JP5110244B2 - 化学機械研磨用水系分散体および化学機械研磨方法 - Google Patents

化学機械研磨用水系分散体および化学機械研磨方法 Download PDF

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JP5110244B2
JP5110244B2 JP2006048946A JP2006048946A JP5110244B2 JP 5110244 B2 JP5110244 B2 JP 5110244B2 JP 2006048946 A JP2006048946 A JP 2006048946A JP 2006048946 A JP2006048946 A JP 2006048946A JP 5110244 B2 JP5110244 B2 JP 5110244B2
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aqueous dispersion
polishing
chemical mechanical
mechanical polishing
mass
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JP2006287207A5 (enrdf_load_stackoverflow
JP2006287207A (ja
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和一 内倉
雅幸 服部
信夫 川橋
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JSR Corp
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JSR Corp
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006048946A 2005-03-09 2006-02-24 化学機械研磨用水系分散体および化学機械研磨方法 Expired - Fee Related JP5110244B2 (ja)

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JP2005064754 2005-03-09
JP2005064754 2005-03-09
JP2006048946A JP5110244B2 (ja) 2005-03-09 2006-02-24 化学機械研磨用水系分散体および化学機械研磨方法

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JP2006287207A JP2006287207A (ja) 2006-10-19
JP2006287207A5 JP2006287207A5 (enrdf_load_stackoverflow) 2006-12-14
JP5110244B2 true JP5110244B2 (ja) 2012-12-26

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080070074A (ko) 2005-12-27 2008-07-29 히다치 가세고교 가부시끼가이샤 금속용 연마액 및 피연마막의 연마 방법
JP2008205433A (ja) * 2007-01-25 2008-09-04 Jsr Corp 電気光学表示装置用基板に設けられたバリアメタル層を研磨するための化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法
JP5327427B2 (ja) * 2007-06-19 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法
JPWO2009028256A1 (ja) * 2007-08-31 2010-11-25 Jsr株式会社 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法
JP2009065001A (ja) * 2007-09-07 2009-03-26 Jsr Corp 化学機械研磨用水系分散体、該分散体を調製するためのキット、および化学機械研磨用水系分散体の調製方法
JP2010161201A (ja) * 2009-01-08 2010-07-22 Jsr Corp 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の製造方法
EP2776523B1 (en) * 2011-11-09 2016-07-20 Rhodia Operations Additive mixture and composition and method for polishing glass substrates
CN104093810B (zh) * 2012-02-01 2016-01-20 日立化成株式会社 金属用研磨液及研磨方法
JP7731543B2 (ja) * 2023-02-28 2025-09-01 熊本県 研磨加工物の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3179064B2 (ja) * 1999-01-18 2001-06-25 株式会社東京精密 スラリーの供給装置
JP2003133266A (ja) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2003151927A (ja) * 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd 研磨用組成物
AU2003235964A1 (en) * 2002-04-30 2003-11-17 Hitachi Chemical Co., Ltd. Polishing fluid and polishing method
TWI282360B (en) * 2002-06-03 2007-06-11 Hitachi Chemical Co Ltd Polishing composition and polishing method thereof
JP4070622B2 (ja) * 2003-01-29 2008-04-02 富士フイルム株式会社 金属用研磨液及び研磨方法
JP4649871B2 (ja) * 2003-05-12 2011-03-16 Ｊｓｒ株式会社 化学機械研磨剤キットを用いた化学機械研磨方法
JP2005045229A (ja) * 2003-07-04 2005-02-17 Jsr Corp 化学機械研磨用水系分散体および化学機械研磨方法

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