JP5112868B2 - 補助媒体として液体を使用するレーザ微細加工方法及びシステム - Google Patents

補助媒体として液体を使用するレーザ微細加工方法及びシステム Download PDF

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Publication number
JP5112868B2
JP5112868B2 JP2007531168A JP2007531168A JP5112868B2 JP 5112868 B2 JP5112868 B2 JP 5112868B2 JP 2007531168 A JP2007531168 A JP 2007531168A JP 2007531168 A JP2007531168 A JP 2007531168A JP 5112868 B2 JP5112868 B2 JP 5112868B2
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Prior art keywords
substrate
feature
substrate surface
liquid
depth
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Expired - Fee Related
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JP2007531168A
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Japanese (ja)
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JP2008512250A (ja
JP2008512250A5 (https=
Inventor
ヒュース，マーク
ロールケ，フィリップ，ジー
ゲイツ，クレイグ，エム
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
JP2007531168A 2004-09-13 2005-07-29 補助媒体として液体を使用するレーザ微細加工方法及びシステム Expired - Fee Related JP5112868B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US60953004P 2004-09-13 2004-09-13
US60/609,530 2004-09-13
US10/976,555 US7923658B2 (en) 2004-09-13 2004-10-29 Laser micromachining methods and systems
US10/976,555 2004-10-29
PCT/US2005/027113 WO2006031303A1 (en) 2004-09-13 2005-07-29 Laser micromachining methods and systems using a liquid as an assist medium

Publications (3)

Publication Number Publication Date
JP2008512250A JP2008512250A (ja) 2008-04-24
JP2008512250A5 JP2008512250A5 (https=) 2011-08-11
JP5112868B2 true JP5112868B2 (ja) 2013-01-09

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JP2007531168A Expired - Fee Related JP5112868B2 (ja) 2004-09-13 2005-07-29 補助媒体として液体を使用するレーザ微細加工方法及びシステム

Country Status (6)

Country Link
US (1) US7923658B2 (https=)
EP (1) EP1817135A1 (https=)
JP (1) JP5112868B2 (https=)
BR (1) BRPI0515658A (https=)
MX (1) MX2007002935A (https=)
WO (1) WO2006031303A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080220612A1 (en) * 2007-03-06 2008-09-11 Ute Drechsler Protection of polymer surfaces during micro-fabrication
US20090020511A1 (en) * 2007-07-17 2009-01-22 Kommera Swaroop K Ablation
CN109434301B (zh) * 2018-11-09 2020-09-25 科立视材料科技有限公司 一种可调节平面方向的激光加工载台及其使用方法
CN114571107B (zh) * 2022-03-28 2023-02-21 北京理工大学 一种超声辅助飞秒激光嵌套加工密封容器阳性微孔的方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556600A (en) 1968-08-30 1971-01-19 Westinghouse Electric Corp Distribution and cutting of rocks,glass and the like
US3656988A (en) 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
WO1997007928A2 (en) 1995-08-31 1997-03-06 Biolase Technology, Inc. User programmable combination of atomized particles for electromagnetically induced cutting
US5742028A (en) 1996-07-24 1998-04-21 General Electric Company Preloaded laser shock peening
US5773791A (en) 1996-09-03 1998-06-30 Kuykendal; Robert Water laser machine tool
JP2000117480A (ja) 1998-10-15 2000-04-25 Fanuc Ltd レーザ加工機
WO2000050198A1 (en) 1999-02-25 2000-08-31 Seiko Epson Corporation Method for machining work by laser beam
US6333488B1 (en) 1999-08-30 2001-12-25 General Electric Company Method for setting up and controlling confinement media flow in laser shock peening
US6720522B2 (en) 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
JP2004515365A (ja) * 2000-12-15 2004-05-27 エグシル テクノロジー リミテッド 半導体材料のレーザー加工
US6765174B2 (en) 2001-02-05 2004-07-20 Denso Corporation Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die
JP2002240294A (ja) * 2001-02-21 2002-08-28 Ricoh Co Ltd 液滴吐出ヘッド及びその製造方法並びにインクジェット記録装置
EP1404481B1 (en) * 2001-03-22 2006-04-19 Xsil Technology Limited A laser machining system and method
IL159431A0 (en) 2001-07-02 2004-06-01 Virtek Laser Systems Inc Method of ablating an opening in a hard, non-metallic substrate
JP2003151924A (ja) * 2001-08-28 2003-05-23 Tokyo Seimitsu Co Ltd ダイシング方法およびダイシング装置
WO2003028943A1 (en) 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
US20030062126A1 (en) 2001-10-03 2003-04-03 Scaggs Michael J. Method and apparatus for assisting laser material processing
TWI236944B (en) * 2001-12-17 2005-08-01 Tokyo Electron Ltd Film removal method and apparatus, and substrate processing system
US7994450B2 (en) 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
JP4079309B2 (ja) * 2002-02-12 2008-04-23 株式会社リコー ノズル加工装置及びノズル加工方法
JP2003324263A (ja) 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd プリント配線基板の製造方法
JP4043923B2 (ja) 2002-11-22 2008-02-06 東京エレクトロン株式会社 加工装置
US7893386B2 (en) 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same

Also Published As

Publication number Publication date
US7923658B2 (en) 2011-04-12
JP2008512250A (ja) 2008-04-24
US20060054605A1 (en) 2006-03-16
BRPI0515658A (pt) 2008-07-29
WO2006031303A1 (en) 2006-03-23
MX2007002935A (es) 2007-05-24
EP1817135A1 (en) 2007-08-15

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