JP5054020B2 - シールされた補充容器を用いた堆積システム - Google Patents

シールされた補充容器を用いた堆積システム Download PDF

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Publication number
JP5054020B2
JP5054020B2 JP2008540057A JP2008540057A JP5054020B2 JP 5054020 B2 JP5054020 B2 JP 5054020B2 JP 2008540057 A JP2008540057 A JP 2008540057A JP 2008540057 A JP2008540057 A JP 2008540057A JP 5054020 B2 JP5054020 B2 JP 5054020B2
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Prior art keywords
particulate material
organic
supply
screw
organic particulate
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JP2008540057A
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English (en)
Japanese (ja)
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JP2009516072A5 (enExample
JP2009516072A (ja
Inventor
ルイス ボロソン，マイケル
ブラント，イー．スティーブン
Original Assignee
グローバル オーエルイーディー テクノロジー リミティド ライアビリティ カンパニー
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Publication of JP2009516072A5 publication Critical patent/JP2009516072A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2008540057A 2005-11-10 2006-11-01 シールされた補充容器を用いた堆積システム Active JP5054020B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/273,268 US7638168B2 (en) 2005-11-10 2005-11-10 Deposition system using sealed replenishment container
US11/273,268 2005-11-10
PCT/US2006/042605 WO2007058775A2 (en) 2005-11-10 2006-11-01 Deposition system using sealed replenishment container

Publications (3)

Publication Number Publication Date
JP2009516072A JP2009516072A (ja) 2009-04-16
JP2009516072A5 JP2009516072A5 (enExample) 2010-02-18
JP5054020B2 true JP5054020B2 (ja) 2012-10-24

Family

ID=37964945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008540057A Active JP5054020B2 (ja) 2005-11-10 2006-11-01 シールされた補充容器を用いた堆積システム

Country Status (5)

Country Link
US (1) US7638168B2 (enExample)
EP (1) EP1971702B1 (enExample)
JP (1) JP5054020B2 (enExample)
TW (1) TWI377715B (enExample)
WO (1) WO2007058775A2 (enExample)

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JP5011013B2 (ja) * 2007-07-24 2012-08-29 大陽日酸株式会社 二フッ化キセノンガス供給装置
US7883583B2 (en) * 2008-01-08 2011-02-08 Global Oled Technology Llc Vaporization apparatus with precise powder metering
US8048230B2 (en) * 2008-11-14 2011-11-01 Global Oled Technology Llc Metering and vaporizing particulate material
US8062427B2 (en) * 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
GB2472817A (en) 2009-08-19 2011-02-23 Queen Mary & Westfield College Powder dispenser with permanently-open linear-taper nozzle operated by vibration
JP2013503256A (ja) * 2009-08-26 2013-01-31 株式会社テラセミコン 蒸着ガス供給装置
JP4974036B2 (ja) 2009-11-19 2012-07-11 株式会社ジャパンディスプレイセントラル 有機ｅｌ装置の製造方法
JP2012046814A (ja) * 2010-08-30 2012-03-08 Kaneka Corp 蒸着装置
KR101402526B1 (ko) 2011-12-26 2014-06-09 삼성디스플레이 주식회사 수명이 향상된 유기발광소자 및 그 제조방법
AU2013208044A1 (en) * 2012-01-10 2014-03-20 Hzo, Inc. Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods
US9578718B2 (en) * 2012-05-04 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting element and deposition apparatus
GB201300828D0 (en) 2013-01-17 2013-03-06 Varydose Ltd Apparatus and method for dispensing powders
FR3020381B1 (fr) * 2014-04-24 2017-09-29 Riber Cellule d'evaporation
CN104498889B (zh) * 2014-12-18 2017-02-22 光驰科技(上海)有限公司 自动化连续式防污膜镀膜装置
KR101641453B1 (ko) * 2015-01-14 2016-07-21 에스엔유 프리시젼 주식회사 박막 증착 장치
KR20160123438A (ko) * 2015-04-15 2016-10-26 삼성디스플레이 주식회사 유기 발광 디스플레이 장치용 증착원
TWI737718B (zh) 2016-04-25 2021-09-01 美商創新先進材料股份有限公司 含有瀉流源的沉積系統及相關方法
US11293551B2 (en) 2018-09-30 2022-04-05 ColdQuanta, Inc. Break-seal system with breakable-membrane bridging rings
KR20210134976A (ko) 2019-03-13 2021-11-11 메트옥스 테크놀로지스 인코포레이티드 박막 증착용 고체 전구체 공급 시스템
US20220274338A1 (en) * 2019-09-16 2022-09-01 Hewlett-Packard Development Company, L.P. Build material loading
DE102020103822A1 (de) 2020-02-13 2021-08-19 Apeva Se Vorrichtung zum Verdampfen eines organischen Pulvers
DE102020118015A1 (de) * 2020-07-08 2022-01-13 Thyssenkrupp Steel Europe Ag Beschichtungsvorrichtung zum Ablagern eines Beschichtungsmaterials auf einem Substrat
CN113737137B (zh) * 2021-11-05 2022-01-18 苏州盛曼特新材料有限公司 一种金属膜蒸镀加工设备

Family Cites Families (13)

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US2447789A (en) * 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
US3693840A (en) * 1970-12-18 1972-09-26 George N Starr Dispensing device for salt and the like
US4885211A (en) * 1987-02-11 1989-12-05 Eastman Kodak Company Electroluminescent device with improved cathode
US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
KR920003591B1 (ko) * 1988-04-11 1992-05-04 미쯔비시주우고오교오 가부시기가이샤 연속진공증착장치
EP0585848A1 (de) 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
JP3586551B2 (ja) * 1998-01-27 2004-11-10 松下電器産業株式会社 光記録媒体の製造方法及び製造装置
US5945163A (en) * 1998-02-19 1999-08-31 First Solar, Llc Apparatus and method for depositing a material on a substrate
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法
JP2003216681A (ja) 2002-01-24 2003-07-31 Fujitsu Ltd 電磁界強度算出方法および算出装置
TWI277363B (en) * 2002-08-30 2007-03-21 Semiconductor Energy Lab Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
KR101137901B1 (ko) * 2003-05-16 2012-05-02 에스브이티 어소시에이츠, 인코포레이티드 박막 증착 증발기
US7501151B2 (en) * 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone

Also Published As

Publication number Publication date
TWI377715B (en) 2012-11-21
WO2007058775A3 (en) 2007-07-12
TW200725960A (en) 2007-07-01
JP2009516072A (ja) 2009-04-16
US20070104864A1 (en) 2007-05-10
US7638168B2 (en) 2009-12-29
EP1971702B1 (en) 2014-08-27
EP1971702A2 (en) 2008-09-24
WO2007058775A2 (en) 2007-05-24

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