JP5078605B2 - モリブデンを含有するビレットあるいはバーを製造する方法 - Google Patents
モリブデンを含有するビレットあるいはバーを製造する方法 Download PDFInfo
- Publication number
- JP5078605B2 JP5078605B2 JP2007501039A JP2007501039A JP5078605B2 JP 5078605 B2 JP5078605 B2 JP 5078605B2 JP 2007501039 A JP2007501039 A JP 2007501039A JP 2007501039 A JP2007501039 A JP 2007501039A JP 5078605 B2 JP5078605 B2 JP 5078605B2
- Authority
- JP
- Japan
- Prior art keywords
- molybdenum
- metal
- metal powder
- sintered
- isostatic pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title claims description 37
- 229910052750 molybdenum Inorganic materials 0.000 title claims description 37
- 239000011733 molybdenum Substances 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 98
- 239000002184 metal Substances 0.000 claims description 98
- 239000000843 powder Substances 0.000 claims description 70
- 238000001513 hot isostatic pressing Methods 0.000 claims description 43
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 28
- 239000001301 oxygen Substances 0.000 claims description 28
- 229910052760 oxygen Inorganic materials 0.000 claims description 28
- 238000009792 diffusion process Methods 0.000 claims description 25
- 238000004544 sputter deposition Methods 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 16
- 238000009694 cold isostatic pressing Methods 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 11
- 238000003754 machining Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 15
- 239000011449 brick Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 8
- 238000005477 sputtering target Methods 0.000 description 8
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001146 hypoxic effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
Description
Claims (6)
- モリブデンを含むスパッタリング対象物用のビレットあるいはバーを製造する方法であって、第1のプリフォームを、モリブデン含有金属粉を冷間等方加圧した後に焼結してモリブデン含有金属粉ボディを形成し、隣接する前記焼結されたモリブデン含有金属粉ボディ同士を、ガス圧力を使用する熱間等方加圧成形操作で金属−金属の結合部において拡散接合することによって形成すること、第2のプリフォームを、モリブデン含有金属粉を冷間等方加圧した後に焼結してモリブデン含有金属粉ボディを形成し、隣接する前記焼結されたモリブデン含有金属粉ボディ同士を、ガス圧力を使用する熱間等方加圧成形操作で金属−金属の結合部において拡散接合することによって形成すること、そして、その後、隣接する前記焼結された第1のプリフォームおよび前記焼結された第2のプリフォームを一緒に、ガス圧力を使用する続く熱間等方加圧成形操作でそれらの間における金属−金属粉層−金属の結合部において拡散接合することを含み、ここで、前記金属粉層はモリブデンを含有することを特徴とするモリブデンを含有するビレットあるいはバーを製造する方法。
- 前記金属粉層の酸素含有量は、重量比で約1000ppm未満であることを特徴とする請求項1に記載のモリブデンを含有するビレットあるいはバーを製造する方法。
- 前記焼結されたモリブデン含有金属粉ボディの酸素含有量は、重量比で約100ppm未満であることを特徴とする請求項1に記載のモリブデンを含有するビレットあるいはバーを製造する方法。
- 前記接合された第1のプリフォームおよび第2のプリフォームを、スパッタリング対象物を形成するために機械加工を行うことを含むことを特徴とする請求項1に記載のモリブデンを含有するビレットあるいはバーを製造する方法。
- 前記第1のプリフォームおよび前記第2のプリフォームを、前記金属粉層が間に配置されるそれぞれの機械加工された表面を提供するために、前記続く熱間等方加圧成形操作の前に機械加工することを含むことを特徴とする請求項1に記載のモリブデンを含有するビレットあるいはバーを製造する方法。
