JP5109643B2 - 光基板の製造方法 - Google Patents
光基板の製造方法 Download PDFInfo
- Publication number
- JP5109643B2 JP5109643B2 JP2007326694A JP2007326694A JP5109643B2 JP 5109643 B2 JP5109643 B2 JP 5109643B2 JP 2007326694 A JP2007326694 A JP 2007326694A JP 2007326694 A JP2007326694 A JP 2007326694A JP 5109643 B2 JP5109643 B2 JP 5109643B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- optical
- dummy film
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Description
2 絶縁樹脂層
3 フィルム
4 感光性樹脂
5 電子部品
6 金線
7 第1のダミーフィルム
8 第2のダミーフィルム
9 発光素子
10 モールド用樹脂
11 光導波路
12 光ファイバ
20 モジュール用基板
30 光基板
Claims (3)
- 光導波路と光ファイバとを接合する光基板の製造方法であって、
キャリアとなるフィルム上においてモジュール用基板を形成し、
前記キャリアとなるフィルム上に、光導波路と同一の厚さを有する第1のダミーフィルムを前記モジュール用基板に隣接して配置し、
前記キャリアとなるフィルム上に、光ファイバの外径と同一の厚さを有する第2のダミーフィルムを前記第1のダミーフィルムに隣接して配置し、
前記モジュール用基板と前記第1のダミーフィルムとに跨り前記第1のダミーフィルムに発光面又は受光面を対向させて発光素子又は受光素子を配置し、
前記モジュール用基板と前記第1のダミーフィルムと前記第2のダミーフィルムと前記発光素子又は受光素子とをモールド用樹脂で封止固定し、
前記キャリアとなるフィルム、前記第1のダミーフィルム及び前記第2のダミーフィルムとを剥離し、
前記第1のダミーフィルムが剥離された部分に光導波路を実装し、
前記第2のダミーフィルムが剥離された部分に光ファイバを実装することを特徴とする光基板の製造方法。 - 前記第1のダミーフィルムと前記第2のダミーフィルムとが耐熱性を有する高分子材料のフィルムであることを特徴とする請求項1に記載の光基板の製造方法。
- 前記モジュール用基板は、
絶縁樹脂層を準備し、
前記絶縁樹脂層上の一方の面に銅箔を形成し、
前記絶縁樹脂層を第1の所望のパターンに形成し、
前記パターン形成された絶縁樹脂層を前記キャリアとなるフィルムに貼り合わせ、
前記銅箔を第2の所望のパターンに形成して得られることを特徴とする請求項1又は2に記載の光基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326694A JP5109643B2 (ja) | 2007-12-19 | 2007-12-19 | 光基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326694A JP5109643B2 (ja) | 2007-12-19 | 2007-12-19 | 光基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009150946A JP2009150946A (ja) | 2009-07-09 |
JP5109643B2 true JP5109643B2 (ja) | 2012-12-26 |
Family
ID=40920169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007326694A Expired - Fee Related JP5109643B2 (ja) | 2007-12-19 | 2007-12-19 | 光基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5109643B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013231860A (ja) * | 2012-04-27 | 2013-11-14 | Hitachi Chemical Co Ltd | レンズ付き光導波路の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003107301A (ja) * | 2001-09-28 | 2003-04-09 | Toshiba Corp | 光通信用モジュール |
JP2004069824A (ja) * | 2002-08-02 | 2004-03-04 | Toppan Printing Co Ltd | 光配線基板 |
JP2004354532A (ja) * | 2003-05-27 | 2004-12-16 | Seiko Epson Corp | 光モジュール及びその製造方法、光通信装置、電子機器 |
JP2005128093A (ja) * | 2003-10-21 | 2005-05-19 | Nalux Co Ltd | 光ファイバ用コネクタおよびその製造方法 |
JP3955065B2 (ja) * | 2005-01-18 | 2007-08-08 | シャープ株式会社 | 光結合器 |
JP5029343B2 (ja) * | 2007-12-18 | 2012-09-19 | 凸版印刷株式会社 | 光基板の製造方法 |
-
2007
- 2007-12-19 JP JP2007326694A patent/JP5109643B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009150946A (ja) | 2009-07-09 |
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