JP5058126B2 - 電子部品装着装置 - Google Patents
電子部品装着装置 Download PDFInfo
- Publication number
- JP5058126B2 JP5058126B2 JP2008280445A JP2008280445A JP5058126B2 JP 5058126 B2 JP5058126 B2 JP 5058126B2 JP 2008280445 A JP2008280445 A JP 2008280445A JP 2008280445 A JP2008280445 A JP 2008280445A JP 5058126 B2 JP5058126 B2 JP 5058126B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- suction nozzle
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007689 inspection Methods 0.000 claims description 25
- 230000032258 transport Effects 0.000 claims description 16
- 238000011084 recovery Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001444 catalytic combustion detection Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
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- Supply And Installment Of Electrical Components (AREA)
Description
2 搬送装置
3A、3B フィーダベース
4A、4B ビーム
7 装着ヘッド
9 吸着ノズル
13 リード浮き検査装置
15 回収装置
Claims (2)
- プリント基板を搬送する搬送装置と、電子部品を供給するもので前記搬送装置の両外方においてフィーダベース上に設けられる部品供給装置と、駆動源により一方向に移動可能な一対のビームと、それぞれ吸着ノズルを備えて前記各ビームの内側に設けられると共に前記各ビームに沿った方向に各駆動源により移動可能な装着ヘッドと、前記吸着ノズルに吸着保持された電子部品の状態を検査する検査装置とを備えた電子部品装着装置において、前記各駆動源を駆動して前記各ビームに設けられた装着ヘッドの吸着ノズルによりいずれの前記部品供給装置からも電子部品を取出せるように構成すると共に、前記検査装置の検査によりそのままの状態では前記プリント基板上に装着できないとされた電子部品を回収する回収装置を前記搬送装置の両外方のいずれの前記フィーダベース上であっても着脱自在となるように設け、前記各装着ヘッドに設けられた吸着ノズルによりいずれかの前記部品供給装置から電子部品を前記各装着ヘッドが前記ビームに沿った方向に近づくと衝突する位置にて併行して取出す場合には前記ビームに沿った方向に衝突しないように制御するよう構成し、且つ、前記各ビームに設けられた装着ヘッドが前記搬送装置の両外方のいずれの前記フィーダベース上の前記回収装置にも移動可能なように構成したことを特徴とする電子部品装着装置。
- 前記回収装置は前記搬送装置側である奥側に置かれた電子部品を前記搬送装置の反対側の手前側に前記フィーダベースの外側まで搬送するものであることを特徴とする請求項1に記載の電子部品装着装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008280445A JP5058126B2 (ja) | 2008-10-30 | 2008-10-30 | 電子部品装着装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008280445A JP5058126B2 (ja) | 2008-10-30 | 2008-10-30 | 電子部品装着装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012083232A Division JP5658707B2 (ja) | 2012-03-30 | 2012-03-30 | 電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010109194A JP2010109194A (ja) | 2010-05-13 |
JP5058126B2 true JP5058126B2 (ja) | 2012-10-24 |
Family
ID=42298328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008280445A Active JP5058126B2 (ja) | 2008-10-30 | 2008-10-30 | 電子部品装着装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5058126B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5679422B2 (ja) * | 2010-10-13 | 2015-03-04 | 富士機械製造株式会社 | 電子部品実装方法および電子部品実装機 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002246798A (ja) * | 2001-02-19 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 実装機 |
JP4616524B2 (ja) * | 2001-07-27 | 2011-01-19 | 富士機械製造株式会社 | 電気部品装着システム |
JP2003069287A (ja) * | 2001-08-23 | 2003-03-07 | Sanyo Electric Co Ltd | 電子部品装着装置 |
JP2008210981A (ja) * | 2007-02-26 | 2008-09-11 | Matsushita Electric Ind Co Ltd | 部品実装機 |
JP2008227402A (ja) * | 2007-03-15 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 部品実装方法 |
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2008
- 2008-10-30 JP JP2008280445A patent/JP5058126B2/ja active Active
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Publication number | Publication date |
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JP2010109194A (ja) | 2010-05-13 |
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