JP5098221B2 - 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ - Google Patents
発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ Download PDFInfo
- Publication number
- JP5098221B2 JP5098221B2 JP2006144321A JP2006144321A JP5098221B2 JP 5098221 B2 JP5098221 B2 JP 5098221B2 JP 2006144321 A JP2006144321 A JP 2006144321A JP 2006144321 A JP2006144321 A JP 2006144321A JP 5098221 B2 JP5098221 B2 JP 5098221B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting device
- phosphor
- light emitting
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
- Luminescent Compositions (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006144321A JP5098221B2 (ja) | 2005-05-24 | 2006-05-24 | 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005151175 | 2005-05-24 | ||
| JP2005151175 | 2005-05-24 | ||
| JP2006144321A JP5098221B2 (ja) | 2005-05-24 | 2006-05-24 | 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011204839A Division JP2012033945A (ja) | 2005-05-24 | 2011-09-20 | 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007005781A JP2007005781A (ja) | 2007-01-11 |
| JP2007005781A5 JP2007005781A5 (https=) | 2009-07-09 |
| JP5098221B2 true JP5098221B2 (ja) | 2012-12-12 |
Family
ID=37691034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006144321A Expired - Fee Related JP5098221B2 (ja) | 2005-05-24 | 2006-05-24 | 発光装置、照明装置、ディスプレイ用バックライトおよびディスプレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5098221B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200807104A (en) | 2006-04-19 | 2008-02-01 | Mitsubishi Chem Corp | Color image display device |
| DE102008006990A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Hintergrundbeleuchtungseinheit für eine Hintergrundbeleuchtung eines Bildschirms und Bildschirmeinheit des Bildschirms |
| US8491816B2 (en) | 2008-02-07 | 2013-07-23 | Mitsubishi Chemical Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
| US20130002963A1 (en) * | 2010-03-25 | 2013-01-03 | Masashi Yokota | Display device and television receiver |
| JP5413404B2 (ja) * | 2011-05-30 | 2014-02-12 | パナソニック株式会社 | Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法 |
| JP5413405B2 (ja) | 2011-05-30 | 2014-02-12 | パナソニック株式会社 | 樹脂塗布装置および樹脂塗布方法 |
| JP6287268B2 (ja) * | 2014-01-29 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置 |
| JP7242894B2 (ja) * | 2019-03-18 | 2023-03-20 | インテマティックス・コーポレーション | 光ルミネセンス層状構造体を備えるパッケージ化された白色発光デバイス |
| US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10133352A1 (de) * | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| JP4032682B2 (ja) * | 2001-08-28 | 2008-01-16 | 三菱化学株式会社 | 蛍光体 |
| JP3946541B2 (ja) * | 2002-02-25 | 2007-07-18 | 三菱電線工業株式会社 | 発光装置およびそれを用いた照明装置、ならびに該発光装置の製造方法と設計方法 |
| EP1503428B1 (en) * | 2002-04-25 | 2011-08-17 | Nichia Corporation | Light-emitting device using fluorescent substance |
| JP2004115633A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 珪酸塩蛍光体およびそれを用いた発光装置 |
| US6717353B1 (en) * | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
| WO2005031797A2 (de) * | 2003-09-24 | 2005-04-07 | Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh | Weiss emittierende led mit definierter farbtemperatur |
| US7094362B2 (en) * | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
-
2006
- 2006-05-24 JP JP2006144321A patent/JP5098221B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007005781A (ja) | 2007-01-11 |
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