JP5100097B2 - フッ素ゴム成形体並びにこれを使用したゴム材料及びoリング - Google Patents
フッ素ゴム成形体並びにこれを使用したゴム材料及びoリング Download PDFInfo
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- JP5100097B2 JP5100097B2 JP2006326688A JP2006326688A JP5100097B2 JP 5100097 B2 JP5100097 B2 JP 5100097B2 JP 2006326688 A JP2006326688 A JP 2006326688A JP 2006326688 A JP2006326688 A JP 2006326688A JP 5100097 B2 JP5100097 B2 JP 5100097B2
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- Prior art keywords
- bond
- rubber
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- fluororubber molded
- fluororubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001973 fluoroelastomer Polymers 0.000 title claims description 33
- 229920001971 elastomer Polymers 0.000 title claims description 18
- 239000000463 material Substances 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000001307 helium Substances 0.000 claims description 12
- 229910052734 helium Inorganic materials 0.000 claims description 12
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 11
- 125000001153 fluoro group Chemical group F* 0.000 claims description 7
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- -1 propylene, ethylene Chemical group 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010068 moulding (rubber) Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
- C08L15/02—Rubber derivatives containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
- Y10T428/215—Seal, gasket, or packing
Description
(1)表面がフッ素化処理されたフッ素ゴム成形体であって、表面の[酸素原子/フッ素原子]の原子個数比が0.11以下、かつ、[C−H結合/C−F2結合]の結合数比が1.0以下であり、ヘリウムリーク試験開始3分後のリーク量が1.0×10−12[Pa・m3/sec]以下であり、200℃環境下における金属との固着力が100N(ニュートン)以下であることを特徴とするフッ素ゴム成形体。
(2)半導体製造装置、液晶製造装置または真空機器のシール部、または半導体搬送機器に使用されるゴム材料であって、上記(1)記載のフッ素ゴム成形体からなることを特徴とするゴム材料。
(3)上記(1)記載のフッ素ゴム成形体からなることを特徴とするOリング。
ダイキン工業(株)製2元系共重合体G7801(架橋剤ビスフェノールAF配合)100部に、MTカーボンを20部、酸化マグネシウムを3部、水酸化カルシウムを6部、脂肪酸エステルを0.5部配合し、オープンロールで混練した後、170℃の温度で10分間熱処理して1次架橋し、次いで230℃で24時間熱処理をして2次架橋を行い、100mm×100mm×6tのシート状のフッ素ゴム成形体を得た。
上記フッ素ゴム成形体を、表面波プラズマ照射装置のチャンバー内にセットし、出力3000W、ガス種CF4、ガス流量300cc/min、基材温度30℃、処理時真空度6Paとして3分間照射を行い、サンプルを作製した。
真空度50Paとした以外は実施例1と同様にしてプラズマ照射を行い、サンプルを作製した。
真空度133Paとした以外は実施例1と同様にしてプラズマ照射を行い、サンプルを作製した。
真空度500Paとした以外は実施例1と同様にしてプラズマ照射を行い、サンプルを作製した。
真空度1000Paとした以外は実施例1と同様にしてプラズマ照射を行い、サンプルを作製した。
上記フッ素ゴム成形体をそのままサンプルとした(未処理)。
プラズマ照射に代えて、上記フッ素ゴム成形体の表面に架橋剤を含浸させ、加熱して架橋させ、サンプルを作製した
上記フッ素ゴム成形体の表面にシリコーン反応層を形成し、サンプルを作製した。
平行平板型RIE装置を用い、上記フッ素ゴム成形体に対し、150Wで2時間の過剰処理を行い、サンプルを作製した。
(株)島津製作所製X線光電子分光分析装置(XPS:XSAM800cpi)を用い、分析面積5mm×10mm幅、真空度10−6Pa、X線カソード電圧・電流それぞれ15kV、10mAの条件下で、サンプル表面を構成する原子や分子、その化学結合状態に関する分析を行い、[酸素原子/フッ素原子]の原子個数比及び[C-H結合/C-F2結合]の結合数比を求めた。
サンプルから厚さ6mm、直径10mmの試験片を切り出し、厚さ2mm、直径90mmの円盤状のステンレス鋼(SUS316L)の圧縮板で両側から厚さ方向に25%圧縮した。この状態で200℃のギアオーブンに22時間入れ、放置した。その後冷却し、上記金属製の圧縮板をオートグラフで垂直方向に10mm/秒の速度で引っ張り、その時の最大荷重を測定した。測定は3回繰り返し行った。
LEYBOLD社製ヘリウムリークディテクターUL5000(検出感度1.0×10−13[Pa・m3/sec])を用い、リーク量の経時変化を求めた。尚、試験条件は、下記の通りである。
・サンプル形状:AS568−214
・温度 :室温
・ゴム圧縮率 :25%
・測定時間 :1時間
・ヘリウム圧力:0.1MPa
Claims (3)
- 表面がフッ素化処理されたフッ素ゴム成形体であって、表面の[酸素原子/フッ素原子]の原子個数比が0.11以下、かつ、[C−H結合/C−F2結合]の結合数比が1.0以下であり、ヘリウムリーク試験開始3分後のリーク量が1.0×10−12[Pa・m3/sec]以下であり、200℃環境下における金属との固着力が100N(ニュートン)以下であることを特徴とするフッ素ゴム成形体。
