JP5051463B2 - 積み重ね型パッケージ集積回路デバイスの製造方法 - Google Patents
積み重ね型パッケージ集積回路デバイスの製造方法 Download PDFInfo
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Description
路デバイス12Aと第二のパッケージ回路デバイス12Bはほぼ同じパッケージサイズを持つ。さらに、本開示の方法を用いて、積み重ねられたダイパッケージ10は、図1に示された例示的なパッケージデバイス12Aと12Bの二つ以上を含む。例えば、3個から5個のパッケージ集積回路デバイスを、本開示の構造および方法を用いて、一つの積み重ね10として配置できる。
長部54に設けて、延長部54からパッケージ集積回路デバイス12A、12Bへの接続をつくってもよい。
Claims (6)
- 第一及び第二のパッケージされた集積回路デバイスを提供するステップであって、前記第一及び第二のパッケージされた集積回路デバイスのそれぞれが複数の導電性端子を有する、ステップと、
複数のリードフレーム延長部を前記第一のパッケージされた集積回路デバイスの前記導電性端子と位置整合させ、かつ、前記リードフレーム延長部を前記第一のパッケージされた集積回路デバイスの対応する導電性端子に取り付けるための第一のリフロー工程を行なうステップと、
前記複数のリードフレーム延長部を前記第二のパッケージされた集積回路デバイスの前記導電性端子と位置整合させ、かつ、前記リードフレーム延長部を前記第二のパッケージされた集積回路デバイスの対応する導電性端子に取り付けるための第二のリフロー工程を行ない、これにより前記第一及び第二のパッケージされた集積回路デバイスを互いに導電的に接続するステップと、
を含む方法。 - 前記複数のリードフレーム延長部を位置整合するステップは、前記リードフレーム延長部のそれぞれの外縁が前記第一及び第二のパッケージされた集積回路デバイスの少なくとも一方の外縁とほぼ位置整合されるように、前記複数のリードフレーム延長部を配置するステップを含む、請求項1の方法。
- 前記リードフレーム延長部のそれぞれが、上から見て、ほぼ方形の構成を有する、請求項1の方法。
- リードフレームの複数の延長部を第一のパッケージされた集積回路デバイスの上面の複数の導電性端子に導電的に接続するための第一のリフロー工程を行なうステップと、
前記リードフレームの複数の延長部を第二のパッケージされた集積回路デバイスの下面の複数の導電性端子に導電的に接続するための第二のリフロー工程を行うステップと、
前記リードフレームを分断して、前記複数の延長部を単独化するステップと、
を含む方法。 - 前記リードフレームを分断するステップが、前記複数の延長部を前記リードフレームのタイバーから分離するステップを含む、請求項4の方法。
- 前記複数の延長部分の外縁が、積み重ねられた前記第一及び第二のパッケージされた集積回路デバイスの少なくとも一方の外縁とほぼ位置整合されるように、前記リードフレームの前記分断が行われる、請求項4の方法。
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US11/749,336 | 2007-05-16 | ||
US11/749,336 US8106491B2 (en) | 2007-05-16 | 2007-05-16 | Methods of forming stacked semiconductor devices with a leadframe and associated assemblies |
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JP2008288591A JP2008288591A (ja) | 2008-11-27 |
JP5051463B2 true JP5051463B2 (ja) | 2012-10-17 |
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US8106491B2 (en) | 2007-05-16 | 2012-01-31 | Micron Technology, Inc. | Methods of forming stacked semiconductor devices with a leadframe and associated assemblies |
US9176671B1 (en) | 2011-04-06 | 2015-11-03 | P4tents1, LLC | Fetching data between thread execution in a flash/DRAM/embedded DRAM-equipped system |
US9170744B1 (en) | 2011-04-06 | 2015-10-27 | P4tents1, LLC | Computer program product for controlling a flash/DRAM/embedded DRAM-equipped system |
US9432298B1 (en) | 2011-12-09 | 2016-08-30 | P4tents1, LLC | System, method, and computer program product for improving memory systems |
US9164679B2 (en) | 2011-04-06 | 2015-10-20 | Patents1, Llc | System, method and computer program product for multi-thread operation involving first memory of a first memory class and second memory of a second memory class |
US8930647B1 (en) | 2011-04-06 | 2015-01-06 | P4tents1, LLC | Multiple class memory systems |
US9158546B1 (en) | 2011-04-06 | 2015-10-13 | P4tents1, LLC | Computer program product for fetching from a first physical memory between an execution of a plurality of threads associated with a second physical memory |
US9417754B2 (en) | 2011-08-05 | 2016-08-16 | P4tents1, LLC | User interface system, method, and computer program product |
KR102372300B1 (ko) * | 2015-11-26 | 2022-03-08 | 삼성전자주식회사 | 스택 패키지 및 그 제조 방법 |
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US20150171061A1 (en) | 2015-06-18 |
JP2008288591A (ja) | 2008-11-27 |
US8963302B2 (en) | 2015-02-24 |
US20120127685A1 (en) | 2012-05-24 |
US8106491B2 (en) | 2012-01-31 |
US20130256853A1 (en) | 2013-10-03 |
US9362260B2 (en) | 2016-06-07 |
US8445997B2 (en) | 2013-05-21 |
US20080283977A1 (en) | 2008-11-20 |
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