JP5044818B2 - 補償されたカソード・コンタクトを使用する1マスク超階段接合バラクタの形成方法 - Google Patents
補償されたカソード・コンタクトを使用する1マスク超階段接合バラクタの形成方法 Download PDFInfo
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- JP5044818B2 JP5044818B2 JP2007550400A JP2007550400A JP5044818B2 JP 5044818 B2 JP5044818 B2 JP 5044818B2 JP 2007550400 A JP2007550400 A JP 2007550400A JP 2007550400 A JP2007550400 A JP 2007550400A JP 5044818 B2 JP5044818 B2 JP 5044818B2
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- 238000002513 implantation Methods 0.000 claims description 22
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- 229910021332 silicide Inorganic materials 0.000 claims description 14
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 14
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
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- 229910003811 SiGeC Inorganic materials 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 238000001312 dry etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
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- 229910003465 moissanite Inorganic materials 0.000 description 1
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- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
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- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/64—Variable-capacitance diodes, e.g. varactors
Landscapes
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/905,486 | 2005-01-06 | ||
| US10/905,486 US7518215B2 (en) | 2005-01-06 | 2005-01-06 | One mask hyperabrupt junction varactor using a compensated cathode contact |
| PCT/US2005/047085 WO2006073943A2 (en) | 2005-01-06 | 2005-12-22 | Method for forming a one mask hyperabrupt junction varactor using a compensated cathode contact |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008527714A JP2008527714A (ja) | 2008-07-24 |
| JP2008527714A5 JP2008527714A5 (enExample) | 2008-11-27 |
| JP5044818B2 true JP5044818B2 (ja) | 2012-10-10 |
Family
ID=36639455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007550400A Expired - Fee Related JP5044818B2 (ja) | 2005-01-06 | 2005-12-22 | 補償されたカソード・コンタクトを使用する1マスク超階段接合バラクタの形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7518215B2 (enExample) |
| EP (1) | EP1839340B1 (enExample) |
| JP (1) | JP5044818B2 (enExample) |
| CN (1) | CN100539022C (enExample) |
| WO (1) | WO2006073943A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7525177B2 (en) * | 2005-04-01 | 2009-04-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Controllable varactor within dummy substrate pattern |
| US20080149983A1 (en) * | 2006-12-20 | 2008-06-26 | International Business Machines Corporation | Metal-oxide-semiconductor (mos) varactors and methods of forming mos varactors |
| US7692271B2 (en) * | 2007-02-28 | 2010-04-06 | International Business Machines Corporation | Differential junction varactor |
| US7825441B2 (en) * | 2007-06-25 | 2010-11-02 | International Business Machines Corporation | Junction field effect transistor with a hyperabrupt junction |
| US20090101988A1 (en) * | 2007-10-18 | 2009-04-23 | Texas Instruments Incorporated | Bipolar transistors with resistors |
| US7696604B2 (en) * | 2007-10-23 | 2010-04-13 | International Business Machines Corporation | Silicon germanium heterostructure barrier varactor |
| US7902606B2 (en) * | 2008-01-11 | 2011-03-08 | International Business Machines Corporation | Double gate depletion mode MOSFET |
| US8338906B2 (en) * | 2008-01-30 | 2012-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Schottky device |
| US7804119B2 (en) * | 2008-04-08 | 2010-09-28 | International Business Machines Corporation | Device structures with a hyper-abrupt P-N junction, methods of forming a hyper-abrupt P-N junction, and design structures for an integrated circuit |
| US8232558B2 (en) * | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
| US8796809B2 (en) * | 2008-09-08 | 2014-08-05 | Cree, Inc. | Varactor diode with doped voltage blocking layer |
| US7821103B2 (en) * | 2008-09-09 | 2010-10-26 | Freescale Semiconductor, Inc. | Counter-doped varactor structure and method |
