JP5077018B2 - 熱処理装置 - Google Patents

熱処理装置 Download PDF

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Publication number
JP5077018B2
JP5077018B2 JP2008089069A JP2008089069A JP5077018B2 JP 5077018 B2 JP5077018 B2 JP 5077018B2 JP 2008089069 A JP2008089069 A JP 2008089069A JP 2008089069 A JP2008089069 A JP 2008089069A JP 5077018 B2 JP5077018 B2 JP 5077018B2
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Japan
Prior art keywords
heat treatment
treatment apparatus
irradiation window
heating
processed
Prior art date
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Active
Application number
JP2008089069A
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English (en)
Japanese (ja)
Other versions
JP2009246061A5 (zh
JP2009246061A (ja
Inventor
真太郎 青山
晃司 下村
仙尚 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008089069A priority Critical patent/JP5077018B2/ja
Priority to PCT/JP2009/055325 priority patent/WO2009122913A1/ja
Priority to KR1020107021779A priority patent/KR20100138984A/ko
Priority to CN200980100966XA priority patent/CN101855708B/zh
Priority to TW98110446A priority patent/TW200949950A/zh
Publication of JP2009246061A publication Critical patent/JP2009246061A/ja
Publication of JP2009246061A5 publication Critical patent/JP2009246061A5/ja
Application granted granted Critical
Publication of JP5077018B2 publication Critical patent/JP5077018B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
JP2008089069A 2008-03-31 2008-03-31 熱処理装置 Active JP5077018B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008089069A JP5077018B2 (ja) 2008-03-31 2008-03-31 熱処理装置
PCT/JP2009/055325 WO2009122913A1 (ja) 2008-03-31 2009-03-18 熱処理装置
KR1020107021779A KR20100138984A (ko) 2008-03-31 2009-03-18 열처리 장치
CN200980100966XA CN101855708B (zh) 2008-03-31 2009-03-18 热处理装置
TW98110446A TW200949950A (en) 2008-03-31 2009-03-30 Heat treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008089069A JP5077018B2 (ja) 2008-03-31 2008-03-31 熱処理装置

Publications (3)

Publication Number Publication Date
JP2009246061A JP2009246061A (ja) 2009-10-22
JP2009246061A5 JP2009246061A5 (zh) 2011-03-03
JP5077018B2 true JP5077018B2 (ja) 2012-11-21

Family

ID=41135299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008089069A Active JP5077018B2 (ja) 2008-03-31 2008-03-31 熱処理装置

Country Status (5)

Country Link
JP (1) JP5077018B2 (zh)
KR (1) KR20100138984A (zh)
CN (1) CN101855708B (zh)
TW (1) TW200949950A (zh)
WO (1) WO2009122913A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11764087B2 (en) 2019-12-13 2023-09-19 Samsung Electronics Co., Ltd. Process apparatus including a non-contact thermo-sensor

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5466670B2 (ja) * 2010-10-28 2014-04-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP5640890B2 (ja) * 2011-05-23 2014-12-17 ウシオ電機株式会社 光照射装置および光照射方法
JP6038503B2 (ja) * 2011-07-01 2016-12-07 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
KR101297981B1 (ko) * 2011-10-07 2013-08-23 (주) 예스티 기판의 열처리 장치
JP5964630B2 (ja) * 2012-03-27 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US8785815B2 (en) * 2012-06-22 2014-07-22 Applied Materials, Inc. Aperture control of thermal processing radiation
CN105261576A (zh) * 2014-07-15 2016-01-20 北京北方微电子基地设备工艺研究中心有限责任公司 一种加热腔室及半导体加工设备
US11089657B2 (en) * 2015-03-06 2021-08-10 SCREEN Holdings Co., Ltd. Light-irradiation heat treatment apparatus
JP6518548B2 (ja) * 2015-08-10 2019-05-22 東京応化工業株式会社 紫外線照射装置、レジストパターン形成装置、紫外線照射方法及びレジストパターン形成方法
JP6546512B2 (ja) * 2015-11-04 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN107706139A (zh) * 2017-11-13 2018-02-16 上海华力微电子有限公司 一种半导体加工机台的温度控制装置
JP7048372B2 (ja) * 2018-03-20 2022-04-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP7546417B2 (ja) 2020-09-09 2024-09-06 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN115064471B (zh) * 2022-08-01 2023-11-28 北京屹唐半导体科技股份有限公司 晶圆的热处理装置
FR3142757A1 (fr) * 2022-12-05 2024-06-07 Annealsys Four de recuit thermique rapide à uniformité de chauffage améliorée
CN118712105A (zh) * 2024-08-29 2024-09-27 一塔半导体(安徽)有限公司 一种快速热退火装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270390A (ja) * 1996-03-29 1997-10-14 Dainippon Screen Mfg Co Ltd 基板の光照射式熱処理装置
JPH10321547A (ja) * 1997-05-22 1998-12-04 Kokusai Electric Co Ltd 熱処理装置
JP4200844B2 (ja) * 2003-08-11 2008-12-24 東京エレクトロン株式会社 熱処理装置
JP2006005177A (ja) * 2004-06-17 2006-01-05 Tokyo Electron Ltd 熱処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11764087B2 (en) 2019-12-13 2023-09-19 Samsung Electronics Co., Ltd. Process apparatus including a non-contact thermo-sensor

Also Published As

Publication number Publication date
KR20100138984A (ko) 2010-12-31
CN101855708B (zh) 2012-10-10
CN101855708A (zh) 2010-10-06
WO2009122913A1 (ja) 2009-10-08
TW200949950A (en) 2009-12-01
JP2009246061A (ja) 2009-10-22

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