CN101527398B - 复合连接器及相应的电子设备 - Google Patents
复合连接器及相应的电子设备 Download PDFInfo
- Publication number
- CN101527398B CN101527398B CN200910118394XA CN200910118394A CN101527398B CN 101527398 B CN101527398 B CN 101527398B CN 200910118394X A CN200910118394X A CN 200910118394XA CN 200910118394 A CN200910118394 A CN 200910118394A CN 101527398 B CN101527398 B CN 101527398B
- Authority
- CN
- China
- Prior art keywords
- terminal
- signal terminal
- composite connector
- analog signal
- wiring plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- 238000001514 detection method Methods 0.000 claims description 19
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 230000014509 gene expression Effects 0.000 description 58
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000009434 installation Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
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- 238000012545 processing Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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- 230000005236 sound signal Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-055464 | 2008-03-05 | ||
| JP2008055464A JP5100449B2 (ja) | 2008-03-05 | 2008-03-05 | 複合コネクタおよびそれを備える電子機器 |
| JP2008055464 | 2008-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101527398A CN101527398A (zh) | 2009-09-09 |
| CN101527398B true CN101527398B (zh) | 2011-04-20 |
Family
ID=41054087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910118394XA Expired - Fee Related CN101527398B (zh) | 2008-03-05 | 2009-03-05 | 复合连接器及相应的电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7722407B2 (enExample) |
| JP (1) | JP5100449B2 (enExample) |
| CN (1) | CN101527398B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI334546B (en) * | 2009-03-13 | 2010-12-11 | Via Tech Inc | Integrated circuits |
| JP4887393B2 (ja) * | 2009-03-24 | 2012-02-29 | ホシデン株式会社 | コネクタ |
| CN102802497B (zh) * | 2009-06-25 | 2015-03-25 | 奥林巴斯医疗株式会社 | 摄像单元 |
| TWI483195B (zh) | 2010-03-16 | 2015-05-01 | Toshiba Kk | Semiconductor memory device |
| TWM398226U (en) * | 2010-08-24 | 2011-02-11 | Power Quotient Int Co Ltd | USB connector |
| CN102237592B (zh) * | 2010-04-30 | 2013-03-13 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| CN102290655B (zh) * | 2010-06-21 | 2013-12-04 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| CN102290654B (zh) * | 2010-06-21 | 2014-02-19 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| JP5574867B2 (ja) * | 2010-07-28 | 2014-08-20 | キヤノン株式会社 | 電子機器 |
| JP2012227025A (ja) * | 2011-04-20 | 2012-11-15 | Hosiden Corp | コネクタ |
| JP2012234736A (ja) | 2011-05-06 | 2012-11-29 | Nintendo Co Ltd | 電子部品 |
| US8690608B2 (en) * | 2011-06-20 | 2014-04-08 | Japan Aviation Electronics Industry Limited | Special USB plug having different structure from standard USB plug and USB receptacle matable with the special USB plug |
| KR101315360B1 (ko) | 2012-01-03 | 2013-10-07 | 엘에스엠트론 주식회사 | 컨택트 어레이의 구조가 개선된 인터페이스 커넥터 |
| US8920197B2 (en) * | 2012-03-14 | 2014-12-30 | Apple Inc. | Connector receptacle with ground contact having split rear extensions |
| CN103368010B (zh) * | 2012-04-10 | 2016-03-09 | 凡甲电子(苏州)有限公司 | 电连接器 |
| KR101381909B1 (ko) * | 2012-05-15 | 2014-04-07 | 엘에스엠트론 주식회사 | 멀티형 리셉터클 커넥터 및 이에 적용되는 플러그 커넥터 |
| US9011176B2 (en) | 2012-06-09 | 2015-04-21 | Apple Inc. | ESD path for connector receptacle |