| US8216890B2 (en) | 2009-03-13 | 2012-07-10 | International Business Machines Corporation | Lateral hyperabrupt junction varactor diode in an SOI substrate |
| JP6186601B2 (ja) * | 2013-01-16 | 2017-08-30 | セイコーNpc株式会社 | 可変容量ダイオード |
| TWI772839B (zh) * | 2019-07-17 | 2022-08-01 | 美商安托梅拉公司 | 設有含分隔超晶格之突陡接面區之可變電容器及相關方法 |
| US10937888B2 (en) | 2019-07-17 | 2021-03-02 | Atomera Incorporated | Method for making a varactor with a hyper-abrupt junction region including spaced-apart superlattices |
| US11183565B2 (en) | 2019-07-17 | 2021-11-23 | Atomera Incorporated | Semiconductor devices including hyper-abrupt junction region including spaced-apart superlattices and related methods |
| TWI751609B (zh) * | 2019-07-17 | 2022-01-01 | 美商安托梅拉公司 | 設有含超晶格之突陡接面區之可變電容器及相關方法 |
| US10937868B2 (en) | 2019-07-17 | 2021-03-02 | Atomera Incorporated | Method for making semiconductor devices with hyper-abrupt junction region including spaced-apart superlattices |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226648A (en) | 1979-03-16 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Method of making a hyperabrupt varactor diode utilizing molecular beam epitaxy |
| US4481487A (en) | 1981-08-14 | 1984-11-06 | Texas Instruments Incorporated | Monolithic microwave wide-band VCO |
| FR2592527B1 (fr) | 1985-12-31 | 1988-02-05 | Thomson Csf | Diode a capacite variable, a profil hyperabrupt et structure plane, et son procede de realisation |
| JPS6419779A (en) | 1987-07-15 | 1989-01-23 | Nec Corp | Manufacture of hyperabrupt varactor diode |
| JPH02219279A (ja) * | 1989-02-20 | 1990-08-31 | Sanyo Electric Co Ltd | 超階段型接合ダイオードの製造方法 |
| JPH05175519A (ja) * | 1991-12-25 | 1993-07-13 | Toshiba Corp | 半導体装置 |
| JP4088263B2 (ja) * | 1992-07-02 | 2008-05-21 | 株式会社東芝 | 高耐圧半導体素子 |
| JP2755135B2 (ja) * | 1993-11-25 | 1998-05-20 | 日本電気株式会社 | 可変容量装置および該可変容量装置を有する半導体集積回路装置 |
| US5557140A (en) | 1995-04-12 | 1996-09-17 | Hughes Aircraft Company | Process tolerant, high-voltage, bi-level capacitance varactor diode |
| JPH10256574A (ja) * | 1997-03-14 | 1998-09-25 | Toko Inc | ダイオード装置 |
| JP3114654B2 (ja) * | 1997-06-05 | 2000-12-04 | 日本電気株式会社 | 半導体装置の製造方法 |
| CN1288726C (zh) * | 2000-03-03 | 2006-12-06 | 皇家菲利浦电子有限公司 | 制造肖特基变容二极管的方法 |
| US6559024B1 (en) | 2000-03-29 | 2003-05-06 | Tyco Electronics Corporation | Method of fabricating a variable capacity diode having a hyperabrupt junction profile |
| JP2002305309A (ja) * | 2001-02-01 | 2002-10-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US7235862B2 (en) * | 2001-07-10 | 2007-06-26 | National Semiconductor Corporation | Gate-enhanced junction varactor |
| WO2003054972A1 (en) * | 2001-12-12 | 2003-07-03 | Matsushita Electric Industrial Co., Ltd. | Variable capacitor and its manufacturing method |
| US6521506B1 (en) | 2001-12-13 | 2003-02-18 | International Business Machines Corporation | Varactors for CMOS and BiCMOS technologies |
| SE0200137L (sv) * | 2002-01-18 | 2003-07-19 | Ericsson Telefon Ab L M | Tillverkningsmetod, varaktor samt integrerad krets |
| JP2003229581A (ja) * | 2002-02-04 | 2003-08-15 | Shuzo Ito | 半導体素子および半導体装置の製造方法 |
| US7253073B2 (en) * | 2004-01-23 | 2007-08-07 | International Business Machines Corporation | Structure and method for hyper-abrupt junction varactors |
-
2005
- 2005-01-06 US US10/905,486 patent/US7518215B2/en not_active Expired - Lifetime
- 2005-12-22 WO PCT/US2005/047085 patent/WO2006073943A2/en not_active Ceased
- 2005-12-22 EP EP05855611A patent/EP1839340B1/en not_active Expired - Lifetime
- 2005-12-22 JP JP2007550400A patent/JP5044818B2/ja not_active Expired - Fee Related
- 2005-12-22 CN CNB2005800460080A patent/CN100539022C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100539022C (zh) | 2009-09-09 |
| EP1839340B1 (en) | 2013-03-13 |
| US7518215B2 (en) | 2009-04-14 |
| WO2006073943A2 (en) | 2006-07-13 |
| EP1839340A2 (en) | 2007-10-03 |
| US20060145300A1 (en) | 2006-07-06 |
| EP1839340A4 (en) | 2009-09-09 |
| JP2008527714A (ja) | 2008-07-24 |
| WO2006073943A3 (en) | 2007-03-01 |
| CN101099225A (zh) | 2008-01-02 |
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