JP5069662B2 - 粘着シート - Google Patents

粘着シート Download PDF

Info

Publication number
JP5069662B2
JP5069662B2 JP2008273282A JP2008273282A JP5069662B2 JP 5069662 B2 JP5069662 B2 JP 5069662B2 JP 2008273282 A JP2008273282 A JP 2008273282A JP 2008273282 A JP2008273282 A JP 2008273282A JP 5069662 B2 JP5069662 B2 JP 5069662B2
Authority
JP
Japan
Prior art keywords
energy ray
sensitive adhesive
pressure
curable
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008273282A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009138183A5 (enExample
JP2009138183A (ja
Inventor
圭子 田中
淳 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2008273282A priority Critical patent/JP5069662B2/ja
Priority to US12/268,813 priority patent/US20090123746A1/en
Priority to KR1020080111886A priority patent/KR101454183B1/ko
Publication of JP2009138183A publication Critical patent/JP2009138183A/ja
Publication of JP2009138183A5 publication Critical patent/JP2009138183A5/ja
Application granted granted Critical
Publication of JP5069662B2 publication Critical patent/JP5069662B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008273282A 2007-11-12 2008-10-23 粘着シート Active JP5069662B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008273282A JP5069662B2 (ja) 2007-11-12 2008-10-23 粘着シート
US12/268,813 US20090123746A1 (en) 2007-11-12 2008-11-11 Adhesive sheet
KR1020080111886A KR101454183B1 (ko) 2007-11-12 2008-11-11 점착 시트

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007293329 2007-11-12
JP2007293329 2007-11-12
JP2008273282A JP5069662B2 (ja) 2007-11-12 2008-10-23 粘着シート

Publications (3)

Publication Number Publication Date
JP2009138183A JP2009138183A (ja) 2009-06-25
JP2009138183A5 JP2009138183A5 (enExample) 2012-04-05
JP5069662B2 true JP5069662B2 (ja) 2012-11-07

Family

ID=40869106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008273282A Active JP5069662B2 (ja) 2007-11-12 2008-10-23 粘着シート

Country Status (1)

Country Link
JP (1) JP5069662B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10825711B2 (en) 2015-10-05 2020-11-03 Lintec Corporation Sheet for semiconductor processing

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5764518B2 (ja) * 2011-03-31 2015-08-19 古河電気工業株式会社 ダイシングテープ及び半導体ウエハ加工方法
JP5651526B2 (ja) * 2011-04-28 2015-01-14 藤森工業株式会社 ハードコートフィルム及びそれを用いたタッチパネル
KR102032590B1 (ko) 2012-05-14 2019-10-15 린텍 가부시키가이샤 접착성 수지층이 부착된 시트 및 반도체 장치의 제조 방법
JP6209876B2 (ja) * 2012-06-29 2017-10-11 日立化成株式会社 仮固定用フィルム、仮固定用フィルムシート及び半導体装置の製造方法
WO2014174936A1 (ja) * 2013-04-22 2014-10-30 Dic株式会社 紫外線硬化型粘着剤組成物及び粘着剤
JP6497914B2 (ja) * 2013-12-10 2019-04-10 日本合成化学工業株式会社 粘着剤組成物、粘着剤、粘着シート、表面保護用粘着剤、表面保護用粘着シート
CN105722937A (zh) * 2013-12-25 2016-06-29 Dic株式会社 紫外线固化型粘合剂组合物、粘合膜及粘合膜的制造方法
JP2017031353A (ja) * 2015-08-04 2017-02-09 住友ベークライト株式会社 仮固定用テープ
SG11201807714QA (en) * 2016-03-10 2018-10-30 Lintec Corp Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device
JP6034522B1 (ja) * 2016-03-17 2016-11-30 古河電気工業株式会社 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
JP6461892B2 (ja) * 2016-12-06 2019-01-30 リンテック株式会社 表面保護シート
JP7541021B2 (ja) * 2019-10-04 2024-08-27 リンテック株式会社 エキスパンドシート
KR102713003B1 (ko) * 2020-04-23 2024-10-07 미쓰이 가가쿠 토세로 가부시키가이샤 백그라인드용 점착성 필름 및 전자 장치의 제조 방법
TWI896678B (zh) * 2020-06-10 2025-09-11 日商三井化學艾喜緹瑪蒂莉亞股份有限公司 電子裝置的製造方法
KR20230007493A (ko) * 2020-06-10 2023-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법
JP7764780B2 (ja) * 2022-02-16 2025-11-06 住友ベークライト株式会社 粘着テープ
WO2025154659A1 (ja) * 2024-01-15 2025-07-24 日東電工株式会社 表面保護フィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345131A (ja) * 1999-06-03 2000-12-12 Nippon Synthetic Chem Ind Co Ltd:The 再剥離型粘着剤組成物
JP2006124549A (ja) * 2004-10-29 2006-05-18 Jsr Corp 光硬化性樹脂組成物及び光ディスク用接着剤
JP5049612B2 (ja) * 2007-02-28 2012-10-17 リンテック株式会社 粘着シート
JP5049620B2 (ja) * 2007-03-20 2012-10-17 リンテック株式会社 粘着シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10825711B2 (en) 2015-10-05 2020-11-03 Lintec Corporation Sheet for semiconductor processing

Also Published As

Publication number Publication date
JP2009138183A (ja) 2009-06-25

Similar Documents

Publication Publication Date Title
JP5069662B2 (ja) 粘着シート
JP5049620B2 (ja) 粘着シート
JP5049612B2 (ja) 粘着シート
JP4991348B2 (ja) 粘着シート
KR101278454B1 (ko) 점착 시트
JP5302951B2 (ja) 粘着シート
JP5513866B2 (ja) 電子部品加工用粘着シート
KR101454183B1 (ko) 점착 시트
US20070071969A1 (en) Pressure-sensitive adhesive sheet, production method thereof and method of processing articles
JP6623210B2 (ja) ダイシングシートおよび半導体チップの製造方法
KR20190053135A (ko) 반도체 가공용 점착 시트
JP6195839B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
WO2012128312A1 (ja) 基材フィルムおよび該基材フィルムを備えた粘着シート
JP4991350B2 (ja) 粘着シート
KR20180118594A (ko) 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법
KR20140138738A (ko) 필름, 워크 가공용 시트 기재 및 워크 가공용 시트
JP6129541B2 (ja) ダイシングシート
JP6328397B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
JP6009189B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
JP5033440B2 (ja) 粘着シート
JP6006953B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110527

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120221

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20120221

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20120314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120424

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120605

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120808

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120817

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5069662

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250