- モリブデンを含むスパッタリング対象物用のビレットあるいはバーを製造する方法であって、第1のプリフォームを、モリブデン含有金属粉を冷間等方加圧した後に焼結して酸素含有量が重量比で約100ppm未満であるモリブデン含有金属粉ボディを形成し、隣接する前記焼結されたモリブデン含有金属粉ボディ同士を、ガス圧力を使用する熱間等方加圧成形操作で金属−金属の結合部において拡散接合することによって形成すること、第2のプリフォームを、モリブデン含有金属粉を冷間等方加圧した後に焼結してモリブデン含有金属粉ボディを形成し、酸素含有量が重量比で約100ppm未満である隣接する前記焼結されたモリブデン含有金属粉ボディ同士を、ガス圧力を使用する熱間等方加圧成形操作で金属−金属の結合部において拡散接合することによって形成すること、そして、その後、隣接する前記焼結された第1のプリフォームおよび前記焼結された第2のプリフォームを一緒に、ガス圧力を使用する続く熱間等方加圧成形操作でそれらの間における金属−金属粉層−金属の結合部において拡散接合することを含み、ここで、前記金属粉層が、重量比で約100ppm未満の拡散接合部での酸素含有量を提供するために前記続く熱間等方加圧成形操作の期間中に拡散接合部から前記焼結された第1のプリフォームおよび前記焼結された第2のプリフォームの中に拡散する重量比で約1000ppm未満の酸素含有量を有するモリブデンを含有することを特徴とするモリブデンを含有するビレットあるいはバーを製造する方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54879004P | 2004-02-27 | 2004-02-27 | |
US60/548,790 | 2004-02-27 | ||
US60352804P | 2004-08-20 | 2004-08-20 | |
US60/603,528 | 2004-08-20 | ||
US11/062,777 | 2005-02-22 | ||
US11/062,777 US7832619B2 (en) | 2004-02-27 | 2005-02-22 | Method of making sputtering target |
PCT/US2005/006229 WO2005084242A2 (en) | 2004-02-27 | 2005-02-25 | Method of making sputtering target |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007525599A JP2007525599A (ja) | 2007-09-06 |
JP5078605B2 true JP5078605B2 (ja) | 2012-11-21 |
Family
ID=34891003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501039A Expired - Fee Related JP5078605B2 (ja) | 2004-02-27 | 2005-02-25 | モリブデンを含有するビレットあるいはバーを製造する方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7832619B2 (ja) |
EP (2) | EP1727643B1 (ja) |
JP (1) | JP5078605B2 (ja) |
CN (1) | CN1946507B (ja) |
HK (1) | HK1100842A1 (ja) |
WO (1) | WO2005084242A2 (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US20060201589A1 (en) * | 2005-03-11 | 2006-09-14 | Honeywell International Inc. | Components comprising metallic material, physical vapor deposition targets, thin films, and methods of forming metallic components |
US8130769B2 (en) | 2005-10-14 | 2012-03-06 | Whaleback Systems Corporation | Configuring a network device |
AT8697U1 (de) * | 2005-10-14 | 2006-11-15 | Plansee Se | Rohrtarget |
US8156564B2 (en) * | 2005-10-14 | 2012-04-10 | Whaleback Systems Corporation | Discovering network services |
US7837929B2 (en) * | 2005-10-20 | 2010-11-23 | H.C. Starck Inc. | Methods of making molybdenum titanium sputtering plates and targets |
US20070116592A1 (en) * | 2005-11-22 | 2007-05-24 | Paul Tylus | Fabrication of Ruthenium and Ruthenium Alloy Sputtering Targets with Low Oxygen Content |
WO2007140164A2 (en) | 2006-05-26 | 2007-12-06 | Whaleback Systems Corporation | Call quality monitoring |
US20070286361A1 (en) * | 2006-05-26 | 2007-12-13 | Whaleback Systems Corporation | Sending A Page |
US10097612B2 (en) * | 2006-05-26 | 2018-10-09 | Fuze, Inc. | Selecting routes through a network |
US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
FR2936178B1 (fr) * | 2008-09-24 | 2012-08-17 | Snecma | Assemblage de pieces en titane et en acier par soudage diffusion |
US8449818B2 (en) * | 2010-06-30 | 2013-05-28 | H. C. Starck, Inc. | Molybdenum containing targets |
US8449817B2 (en) | 2010-06-30 | 2013-05-28 | H.C. Stark, Inc. | Molybdenum-containing targets comprising three metal elements |
