Co Ltd | 表面処理方法および装置 |
JP2000150478A (ja) * | 1998-11-12 | 2000-05-30 | Matsushita Electronics Industry Corp | プラズマ発生方法及びプラズマ発生装置 |
JP2000151329A (ja) * | 1998-11-16 | 2000-05-30 | Jeol Ltd | 高周波装置 |
-
2003
- 2003-10-23 JP JP2003363580A patent/JP2005130198A/ja active Pending
-
2010
- 2010-06-16 JP JP2010137097A patent/JP5117540B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2010288285A (ja) | 2010-12-24 |
JP2005130198A (ja) | 2005-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5117540B2 (ja) | 高周波装置 | |
EP3743938B1 (en) | Impedance matching system and method of operating the same | |
US9947513B2 (en) | Edge ramping | |
KR102130921B1 (ko) | 전력 및 주파수의 상태 기반 조절 | |
JP5922053B2 (ja) | Rf生成器の電力および周波数をバイモーダルで自動チューニングするためのシステムおよび方法 | |
CN108140530B (zh) | 等离子rf偏置消除系统 | |
KR101819922B1 (ko) | 플라즈마 처리 장치 및 플라즈마 처리 방법 | |
TW202107515A (zh) | 電漿源/偏置功率遞送的高速同步化之射頻產生器及射頻訊號產生方法 | |
US20160268100A1 (en) | Methods and apparatus for synchronizing rf pulses in a plasma processing system | |
US20130214682A1 (en) | Frequency enhanced impedance dependent power control for multi-frequency rf pulsing | |
US11244809B2 (en) | Control method of driving frequency of pulsed variable frequency RF generator | |
TWI715921B (zh) | 阻抗匹配系統及其操作方法 | |
JP5145699B2 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
US11688584B2 (en) | Programmable ignition profiles for enhanced plasma ignition | |
JP2003264180A (ja) | プラズマ処理装置及びプラズマ処理停止方法 | |
CN112735935A (zh) | 多重电压控制方法及多重电压控制方式的高频电源装置 | |
JP2023146758A (ja) | プラズマ源 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100914 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101004 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120827 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121002 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121017 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5117540 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151026 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |