TWI377715B - Deposition method using sealed replenishment container - Google Patents
Deposition method using sealed replenishment container Download PDFInfo
- Publication number
- TWI377715B TWI377715B TW095141450A TW95141450A TWI377715B TW I377715 B TWI377715 B TW I377715B TW 095141450 A TW095141450 A TW 095141450A TW 95141450 A TW95141450 A TW 95141450A TW I377715 B TWI377715 B TW I377715B
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- Prior art keywords
- particulate material
- organic
- container
- feed
- evaporation
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/273,268 US7638168B2 (en) | 2005-11-10 | 2005-11-10 | Deposition system using sealed replenishment container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200725960A TW200725960A (en) | 2007-07-01 |
| TWI377715B true TWI377715B (en) | 2012-11-21 |
Family
ID=37964945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095141450A TWI377715B (en) | 2005-11-10 | 2006-11-09 | Deposition method using sealed replenishment container |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7638168B2 (enExample) |
| EP (1) | EP1971702B1 (enExample) |
| JP (1) | JP5054020B2 (enExample) |
| TW (1) | TWI377715B (enExample) |
| WO (1) | WO2007058775A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5011013B2 (ja) * | 2007-07-24 | 2012-08-29 | 大陽日酸株式会社 | 二フッ化キセノンガス供給装置 |
| US7883583B2 (en) * | 2008-01-08 | 2011-02-08 | Global Oled Technology Llc | Vaporization apparatus with precise powder metering |
| US8048230B2 (en) * | 2008-11-14 | 2011-11-01 | Global Oled Technology Llc | Metering and vaporizing particulate material |
| US8062427B2 (en) * | 2008-11-14 | 2011-11-22 | Global Oled Technology Llc | Particulate material metering and vaporization |
| US7972443B2 (en) * | 2008-11-14 | 2011-07-05 | Global Oled Technology Llc | Metering of particulate material and vaporization thereof |
| GB2472817A (en) | 2009-08-19 | 2011-02-23 | Queen Mary & Westfield College | Powder dispenser with permanently-open linear-taper nozzle operated by vibration |
| JP2013503256A (ja) * | 2009-08-26 | 2013-01-31 | 株式会社テラセミコン | 蒸着ガス供給装置 |
| JP4974036B2 (ja) | 2009-11-19 | 2012-07-11 | 株式会社ジャパンディスプレイセントラル | 有機ｅｌ装置の製造方法 |
| JP2012046814A (ja) * | 2010-08-30 | 2012-03-08 | Kaneka Corp | 蒸着装置 |
| KR101402526B1 (ko) | 2011-12-26 | 2014-06-09 | 삼성디스플레이 주식회사 | 수명이 향상된 유기발광소자 및 그 제조방법 |
| AU2013208044A1 (en) * | 2012-01-10 | 2014-03-20 | Hzo, Inc. | Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods |
| US9578718B2 (en) * | 2012-05-04 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting element and deposition apparatus |
| GB201300828D0 (en) | 2013-01-17 | 2013-03-06 | Varydose Ltd | Apparatus and method for dispensing powders |
| FR3020381B1 (fr) * | 2014-04-24 | 2017-09-29 | Riber | Cellule d'evaporation |
| CN104498889B (zh) * | 2014-12-18 | 2017-02-22 | 光驰科技(上海)有限公司 | 自动化连续式防污膜镀膜装置 |
| KR101641453B1 (ko) * | 2015-01-14 | 2016-07-21 | 에스엔유 프리시젼 주식회사 | 박막 증착 장치 |
| KR20160123438A (ko) * | 2015-04-15 | 2016-10-26 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치용 증착원 |
| TWI737718B (zh) | 2016-04-25 | 2021-09-01 | 美商創新先進材料股份有限公司 | 含有瀉流源的沉積系統及相關方法 |
| US11293551B2 (en) | 2018-09-30 | 2022-04-05 | ColdQuanta, Inc. | Break-seal system with breakable-membrane bridging rings |
| KR20210134976A (ko) | 2019-03-13 | 2021-11-11 | 메트옥스 테크놀로지스 인코포레이티드 | 박막 증착용 고체 전구체 공급 시스템 |
| US20220274338A1 (en) * | 2019-09-16 | 2022-09-01 | Hewlett-Packard Development Company, L.P. | Build material loading |
| DE102020103822A1 (de) | 2020-02-13 | 2021-08-19 | Apeva Se | Vorrichtung zum Verdampfen eines organischen Pulvers |
| DE102020118015A1 (de) * | 2020-07-08 | 2022-01-13 | Thyssenkrupp Steel Europe Ag | Beschichtungsvorrichtung zum Ablagern eines Beschichtungsmaterials auf einem Substrat |
| CN113737137B (zh) * | 2021-11-05 | 2022-01-18 | 苏州盛曼特新材料有限公司 | 一种金属膜蒸镀加工设备 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2447789A (en) * | 1945-03-23 | 1948-08-24 | Polaroid Corp | Evaporating crucible for coating apparatus |
| US3693840A (en) * | 1970-12-18 | 1972-09-26 | George N Starr | Dispensing device for salt and the like |
| US4885211A (en) * | 1987-02-11 | 1989-12-05 | Eastman Kodak Company | Electroluminescent device with improved cathode |
| US4769292A (en) * | 1987-03-02 | 1988-09-06 | Eastman Kodak Company | Electroluminescent device with modified thin film luminescent zone |
| KR920003591B1 (ko) * | 1988-04-11 | 1992-05-04 | 미쯔비시주우고오교오 가부시기가이샤 | 연속진공증착장치 |
| EP0585848A1 (de) | 1992-09-02 | 1994-03-09 | Hoechst Aktiengesellschaft | Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten |
| JP3586551B2 (ja) * | 1998-01-27 | 2004-11-10 | 松下電器産業株式会社 | 光記録媒体の製造方法及び製造装置 |
| US5945163A (en) * | 1998-02-19 | 1999-08-31 | First Solar, Llc | Apparatus and method for depositing a material on a substrate |
| JP2000068055A (ja) | 1998-08-26 | 2000-03-03 | Tdk Corp | 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法 |
| JP2003216681A (ja) | 2002-01-24 | 2003-07-31 | Fujitsu Ltd | 電磁界強度算出方法および算出装置 |
| TWI277363B (en) * | 2002-08-30 | 2007-03-21 | Semiconductor Energy Lab | Fabrication system, light-emitting device and fabricating method of organic compound-containing layer |
| KR101137901B1 (ko) * | 2003-05-16 | 2012-05-02 | 에스브이티 어소시에이츠, 인코포레이티드 | 박막 증착 증발기 |
| US7501151B2 (en) * | 2004-09-21 | 2009-03-10 | Eastman Kodak Company | Delivering particulate material to a vaporization zone |
-
2005
- 2005-11-10 US US11/273,268 patent/US7638168B2/en active Active
-
2006
- 2006-11-01 JP JP2008540057A patent/JP5054020B2/ja active Active
- 2006-11-01 WO PCT/US2006/042605 patent/WO2007058775A2/en not_active Ceased
- 2006-11-01 EP EP06836748.1A patent/EP1971702B1/en active Active
- 2006-11-09 TW TW095141450A patent/TWI377715B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007058775A3 (en) | 2007-07-12 |
| TW200725960A (en) | 2007-07-01 |
| JP2009516072A (ja) | 2009-04-16 |
| US20070104864A1 (en) | 2007-05-10 |
| US7638168B2 (en) | 2009-12-29 |
| EP1971702B1 (en) | 2014-08-27 |
| JP5054020B2 (ja) | 2012-10-24 |
| EP1971702A2 (en) | 2008-09-24 |
| WO2007058775A2 (en) | 2007-05-24 |
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