JP5113025B2 - コイル構造体及びその製造方法 - Google Patents
コイル構造体及びその製造方法 Download PDFInfo
- Publication number
- JP5113025B2 JP5113025B2 JP2008298391A JP2008298391A JP5113025B2 JP 5113025 B2 JP5113025 B2 JP 5113025B2 JP 2008298391 A JP2008298391 A JP 2008298391A JP 2008298391 A JP2008298391 A JP 2008298391A JP 5113025 B2 JP5113025 B2 JP 5113025B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- coil
- magnetic core
- wiring
- coil structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 239000000696 magnetic material Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 158
- 239000010949 copper Substances 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000000059 patterning Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008298391A JP5113025B2 (ja) | 2008-11-21 | 2008-11-21 | コイル構造体及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008298391A JP5113025B2 (ja) | 2008-11-21 | 2008-11-21 | コイル構造体及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010123879A JP2010123879A (ja) | 2010-06-03 |
| JP2010123879A5 JP2010123879A5 (enrdf_load_stackoverflow) | 2011-10-13 |
| JP5113025B2 true JP5113025B2 (ja) | 2013-01-09 |
Family
ID=42324933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008298391A Active JP5113025B2 (ja) | 2008-11-21 | 2008-11-21 | コイル構造体及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5113025B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014007339A (ja) | 2012-06-26 | 2014-01-16 | Ibiden Co Ltd | インダクタ部品、その製造方法及びプリント配線板 |
| CN204425811U (zh) * | 2013-01-24 | 2015-06-24 | 株式会社村田制作所 | 磁芯内置树脂多层基板及电子设备 |
| JP5923460B2 (ja) * | 2013-06-14 | 2016-05-24 | ダイヤモンド電機株式会社 | 点火コイル用誘磁鉄芯，及び，これを備える内燃機関用点火コイル |
| CN105163490B (zh) * | 2015-08-17 | 2017-11-07 | 广东欧珀移动通信有限公司 | 一种多功能元器件 |
| US11373803B2 (en) * | 2017-08-11 | 2022-06-28 | Applied Materials, Inc. | Method of forming a magnetic core on a substrate |
| JP2019204843A (ja) * | 2018-05-22 | 2019-11-28 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| JP7334425B2 (ja) * | 2019-02-28 | 2023-08-29 | Tdk株式会社 | コイル部品 |
| JP2020141043A (ja) * | 2019-02-28 | 2020-09-03 | Tdk株式会社 | コイル部品 |
| JP2020141041A (ja) * | 2019-02-28 | 2020-09-03 | Tdk株式会社 | コイル部品 |
| JP2021019041A (ja) * | 2019-07-18 | 2021-02-15 | 株式会社デンソー | 電子装置及びプリント基板 |
| JP7553284B2 (ja) | 2020-08-19 | 2024-09-18 | 戸田工業株式会社 | 磁性体アンテナ、及びそれを実装した基板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0795632B2 (ja) * | 1989-05-31 | 1995-10-11 | 太陽誘電株式会社 | コイル内蔵多層配線基板 |
| JP2001257471A (ja) * | 2000-03-10 | 2001-09-21 | Ngk Insulators Ltd | 多層配線基板及びその製造方法 |
| JP4464127B2 (ja) * | 2003-12-22 | 2010-05-19 | Ｎｅｃエレクトロニクス株式会社 | 半導体集積回路及びその製造方法 |
-
2008
- 2008-11-21 JP JP2008298391A patent/JP5113025B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010123879A (ja) | 2010-06-03 |
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