JP5100449B2 - 複合コネクタおよびそれを備える電子機器 - Google Patents

複合コネクタおよびそれを備える電子機器 Download PDF

Info

Publication number
JP5100449B2
JP5100449B2 JP2008055464A JP2008055464A JP5100449B2 JP 5100449 B2 JP5100449 B2 JP 5100449B2 JP 2008055464 A JP2008055464 A JP 2008055464A JP 2008055464 A JP2008055464 A JP 2008055464A JP 5100449 B2 JP5100449 B2 JP 5100449B2
Authority
JP
Japan
Prior art keywords
terminal
wiring board
terminals
composite connector
signal terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008055464A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009212009A (ja
JP2009212009A5 (enExample
Inventor
英明 百瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008055464A priority Critical patent/JP5100449B2/ja
Priority to US12/397,953 priority patent/US7722407B2/en
Priority to CN200910118394XA priority patent/CN101527398B/zh
Publication of JP2009212009A publication Critical patent/JP2009212009A/ja
Publication of JP2009212009A5 publication Critical patent/JP2009212009A5/ja
Application granted granted Critical
Publication of JP5100449B2 publication Critical patent/JP5100449B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
JP2008055464A 2008-03-05 2008-03-05 複合コネクタおよびそれを備える電子機器 Expired - Fee Related JP5100449B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008055464A JP5100449B2 (ja) 2008-03-05 2008-03-05 複合コネクタおよびそれを備える電子機器
US12/397,953 US7722407B2 (en) 2008-03-05 2009-03-04 Composite connector and electronic apparatus thereof
CN200910118394XA CN101527398B (zh) 2008-03-05 2009-03-05 复合连接器及相应的电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008055464A JP5100449B2 (ja) 2008-03-05 2008-03-05 複合コネクタおよびそれを備える電子機器

Publications (3)

Publication Number Publication Date
JP2009212009A JP2009212009A (ja) 2009-09-17
JP2009212009A5 JP2009212009A5 (enExample) 2011-01-20
JP5100449B2 true JP5100449B2 (ja) 2012-12-19

Family

ID=41054087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008055464A Expired - Fee Related JP5100449B2 (ja) 2008-03-05 2008-03-05 複合コネクタおよびそれを備える電子機器

Country Status (3)

