JP5102793B2 - プリプレグ硬化測定方法 - Google Patents
プリプレグ硬化測定方法 Download PDFInfo
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- JP5102793B2 JP5102793B2 JP2009039713A JP2009039713A JP5102793B2 JP 5102793 B2 JP5102793 B2 JP 5102793B2 JP 2009039713 A JP2009039713 A JP 2009039713A JP 2009039713 A JP2009039713 A JP 2009039713A JP 5102793 B2 JP5102793 B2 JP 5102793B2
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- prepreg
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- 238000000691 measurement method Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims description 44
- 125000003700 epoxy group Chemical group 0.000 claims description 42
- 238000001228 spectrum Methods 0.000 claims description 36
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 claims description 23
- 238000010521 absorption reaction Methods 0.000 claims description 21
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 4
- 230000003595 spectral effect Effects 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 40
- 230000009102 absorption Effects 0.000 description 19
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000035515 penetration Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000001028 reflection method Methods 0.000 description 5
- 230000001066 destructive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002835 absorbance Methods 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 238000007873 sieving Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- Investigating Or Analysing Materials By Optical Means (AREA)
Description
・サンプルA:パナソニック電工製プリプレグ、ビスフェノールA型エポキシ樹脂、ガラス基材、厚み200μm
・サンプルB:パナソニック電工製プリプレグ、ノボラック型エポキシ樹脂、ガラス基材、厚み200μm
・サンプルC:パナソニック電工製プリプレグ、ノボラック型エポキシ樹脂、ガラス基材、厚み100μm
・サンプルD:パナソニック電工製プリプレグ、ノボラック型エポキシ樹脂、ガラス基材、厚み60μm
まず、未硬化のプリプレグをFT−IRにて測定して、ライブラリーデータと比較した。図6に、スペクトルの測定結果を示す。
2 プリズム
Claims (1)
- 芳香族エポキシ樹脂を含有する樹脂組成物がガラス基材に含浸された半硬化状態のプリプレグを、エポキシ基の吸収ピークは910〜915cm −1 を用いて、ベンゼン環の吸収ピークは、ビスフェノールA型エポキシ樹脂については830cm −1 又は1510cm −1 を、ノボラック型エポキシ樹脂については1023cm −1 を用いて、FT−IRにてATR法によりスペクトルを測定し、得られたスペクトルのエポキシ基とベンゼン環との中赤外領域のピーク比に基づき、ゲルタイムの判明している芳香族エポキシ樹脂のスペクトルライブラリーのピーク比と照合することにより、プリプレグのゲルタイムを推定することを特徴とするプリプレグ硬化測定方法。
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JP2009039713A JP5102793B2 (ja) | 2009-02-23 | 2009-02-23 | プリプレグ硬化測定方法 |
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JP2009039713A JP5102793B2 (ja) | 2009-02-23 | 2009-02-23 | プリプレグ硬化測定方法 |
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JP2010197099A JP2010197099A (ja) | 2010-09-09 |
JP5102793B2 true JP5102793B2 (ja) | 2012-12-19 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6063367B2 (ja) * | 2012-12-04 | 2017-01-18 | 本田技研工業株式会社 | エポキシ樹脂の混練分散性評価方法 |
GB2528487A (en) * | 2014-07-23 | 2016-01-27 | Airbus Operations Ltd | Apparatus and method for testing materials |
GB2528488A (en) | 2014-07-23 | 2016-01-27 | Airbus Operations Ltd | Method and apparatus for testing materials |
CN114088654B (zh) * | 2021-10-12 | 2024-06-04 | 南京玻璃纤维研究设计院有限公司 | 一种评价玻纤涂敷物有效性的方法及其应用 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2542013B2 (ja) * | 1987-10-26 | 1996-10-09 | 旭化成工業株式会社 | プリプレグ用エポキシ樹脂組成物 |
JPH0283610A (ja) * | 1988-09-20 | 1990-03-23 | Ricoh Co Ltd | 操作間の依存関係を用いた操作の取り消し方法 |
JPH0361059U (ja) * | 1989-10-16 | 1991-06-14 | ||
US5142151A (en) * | 1989-11-17 | 1992-08-25 | Allied-Signal Inc. | Method for measuring degree of cure of resin in a composite material and process for making the same |
US5457319A (en) * | 1993-06-02 | 1995-10-10 | Alliedsignal Inc. | Process for measurement of the degree of cure and percent resin of glass-fiber reinforced epoxy resin prepreg |
JPH08300350A (ja) * | 1995-05-15 | 1996-11-19 | Matsushita Electric Works Ltd | プリプレグの製造方法 |
CA2184342A1 (en) * | 1995-09-28 | 1997-03-29 | Robert C. Lam | Fibrous lining material comprising a less fibrillated aramid and synthetic graphite |
DE60032624T2 (de) * | 1999-11-04 | 2007-11-15 | Cytec Technology Corp., Wilmington | Bei variablen temperaturen härtbare zusammensetzung |
JP2007137041A (ja) * | 2005-10-17 | 2007-06-07 | Hitachi Chem Co Ltd | 接着補助剤付き銅箔、プリント配線板および硬化度の評価方法 |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007248431A (ja) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | 硬化性樹脂の硬化度測定方法 |
FI124017B (fi) * | 2006-06-30 | 2014-01-31 | Stick Tech Oy | Kovettavat kuitulujitetut komposiitit ja menetelmä aplikaatio-orientuneiden kuitulujitettujen komposiittien valmistamiseksi |
JP4862646B2 (ja) * | 2006-12-20 | 2012-01-25 | パナソニック電工株式会社 | 樹脂シート材の硬化度測定装置 |
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