| US8740649B2 (en) * | 2012-07-30 | 2014-06-03 | Cheng Uei Precision Industry Co., Ltd. | Electrical connector |
| JP5943823B2 (ja) * | 2012-12-06 | 2016-07-05 | 日本航空電子工業株式会社 | コネクタ |
| JP2014116223A (ja) * | 2012-12-11 | 2014-06-26 | Smk Corp | レセプタクルコネクタ |
| DE202013001452U1 (de) * | 2013-02-14 | 2013-03-21 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Adapter |
| TWM476383U (en) * | 2013-05-31 | 2014-04-11 | Advanced Connectek Inc | Connector |
| US9077128B2 (en) | 2013-07-16 | 2015-07-07 | Ls Mtron Ltd. | Multi-type receptacle connector and plug connector applied thereto |
| KR101552916B1 (ko) | 2013-09-23 | 2015-09-15 | 엘에스엠트론 주식회사 | 멀티형 리셉터클 커넥터 및 이에 적용되는 플러그 커넥터 |
| CN104380535B (zh) * | 2013-12-13 | 2017-06-06 | 华为终端有限公司 | 一种插头及印刷电路板组件 |
| CN104538759A (zh) * | 2014-12-19 | 2015-04-22 | 连展科技电子(昆山)有限公司 | 插座电连接器 |
| JP6454656B2 (ja) * | 2016-03-22 | 2019-01-16 | 東芝メモリ株式会社 | Usb装置及びその製造方法 |
| TWM561338U (zh) * | 2018-01-15 | 2018-06-01 | 連展科技股份有限公司 | 電連接器 |
| CN110137718A (zh) * | 2018-02-02 | 2019-08-16 | 巧连科技股份有限公司 | 复合式连接器结构 |
| JP7547036B2 (ja) * | 2019-08-09 | 2024-09-09 | キヤノン株式会社 | プリント基板 |
| CN111769396B (zh) | 2020-07-24 | 2021-10-26 | 东莞立讯技术有限公司 | 端子结构和电连接器 |
| CN214957657U (zh) * | 2021-04-23 | 2021-11-30 | 东莞富强电子有限公司 | 高速连接器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280209B1 (en) * | 1999-07-16 | 2001-08-28 | Molex Incorporated | Connector with improved performance characteristics |
| US6863549B2 (en) * | 2002-09-25 | 2005-03-08 | Molex Incorporated | Impedance-tuned terminal contact arrangement and connectors incorporating same |
| CN2711938Y (zh) * | 2004-05-14 | 2005-07-20 | 万国电脑股份有限公司 | 具侦测信号装置的usb连接器及其应用系统 |
| CN1921236A (zh) * | 2005-08-26 | 2007-02-28 | 松下电工株式会社 | 连接器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3564555B2 (ja) * | 2001-03-05 | 2004-09-15 | 日本航空電子工業株式会社 | 高速ディファレンシャル信号伝送用コネクタ |
| TW570390U (en) * | 2003-03-12 | 2004-01-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| JP2006032226A (ja) * | 2004-07-20 | 2006-02-02 | Sony Corp | 接続コード |
| US7591683B2 (en) * | 2007-06-07 | 2009-09-22 | Hon Hai Precision Ind. Co., Ltd. | Contact terminal, extender with improved ground contact, and method for making the extender |
| US7980898B2 (en) * | 2007-11-09 | 2011-07-19 | Hewlett-Packard Development Company, L.P. | Augmented small form-factor connector |
-
2008
- 2008-03-05 JP JP2008055464A patent/JP5100449B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-04 US US12/397,953 patent/US7722407B2/en not_active Expired - Fee Related
- 2009-03-05 CN CN200910118394XA patent/CN101527398B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280209B1 (en) * | 1999-07-16 | 2001-08-28 | Molex Incorporated | Connector with improved performance characteristics |
| US6863549B2 (en) * | 2002-09-25 | 2005-03-08 | Molex Incorporated | Impedance-tuned terminal contact arrangement and connectors incorporating same |
| CN2711938Y (zh) * | 2004-05-14 | 2005-07-20 | 万国电脑股份有限公司 | 具侦测信号装置的usb连接器及其应用系统 |
| CN1921236A (zh) * | 2005-08-26 | 2007-02-28 | 松下电工株式会社 | 连接器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5100449B2 (ja) | 2012-12-19 |
| JP2009212009A (ja) | 2009-09-17 |
| CN101527398A (zh) | 2009-09-09 |
| US7722407B2 (en) | 2010-05-25 |
| US20090227147A1 (en) | 2009-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |