CN100539022C - 用于使用补偿阴极接触形成单掩模超突变结变容管的方法 - Google Patents
用于使用补偿阴极接触形成单掩模超突变结变容管的方法 Download PDFInfo
- Publication number
- CN100539022C CN100539022C CNB2005800460080A CN200580046008A CN100539022C CN 100539022 C CN100539022 C CN 100539022C CN B2005800460080 A CNB2005800460080 A CN B2005800460080A CN 200580046008 A CN200580046008 A CN 200580046008A CN 100539022 C CN100539022 C CN 100539022C
- Authority
- CN
- China
- Prior art keywords
- dopant
- region
- negative electrode
- abrupt junction
- semiconductor structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/64—Variable-capacitance diodes, e.g. varactors
Landscapes
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/905,486 US7518215B2 (en) | 2005-01-06 | 2005-01-06 | One mask hyperabrupt junction varactor using a compensated cathode contact |
| US10/905,486 | 2005-01-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101099225A CN101099225A (zh) | 2008-01-02 |
| CN100539022C true CN100539022C (zh) | 2009-09-09 |
Family
ID=36639455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800460080A Expired - Fee Related CN100539022C (zh) | 2005-01-06 | 2005-12-22 | 用于使用补偿阴极接触形成单掩模超突变结变容管的方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7518215B2 (enExample) |
| EP (1) | EP1839340B1 (enExample) |
| JP (1) | JP5044818B2 (enExample) |
| CN (1) | CN100539022C (enExample) |
| WO (1) | WO2006073943A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7525177B2 (en) * | 2005-04-01 | 2009-04-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Controllable varactor within dummy substrate pattern |
| US20080149983A1 (en) * | 2006-12-20 | 2008-06-26 | International Business Machines Corporation | Metal-oxide-semiconductor (mos) varactors and methods of forming mos varactors |
| US7692271B2 (en) * | 2007-02-28 | 2010-04-06 | International Business Machines Corporation | Differential junction varactor |
| US7825441B2 (en) * | 2007-06-25 | 2010-11-02 | International Business Machines Corporation | Junction field effect transistor with a hyperabrupt junction |
| US20090101988A1 (en) * | 2007-10-18 | 2009-04-23 | Texas Instruments Incorporated | Bipolar transistors with resistors |
| US7696604B2 (en) * | 2007-10-23 | 2010-04-13 | International Business Machines Corporation | Silicon germanium heterostructure barrier varactor |
| US7902606B2 (en) * | 2008-01-11 | 2011-03-08 | International Business Machines Corporation | Double gate depletion mode MOSFET |
| US8338906B2 (en) * | 2008-01-30 | 2012-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Schottky device |
| US7804119B2 (en) * | 2008-04-08 | 2010-09-28 | International Business Machines Corporation | Device structures with a hyper-abrupt P-N junction, methods of forming a hyper-abrupt P-N junction, and design structures for an integrated circuit |
| US8232558B2 (en) * | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
| US8796809B2 (en) * | 2008-09-08 | 2014-08-05 | Cree, Inc. | Varactor diode with doped voltage blocking layer |
| US7821103B2 (en) * | 2008-09-09 | 2010-10-26 | Freescale Semiconductor, Inc. | Counter-doped varactor structure and method |
| US8216890B2 (en) | 2009-03-13 | 2012-07-10 | International Business Machines Corporation | Lateral hyperabrupt junction varactor diode in an SOI substrate |
| JP6186601B2 (ja) * | 2013-01-16 | 2017-08-30 | セイコーNpc株式会社 | 可変容量ダイオード |
| TWI751609B (zh) * | 2019-07-17 | 2022-01-01 | 美商安托梅拉公司 | 設有含超晶格之突陡接面區之可變電容器及相關方法 |
| TWI772839B (zh) * | 2019-07-17 | 2022-08-01 | 美商安托梅拉公司 | 設有含分隔超晶格之突陡接面區之可變電容器及相關方法 |
| US10937888B2 (en) | 2019-07-17 | 2021-03-02 | Atomera Incorporated | Method for making a varactor with a hyper-abrupt junction region including spaced-apart superlattices |
| US10937868B2 (en) | 2019-07-17 | 2021-03-02 | Atomera Incorporated | Method for making semiconductor devices with hyper-abrupt junction region including spaced-apart superlattices |