- 半導体製造装置、液晶製造装置または真空機器のシール部、または半導体搬送機器に使用されるゴム材料であって、請求項1記載のフッ素ゴム成形体からなることを特徴とするゴム材料。
- 請求項1記載のフッ素ゴム成形体からなることを特徴とするOリング。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006326688A JP5100097B2 (ja) | 2006-12-04 | 2006-12-04 | フッ素ゴム成形体並びにこれを使用したゴム材料及びoリング |
US11/987,665 US20080131644A1 (en) | 2006-12-04 | 2007-12-03 | Fluororubber molded article, and rubber material and O-ring using the same |
KR1020070124319A KR20080051082A (ko) | 2006-12-04 | 2007-12-03 | 불소 고무 성형 제품, 및 이를 이용한 고무 재료 및 o-링 |
TW096146069A TW200833748A (en) | 2006-12-04 | 2007-12-04 | Fluororubber molded article, and rubber material and O-ring using the same |
CNA2007101959222A CN101200565A (zh) | 2006-12-04 | 2007-12-04 | 氟橡胶成型制品以及使用该氟橡胶成型制品的橡胶材料和o形圈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006326688A JP5100097B2 (ja) | 2006-12-04 | 2006-12-04 | フッ素ゴム成形体並びにこれを使用したゴム材料及びoリング |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008138107A JP2008138107A (ja) | 2008-06-19 |
JP5100097B2 true JP5100097B2 (ja) | 2012-12-19 |
Family
ID=39476145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006326688A Expired - Fee Related JP5100097B2 (ja) | 2006-12-04 | 2006-12-04 | フッ素ゴム成形体並びにこれを使用したゴム材料及びoリング |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080131644A1 (ja) |
JP (1) | JP5100097B2 (ja) |
KR (1) | KR20080051082A (ja) |
CN (1) | CN101200565A (ja) |
TW (1) | TW200833748A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201200345A (en) * | 2010-06-25 | 2012-01-01 | Carnehammer Lars Bertil | Surface treatment of rubber using low pressure plasma |
JP2015079601A (ja) * | 2013-10-15 | 2015-04-23 | オムロン株式会社 | スイッチ |
KR101790029B1 (ko) * | 2017-04-13 | 2017-10-25 | 경북대학교 산학협력단 | 불소고무를 이용한 건식접착제, 불소고무를 이용한 건식접착제 제조 방법 및 건식접착 구조물 사출 방법 |
WO2020040221A1 (ja) | 2018-08-24 | 2020-02-27 | 日本ゼオン株式会社 | シール材 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH069803A (ja) * | 1992-06-26 | 1994-01-18 | Tokyo Gas Co Ltd | 高分子材料の表面処理方法 |
US7125598B2 (en) * | 2000-04-19 | 2006-10-24 | Daikin Industries, Ltd. | Molded fluoroelastomer with excellent detachability and process for producing the same |
EP1464671A4 (en) * | 2001-12-17 | 2006-08-02 | Daikin Ind Ltd | ELASTOMER MOLDING |
JP2003286357A (ja) * | 2002-03-28 | 2003-10-10 | Nichias Corp | フッ素ゴム成形体及びフッ素ゴム成形体の非粘着化処理法 |
JP2005082654A (ja) * | 2003-09-05 | 2005-03-31 | Nichias Corp | フッ素ゴム成形体の非粘着化方法、フッ素ゴム成形体及びシール材 |
-
2006
- 2006-12-04 JP JP2006326688A patent/JP5100097B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-03 KR KR1020070124319A patent/KR20080051082A/ko not_active Application Discontinuation
- 2007-12-03 US US11/987,665 patent/US20080131644A1/en not_active Abandoned
- 2007-12-04 CN CNA2007101959222A patent/CN101200565A/zh active Pending
- 2007-12-04 TW TW096146069A patent/TW200833748A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20080051082A (ko) | 2008-06-10 |
US20080131644A1 (en) | 2008-06-05 |
CN101200565A (zh) | 2008-06-18 |
TW200833748A (en) | 2008-08-16 |
JP2008138107A (ja) | 2008-06-19 |
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