Country Link
US (1) US7722407B2 (enExample)
JP (1) JP5100449B2 (enExample)
CN (1) CN101527398B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI334546B (en) * 2009-03-13 2010-12-11 Via Tech Inc Integrated circuits
JP4887393B2 (ja) * 2009-03-24 2012-02-29 ホシデン株式会社 コネクタ
CN102802497B (zh) * 2009-06-25 2015-03-25 奥林巴斯医疗株式会社 摄像单元
TWI483195B (zh) 2010-03-16 2015-05-01 Toshiba Kk Semiconductor memory device
TWM398226U (en) * 2010-08-24 2011-02-11 Power Quotient Int Co Ltd USB connector
CN102237592B (zh) * 2010-04-30 2013-03-13 富士康(昆山)电脑接插件有限公司 电连接器
CN102290654B (zh) * 2010-06-21 2014-02-19 富士康(昆山)电脑接插件有限公司 电连接器
CN102290655B (zh) * 2010-06-21 2013-12-04 富士康(昆山)电脑接插件有限公司 电连接器
JP5574867B2 (ja) * 2010-07-28 2014-08-20 キヤノン株式会社 電子機器
JP2012227025A (ja) * 2011-04-20 2012-11-15 Hosiden Corp コネクタ
JP2012234736A (ja) 2011-05-06 2012-11-29 Nintendo Co Ltd 電子部品
US8690608B2 (en) * 2011-06-20 2014-04-08 Japan Aviation Electronics Industry Limited Special USB plug having different structure from standard USB plug and USB receptacle matable with the special USB plug
KR101315360B1 (ko) 2012-01-03 2013-10-07 엘에스엠트론 주식회사 컨택트 어레이의 구조가 개선된 인터페이스 커넥터
US8920197B2 (en) * 2012-03-14 2014-12-30 Apple Inc. Connector receptacle with ground contact having split rear extensions
CN103368010B (zh) * 2012-04-10 2016-03-09 凡甲电子(苏州)有限公司 电连接器
KR101381909B1 (ko) * 2012-05-15 2014-04-07 엘에스엠트론 주식회사 멀티형 리셉터클 커넥터 및 이에 적용되는 플러그 커넥터
US9011176B2 (en) 2012-06-09 2015-04-21 Apple Inc. ESD path for connector receptacle
US8740649B2 (en) * 2012-07-30 2014-06-03 Cheng Uei Precision Industry Co., Ltd. Electrical connector
JP5943823B2 (ja) 2012-12-06 2016-07-05 日本航空電子工業株式会社 コネクタ
JP2014116223A (ja) * 2012-12-11 2014-06-26 Smk Corp レセプタクルコネクタ
DE202013001452U1 (de) * 2013-02-14 2013-03-21 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Adapter
TWM476383U (en) * 2013-05-31 2014-04-11 Advanced Connectek Inc Connector
US9077128B2 (en) 2013-07-16 2015-07-07 Ls Mtron Ltd. Multi-type receptacle connector and plug connector applied thereto
KR101552916B1 (ko) 2013-09-23 2015-09-15 엘에스엠트론 주식회사 멀티형 리셉터클 커넥터 및 이에 적용되는 플러그 커넥터
CN104380535B (zh) * 2013-12-13 2017-06-06 华为终端有限公司 一种插头及印刷电路板组件
CN104538759A (zh) * 2014-12-19 2015-04-22 连展科技电子（昆山）有限公司 插座电连接器
JP6454656B2 (ja) * 2016-03-22 2019-01-16 東芝メモリ株式会社 Ｕｓｂ装置及びその製造方法
TWM561338U (zh) * 2018-01-15 2018-06-01 連展科技股份有限公司 電連接器
CN110137718A (zh) * 2018-02-02 2019-08-16 巧连科技股份有限公司 复合式连接器结构
JP7547036B2 (ja) * 2019-08-09 2024-09-09 キヤノン株式会社 プリント基板
CN111769396B (zh) * 2020-07-24 2021-10-26 东莞立讯技术有限公司 端子结构和电连接器
CN214957657U (zh) * 2021-04-23 2021-11-30 东莞富强电子有限公司 高速连接器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280209B1 (en) * 1999-07-16 2001-08-28 Molex Incorporated Connector with improved performance characteristics
JP3564555B2 (ja) * 2001-03-05 2004-09-15 日本航空電子工業株式会社 高速ディファレンシャル信号伝送用コネクタ
US6863549B2 (en) * 2002-09-25 2005-03-08 Molex Incorporated Impedance-tuned terminal contact arrangement and connectors incorporating same
TW570390U (en) * 2003-03-12 2004-01-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN2711938Y (zh) * 2004-05-14 2005-07-20 万国电脑股份有限公司 具侦测信号装置的usb连接器及其应用系统
JP2006032226A (ja) * 2004-07-20 2006-02-02 Sony Corp 接続コード
JP4360364B2 (ja) * 2005-08-26 2009-11-11 パナソニック電工株式会社 コネクタ
US7591683B2 (en) * 2007-06-07 2009-09-22 Hon Hai Precision Ind. Co., Ltd. Contact terminal, extender with improved ground contact, and method for making the extender
US7980898B2 (en) * 2007-11-09 2011-07-19 Hewlett-Packard Development Company, L.P. Augmented small form-factor connector

Also Published As

Publication number Publication date
US20090227147A1 (en) 2009-09-10
JP2009212009A (ja) 2009-09-17
CN101527398B (zh) 2011-04-20
US7722407B2 (en) 2010-05-25
CN101527398A (zh) 2009-09-09

Similar Documents

Publication Publication Date Title
JP5100449B2 (ja) 複合コネクタおよびそれを備える電子機器
US8553102B2 (en) Electronic apparatus including multiple differential signal lines
US12150266B2 (en) Electronic device comprising interposer
US8289720B2 (en) Electronic apparatus
US8638569B2 (en) Electrical apparatus
CN108924404A (zh) 一种摄像头模组及终端
JP5269157B2 (ja) 撮像装置
JP2007243550A (ja) 電子機器
CN108495015A (zh) 拍摄装置及电子设备
JP7346069B2 (ja) 電子機器
US12245374B2 (en) Electronic device comprising interposer
US20230246395A1 (en) Electronic device including shielding connector structure
KR102887584B1 (ko) 차폐 구조를 갖는 기판을 포함하는 전자 장치
CN112188048B (zh) 相机模组及移动终端
CN101459771A (zh) 数字拍摄设备
KR100619956B1 (ko) 회로기판 연결 장치를 갖는 휴대용 단말기
CN221784391U (zh) 电路板结构、工业相机及生产设备
JP2013025984A (ja) 配線ユニット
KR102823728B1 (ko) 인터포저를 포함하는 전자 장치
US7547853B2 (en) Control switch connection structure
JP5523595B2 (ja) 電子機器
KR20090009040A (ko) 카메라 모듈, 카메라 모듈용 하우징 및 카메라 모듈의 제조방법
CN119697474A (zh) 摄像头模组、主板和电子设备
JP2006047449A (ja) カメラ
JP2010074666A (ja) 撮像装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101129

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120410

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120611

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120828

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120925

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151005

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 5100449

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151005

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees