JP5050099B2 - 脆性材料基板の加工方法 - Google Patents

脆性材料基板の加工方法 Download PDF

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Publication number
JP5050099B2
JP5050099B2 JP2010508155A JP2010508155A JP5050099B2 JP 5050099 B2 JP5050099 B2 JP 5050099B2 JP 2010508155 A JP2010508155 A JP 2010508155A JP 2010508155 A JP2010508155 A JP 2010508155A JP 5050099 B2 JP5050099 B2 JP 5050099B2
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JP
Japan
Prior art keywords
laser
substrate
beam spot
laser beam
polygon mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010508155A
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English (en)
Japanese (ja)
Other versions
JPWO2009128316A1 (ja
Inventor
透 熊谷
裕介 平内
修一 井上
山本　　幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010508155A priority Critical patent/JP5050099B2/ja
Publication of JPWO2009128316A1 publication Critical patent/JPWO2009128316A1/ja
Application granted granted Critical
Publication of JP5050099B2 publication Critical patent/JP5050099B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2010508155A 2008-04-15 2009-03-16 脆性材料基板の加工方法 Expired - Fee Related JP5050099B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010508155A JP5050099B2 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008106219 2008-04-15
JP2008106219 2008-04-15
JP2010508155A JP5050099B2 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法
PCT/JP2009/055061 WO2009128316A1 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
JPWO2009128316A1 JPWO2009128316A1 (ja) 2011-08-04
JP5050099B2 true JP5050099B2 (ja) 2012-10-17

Family

ID=41199016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010508155A Expired - Fee Related JP5050099B2 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法

Country Status (5)

Country Link
JP (1) JP5050099B2 (ko)
KR (1) KR101165977B1 (ko)
CN (1) CN102046345A (ko)
TW (1) TW200948524A (ko)
WO (1) WO2009128316A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP2013136074A (ja) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法
KR101388181B1 (ko) 2012-09-04 2014-04-30 (주)하드램 유리 기판 레이저 절단 장치 및 방법
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method
EP2980033B1 (en) 2013-03-26 2021-01-20 AGC Inc. Glass sheet processing method and glass sheet processing apparatus
TWM469728U (zh) * 2013-05-30 2014-01-01 Bungbungame Inc 承載架及運用此承載架的包裝盒
JP6413693B2 (ja) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN105436712B (zh) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及系统
CN105436617B (zh) * 2016-01-13 2017-05-31 中国工程物理研究院核物理与化学研究所 同位素辐照盒无屑切割机
JP6888808B2 (ja) * 2017-03-30 2021-06-16 三星ダイヤモンド工業株式会社 樹脂層付き脆性材料基板の分断方法並びに分断装置
JP6855955B2 (ja) * 2017-06-19 2021-04-07 株式会社Sumco レーザマークの印字方法、レーザマーク付きシリコンウェーハの製造方法
JP6717353B2 (ja) * 2018-10-22 2020-07-01 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
KR100462358B1 (ko) * 2004-03-31 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치

Also Published As

Publication number Publication date
KR20110006678A (ko) 2011-01-20
WO2009128316A1 (ja) 2009-10-22
TW200948524A (en) 2009-12-01
CN102046345A (zh) 2011-05-04
JPWO2009128316A1 (ja) 2011-08-04
KR101165977B1 (ko) 2012-07-18
TWI375602B (ko) 2012-11-01

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