| US11183565B2 (en) | 2019-07-17 | 2021-11-23 | Atomera Incorporated | Semiconductor devices including hyper-abrupt junction region including spaced-apart superlattices and related methods |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521506B1 (en) * | 2001-12-13 | 2003-02-18 | International Business Machines Corporation | Varactors for CMOS and BiCMOS technologies |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226648A (en) * | 1979-03-16 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Method of making a hyperabrupt varactor diode utilizing molecular beam epitaxy |
| US4481487A (en) * | 1981-08-14 | 1984-11-06 | Texas Instruments Incorporated | Monolithic microwave wide-band VCO |
| FR2592527B1 (fr) * | 1985-12-31 | 1988-02-05 | Thomson Csf | Diode a capacite variable, a profil hyperabrupt et structure plane, et son procede de realisation |
| JPS6419779A (en) | 1987-07-15 | 1989-01-23 | Nec Corp | Manufacture of hyperabrupt varactor diode |
| JPH02219279A (ja) * | 1989-02-20 | 1990-08-31 | Sanyo Electric Co Ltd | 超階段型接合ダイオードの製造方法 |
| JPH05175519A (ja) * | 1991-12-25 | 1993-07-13 | Toshiba Corp | 半導体装置 |
| JP4088263B2 (ja) * | 1992-07-02 | 2008-05-21 | 株式会社東芝 | 高耐圧半導体素子 |
| JP2755135B2 (ja) * | 1993-11-25 | 1998-05-20 | 日本電気株式会社 | 可変容量装置および該可変容量装置を有する半導体集積回路装置 |
| US5557140A (en) * | 1995-04-12 | 1996-09-17 | Hughes Aircraft Company | Process tolerant, high-voltage, bi-level capacitance varactor diode |
| JPH10256574A (ja) * | 1997-03-14 | 1998-09-25 | Toko Inc | ダイオード装置 |
| JP3114654B2 (ja) * | 1997-06-05 | 2000-12-04 | 日本電気株式会社 | 半導体装置の製造方法 |
| EP1214737B1 (en) * | 2000-03-03 | 2011-06-01 | Nxp B.V. | A method of producing a schottky varicap diode |
| US6559024B1 (en) * | 2000-03-29 | 2003-05-06 | Tyco Electronics Corporation | Method of fabricating a variable capacity diode having a hyperabrupt junction profile |
| JP2002305309A (ja) * | 2001-02-01 | 2002-10-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US7235862B2 (en) * | 2001-07-10 | 2007-06-26 | National Semiconductor Corporation | Gate-enhanced junction varactor |
| WO2003054972A1 (en) * | 2001-12-12 | 2003-07-03 | Matsushita Electric Industrial Co., Ltd. | Variable capacitor and its manufacturing method |
| SE0200137L (sv) * | 2002-01-18 | 2003-07-19 | Ericsson Telefon Ab L M | Tillverkningsmetod, varaktor samt integrerad krets |
| JP2003229581A (ja) * | 2002-02-04 | 2003-08-15 | Shuzo Ito | 半導体素子および半導体装置の製造方法 |
| US7253073B2 (en) * | 2004-01-23 | 2007-08-07 | International Business Machines Corporation | Structure and method for hyper-abrupt junction varactors |
-
2005
- 2005-01-06 US US10/905,486 patent/US7518215B2/en not_active Expired - Lifetime
- 2005-12-22 EP EP05855611A patent/EP1839340B1/en not_active Expired - Lifetime
- 2005-12-22 JP JP2007550400A patent/JP5044818B2/ja not_active Expired - Fee Related
- 2005-12-22 CN CNB2005800460080A patent/CN100539022C/zh not_active Expired - Fee Related
- 2005-12-22 WO PCT/US2005/047085 patent/WO2006073943A2/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521506B1 (en) * | 2001-12-13 | 2003-02-18 | International Business Machines Corporation | Varactors for CMOS and BiCMOS technologies |
Also Published As
| Publication number | Publication date |
|---|---|
| US7518215B2 (en) | 2009-04-14 |
| WO2006073943A2 (en) | 2006-07-13 |
| WO2006073943A3 (en) | 2007-03-01 |
| US20060145300A1 (en) | 2006-07-06 |
| JP5044818B2 (ja) | 2012-10-10 |
| EP1839340A4 (en) | 2009-09-09 |
| CN101099225A (zh) | 2008-01-02 |
| EP1839340A2 (en) | 2007-10-03 |
| JP2008527714A (ja) | 2008-07-24 |
| EP1839340B1 (en) | 2013-03-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171110 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171110 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20181222 |
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| CF01 | Termination of patent right due to non-payment of annual fee |