JP5077894B2 - 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット - Google Patents

光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット Download PDF

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Publication number
JP5077894B2
JP5077894B2 JP2009033148A JP2009033148A JP5077894B2 JP 5077894 B2 JP5077894 B2 JP 5077894B2 JP 2009033148 A JP2009033148 A JP 2009033148A JP 2009033148 A JP2009033148 A JP 2009033148A JP 5077894 B2 JP5077894 B2 JP 5077894B2
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epoxy
group
optical semiconductor
semiconductor element
groups
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JP2009033148A
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Japanese (ja)
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JP2009256604A (ja
Inventor
努 柏木
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2009033148A priority Critical patent/JP5077894B2/ja
Priority to KR1020090026271A priority patent/KR101500757B1/ko
Priority to TW098110129A priority patent/TWI441847B/zh
Priority to CN2009101298892A priority patent/CN101565549B/zh
Publication of JP2009256604A publication Critical patent/JP2009256604A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2009033148A 2008-03-28 2009-02-16 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット Active JP5077894B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009033148A JP5077894B2 (ja) 2008-03-28 2009-02-16 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット
KR1020090026271A KR101500757B1 (ko) 2008-03-28 2009-03-27 광 반도체 소자 밀봉용 에폭시ㆍ실리콘 혼성 수지 조성물 및 그것을 포함하는 트랜스퍼 성형용 타블렛
TW098110129A TWI441847B (zh) 2008-03-28 2009-03-27 Epoxy-Polyimide Oxygen Mixed Resin Composition for Photonic Semiconductor Component Sealing and Tablets for Transparent Forming
CN2009101298892A CN101565549B (zh) 2008-03-28 2009-03-30 混合有环氧树脂和硅树脂的树脂组合物以及预成型材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008085835 2008-03-28
JP2008085835 2008-03-28
JP2009033148A JP5077894B2 (ja) 2008-03-28 2009-02-16 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット

Publications (2)

Publication Number Publication Date
JP2009256604A JP2009256604A (ja) 2009-11-05
JP5077894B2 true JP5077894B2 (ja) 2012-11-21

Family

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Family Applications (1)

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JP2009033148A Active JP5077894B2 (ja) 2008-03-28 2009-02-16 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット

Country Status (4)

Country Link
JP (1) JP5077894B2 (zh)
KR (1) KR101500757B1 (zh)
CN (1) CN101565549B (zh)
TW (1) TWI441847B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5251919B2 (ja) * 2009-05-08 2013-07-31 信越化学工業株式会社 光半導体素子封止用樹脂組成物
JP5606752B2 (ja) * 2010-02-25 2014-10-15 株式会社ダイセル 光半導体封止用樹脂組成物とこれを使用した光半導体装置
KR101923244B1 (ko) * 2011-07-13 2018-11-28 주식회사 다이셀 경화성 에폭시 수지 조성물
WO2013011832A1 (ja) * 2011-07-20 2013-01-24 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP5899025B2 (ja) * 2012-03-30 2016-04-06 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP6047294B2 (ja) * 2012-03-30 2016-12-21 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP6118313B2 (ja) * 2012-04-03 2017-04-19 株式会社ダイセル 硬化性エポキシ樹脂組成物
TWI570160B (zh) * 2012-09-04 2017-02-11 新日鐵住金化學股份有限公司 Epoxy silicone resin and a hardened resin composition using the same
KR102055796B1 (ko) 2013-12-26 2019-12-13 주식회사 다이셀 렌즈용 경화성 조성물, 및 렌즈 및 광학 장치
JP6691475B2 (ja) * 2016-12-28 2020-04-28 信越化学工業株式会社 シリコーン樹脂組成物及び光半導体装置
WO2020133494A1 (zh) * 2018-12-29 2020-07-02 广东生益科技股份有限公司 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板
DE102019209346A1 (de) * 2019-06-27 2020-12-31 Siemens Aktiengesellschaft Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
CN113980514B (zh) * 2021-10-25 2023-05-12 杭州福斯特电子材料有限公司 一种光固化封装组合物、有机封装薄膜及其应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4528613B2 (ja) * 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法
JP2006282988A (ja) * 2005-03-08 2006-10-19 Sanyo Chem Ind Ltd 光半導体素子封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
TWI441847B (zh) 2014-06-21
KR101500757B1 (ko) 2015-03-09
TW200948846A (en) 2009-12-01
CN101565549A (zh) 2009-10-28
CN101565549B (zh) 2013-01-02
KR20090103812A (ko) 2009-10-01
JP2009256604A (ja) 2009-11-05

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