US8727203B2 (en) | 2010-09-16 | 2014-05-20 | Howmedica Osteonics Corp. | Methods for manufacturing porous orthopaedic implants |
KR20140001246A (ko) | 2011-05-10 | 2014-01-06 | 에이치. 씨. 스타아크 아이앤씨 | 멀티-블록 스퍼터링 타겟 및 이에 관한 제조방법 및 물품 |
KR20140007495A (ko) | 2011-06-08 | 2014-01-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 스퍼터링 타겟, 스퍼터링 타겟의 제조 방법 및 박막의 형성 방법 |
US9412568B2 (en) | 2011-09-29 | 2016-08-09 | H.C. Starck, Inc. | Large-area sputtering targets |
JP5958822B2 (ja) * | 2011-12-22 | 2016-08-02 | 日立金属株式会社 | Mo合金スパッタリングターゲット材の製造方法およびMo合金スパッタリングターゲット材 |
US9334565B2 (en) | 2012-05-09 | 2016-05-10 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
US9885108B2 (en) | 2012-08-07 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming sputtering target |
JP6284004B2 (ja) * | 2013-02-15 | 2018-02-28 | 日立金属株式会社 | Mo合金スパッタリングターゲット材の製造方法およびMo合金スパッタリングターゲット材 |
CN104708192A (zh) * | 2013-12-12 | 2015-06-17 | 有研亿金新材料有限公司 | 一种W-Ti合金靶材组件扩散焊接方法 |
WO2016164269A1 (en) | 2015-04-10 | 2016-10-13 | Tosoh Smd, Inc. | Method of making a tantalum sputter target and sputter targets made thereby |
CN105170975A (zh) * | 2015-09-29 | 2015-12-23 | 浙江恒成硬质合金有限公司 | 一种长尺寸粉末冶金压坯对接方法 |
CN105234547A (zh) * | 2015-10-20 | 2016-01-13 | 兰微悦美(天津)科技有限公司 | 互不固溶金属的连接工艺 |
CN108941584B (zh) * | 2018-09-07 | 2019-09-03 | 韶关市欧莱高新材料有限公司 | 一种长钼管溅射靶材的制备方法 |
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JP4027733B2 (ja) * | 2002-07-01 | 2007-12-26 | 新日鉄マテリアルズ株式会社 | ターゲット材 |
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AU2003291159A1 (en) * | 2002-12-09 | 2004-06-30 | Honeywell International Inc. | High purity nickel/vanadium sputtering components; and methods of making sputtering components |
-
2005
- 2005-02-22 US US11/062,777 patent/US7832619B2/en active Active
- 2005-02-25 EP EP05714100.4A patent/EP1727643B1/en not_active Not-in-force
- 2005-02-25 WO PCT/US2005/006229 patent/WO2005084242A2/en active Application Filing
- 2005-02-25 JP JP2007501039A patent/JP5078605B2/ja not_active Expired - Fee Related
- 2005-02-25 EP EP11173006.5A patent/EP2374568B1/en not_active Not-in-force
- 2005-02-25 CN CN200580006205XA patent/CN1946507B/zh not_active Expired - Fee Related
-
2007
- 2007-06-06 HK HK07105976.0A patent/HK1100842A1/xx not_active IP Right Cessation
-
2010
- 2010-09-29 US US12/924,528 patent/US20110017591A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1727643B1 (en) | 2015-08-12 |
JP2007525599A (ja) | 2007-09-06 |
CN1946507A (zh) | 2007-04-11 |
CN1946507B (zh) | 2010-11-17 |
WO2005084242A3 (en) | 2006-10-26 |
EP2374568A1 (en) | 2011-10-12 |
EP2374568B1 (en) | 2016-05-18 |
WO2005084242A2 (en) | 2005-09-15 |
HK1100842A1 (en) | 2007-09-28 |
US7832619B2 (en) | 2010-11-16 |
US20050189401A1 (en) | 2005-09-01 |
EP1727643A4 (en) | 2009-04-01 |
EP1727643A2 (en) | 2006-12-06 |
US20110017591A1 (en) | 2011-01-27 |
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