BRPI0515658A - método de microusinagem a laser, sistema para definir uma trajetória de fluido através de um substrato e meio lido por computador - Google Patents

método de microusinagem a laser, sistema para definir uma trajetória de fluido através de um substrato e meio lido por computador

Info

Publication number
BRPI0515658A
BRPI0515658A BRPI0515658-0A BRPI0515658A BRPI0515658A BR PI0515658 A BRPI0515658 A BR PI0515658A BR PI0515658 A BRPI0515658 A BR PI0515658A BR PI0515658 A BRPI0515658 A BR PI0515658A
Authority
BR
Brazil
Prior art keywords
substrate
defining
fluid path
computer readable
readable medium
Prior art date
Application number
BRPI0515658-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Mark Huth
Philip G Rourke
Craig M Gates
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI0515658A publication Critical patent/BRPI0515658A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
BRPI0515658-0A 2004-09-13 2005-07-29 método de microusinagem a laser, sistema para definir uma trajetória de fluido através de um substrato e meio lido por computador BRPI0515658A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60953004P 2004-09-13 2004-09-13
US10/976,555 US7923658B2 (en) 2004-09-13 2004-10-29 Laser micromachining methods and systems
PCT/US2005/027113 WO2006031303A1 (en) 2004-09-13 2005-07-29 Laser micromachining methods and systems using a liquid as an assist medium

Publications (1)

Publication Number Publication Date
BRPI0515658A true BRPI0515658A (pt) 2008-07-29

Family

ID=35285436

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0515658-0A BRPI0515658A (pt) 2004-09-13 2005-07-29 método de microusinagem a laser, sistema para definir uma trajetória de fluido através de um substrato e meio lido por computador

Country Status (6)

Country Link
US (1) US7923658B2 (https=)
EP (1) EP1817135A1 (https=)
JP (1) JP5112868B2 (https=)
BR (1) BRPI0515658A (https=)
MX (1) MX2007002935A (https=)
WO (1) WO2006031303A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080220612A1 (en) * 2007-03-06 2008-09-11 Ute Drechsler Protection of polymer surfaces during micro-fabrication
US20090020511A1 (en) * 2007-07-17 2009-01-22 Kommera Swaroop K Ablation
CN109434301B (zh) * 2018-11-09 2020-09-25 科立视材料科技有限公司 一种可调节平面方向的激光加工载台及其使用方法
CN114571107B (zh) * 2022-03-28 2023-02-21 北京理工大学 一种超声辅助飞秒激光嵌套加工密封容器阳性微孔的方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556600A (en) 1968-08-30 1971-01-19 Westinghouse Electric Corp Distribution and cutting of rocks,glass and the like
US3656988A (en) 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
WO1997007928A2 (en) 1995-08-31 1997-03-06 Biolase Technology, Inc. User programmable combination of atomized particles for electromagnetically induced cutting
US5742028A (en) 1996-07-24 1998-04-21 General Electric Company Preloaded laser shock peening
US5773791A (en) 1996-09-03 1998-06-30 Kuykendal; Robert Water laser machine tool
JP2000117480A (ja) 1998-10-15 2000-04-25 Fanuc Ltd レーザ加工機
WO2000050198A1 (en) 1999-02-25 2000-08-31 Seiko Epson Corporation Method for machining work by laser beam
US6333488B1 (en) 1999-08-30 2001-12-25 General Electric Company Method for setting up and controlling confinement media flow in laser shock peening
US6720522B2 (en) 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
JP2004515365A (ja) * 2000-12-15 2004-05-27 エグシル テクノロジー リミテッド 半導体材料のレーザー加工
US6765174B2 (en) 2001-02-05 2004-07-20 Denso Corporation Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die
JP2002240294A (ja) * 2001-02-21 2002-08-28 Ricoh Co Ltd 液滴吐出ヘッド及びその製造方法並びにインクジェット記録装置
EP1404481B1 (en) * 2001-03-22 2006-04-19 Xsil Technology Limited A laser machining system and method
IL159431A0 (en) 2001-07-02 2004-06-01 Virtek Laser Systems Inc Method of ablating an opening in a hard, non-metallic substrate
JP2003151924A (ja) * 2001-08-28 2003-05-23 Tokyo Seimitsu Co Ltd ダイシング方法およびダイシング装置
WO2003028943A1 (en) 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
US20030062126A1 (en) 2001-10-03 2003-04-03 Scaggs Michael J. Method and apparatus for assisting laser material processing
TWI236944B (en) * 2001-12-17 2005-08-01 Tokyo Electron Ltd Film removal method and apparatus, and substrate processing system
US7994450B2 (en) 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
JP4079309B2 (ja) * 2002-02-12 2008-04-23 株式会社リコー ノズル加工装置及びノズル加工方法
JP2003324263A (ja) 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd プリント配線基板の製造方法
JP4043923B2 (ja) 2002-11-22 2008-02-06 東京エレクトロン株式会社 加工装置
US7893386B2 (en) 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same

Also Published As

Publication number Publication date
US7923658B2 (en) 2011-04-12
JP5112868B2 (ja) 2013-01-09
JP2008512250A (ja) 2008-04-24
US20060054605A1 (en) 2006-03-16
WO2006031303A1 (en) 2006-03-23
MX2007002935A (es) 2007-05-24
EP1817135A1 (en) 2007-08-15

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2256 DE 01/04/2014.