JP5043297B2 - デバイスの溶融密封方法及びシステム - Google Patents
デバイスの溶融密封方法及びシステム Download PDFInfo
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Description
315 チップ
320 透明要素
339 凹部領域
340 支持領域
342 支持領域
344 ストリート領域
346 ストリート領域
354 透明カバー
510 支持領域
512 ストリート領域
515 支持領域
517 ストリート領域
552 透明要素
554 透明要素
556 透明要素
558 透明要素
560 チップ
610 チップ
630 結合パッド
710 相互結合領域
725 リードフレーム構造
730 封止材
Claims (58)
- 複数の独立したチップを有する基板を用意し、該チップのそれぞれは、複数のマイクロミラーデバイスを含み、第1の配列として空間的に配置され、該配列の構成は離間して配置された複数の第1のストリート領域と離間して配置された複数の第2のストリート領域とを含み、該第2のストリート領域は、前記第1のストリート領域と交差して配列構造を形成し、
予め定められた厚さを有し、当該予め定められた厚さの中に複数の凹部領域を含み、第2の配列として空間的に配置された透明要素を用意し、前記凹部領域のそれぞれは、支持領域により画定され、該支持領域は前記予め定められた厚さの一部により規定される厚さを有し、
前記透明要素は、第1の側面と第2の側面とを有し、前記第1の側面は前記第2の側面と平行であり、前記第1の側面と前記第2の側面とは反射防止材料でコーティングされ、
前記透明要素を前記複数のチップのそれぞれに対応する前記複数の凹部領域のそれぞれと結合するように配置し、前記支持領域は、対応する一つの前記凹部領域内の前記チップのそれぞれを囲むように、前記複数の第1のストリート領域のそれぞれに結合されかつ前記複数の第2のストリート領域のそれぞれに結合され、
少なくとも前記一つの凹部領域内のチップのそれぞれを画定するための結合処理によって、前記透明要素の前記支持領域を前記複数の第1のストリート領域と前記複数の第2のストリート領域とに接触させることにより、前記対応する一つの凹部領域内の前記チップのそれぞれを溶融密封する、
デバイスの溶融密封方法。 - 前記第1のストリート領域のそれぞれは、0.5mmから1.0mmの大きさの範囲の第1の幅を有し、前記第2のストリート領域のそれぞれは、0.5mmから1.0mmの大きさの範囲の第2の幅を有する、請求項1に記載の方法。
- 前記透明要素は、99%より大きい光学出力透過率を有する、請求項1に記載の方法。
- 前記透明要素は、熱膨張係数αTを有し、該熱膨張係数は、基板の熱膨張係数αSとほぼ同一である、請求項1に記載の方法。
- 前記透明要素は、前記凹部領域のそれぞれの表面領域と重なるように配置された反射防止コーティングを有する、請求項1に記載の方法。
- 前記凹部領域のそれぞれは、ドライまたはウェットエッチング、レーザ加工、音響加工、及び注型加工から選択された処理により形成された、請求項1に記載の方法。
- 前記透明要素は、支持層に重なる第1の透明部材を有し、前記支持層は前記支持領域を含む、請求項1に記載の方法。
- 前記支持層は第2の透明部材を有する、請求項1に記載の方法。
- 前記結合処理は、少なくともプラズマ励起結合、共融結合、接着剤層または接着結合、溶接、陽極結合及び溶融結合から選択される、請求項1に記載の方法。
- 前記透明要素は、0.1mmから1.2mmの範囲の厚さを有する、請求項1に記載の方法。
- 前記チップのそれぞれは、前記対応する一つの凹部領域内の不活性雰囲気中に保持される、請求項1に記載の方法。
- 前記不活性雰囲気は、窒素、アルゴン、または窒素及びアルゴンの混合物から選択される、請求項11に記載の方法。
- 前記不活性雰囲気は減衰作用を有する、請求項12に記載の方法。
- 前記不活性雰囲気は電気的切断を軽減する、請求項12に記載の方法。
- 前記チップのそれぞれは、相互結合領域を有し、該相互結合領域は前記凹部領域の外側に配置される、請求項1に記載の方法。
- 前記相互結合領域は、貫通孔を介して前記透明要素上に露出される、請求項15に記載の方法。
- 前記相互結合領域は、複数の結合パッドを有する、請求項16に記載の方法。
- 前記基板は含シリコン材料である、請求項1に記載の方法。
- 前記基板はシリコンウェハである、請求項18に記載の方法。
- 前記凹部領域のそれぞれは、第2の表面領域に結合された第1の表面領域を有し、前記第1の表面領域と前記第2の表面領域とは光学品質を有する、請求項1に記載の方法。
- 前記第1の表面領域は、2μm×2μmの面積について、20nm以下の二乗平均表面粗度を有する、請求項20に記載の方法。
- 前記凹部領域のそれぞれは、環状の形状を有する、請求項1に記載の方法。
- 前記凹部領域のそれぞれは、0.5mmまたはこれより小さい深さを有する、請求項1に記載の方法。
- 反射防止材料からなる前記コーティングは、前記第1の側面と前記第2の側面とにおいて、可視光の反射率を側面あたり2%より小さいように減少させる、請求項1に記載の方法。
- 前記反射防止材料はMgF2から構成される、請求項1に記載の方法。
- 前記第1のストリート領域のそれぞれの一部を画線しかつ前記第2のストリート領域のそれぞれの一部を画線することにより、前記チップの少なくとも1つを切断し、
前記一つの対応する凹部領域内の前記チップの少なくとも1つをリードフレーム構造に装着し、
前記装着されたチップの一部を前記リードフレーム構造の一部に配線結合し、
前記装着されたチップの配線結合された部分と前記リードフレーム構造の一部とを封止するとともに、封止材のない前記凹部領域上に規定される前記透明基板の表面領域を保持する、ことをさらに備える、請求項1に記載の方法。 - 前記凹部領域のそれぞれは光を排除する外周領域を有する、請求項1に記載の方法。
- 前記凹部領域のそれぞれは、前記対応する一つの凹部領域に重なる開口領域を形成する、請求項1に記載の方法。
- 前記複数のマイクロミラーデバイスの少なくとも1つは、複数の電荷結合デバイス、複数の変形デバイス、複数の感知デバイス及びICデバイスを有する、請求項1に記載の方法。
- それぞれが複数のマイクロミラーデバイスを有する複数の独立したチップを含むように構成された基板と、前記チップのそれぞれは、第1の配列として空間的に配置され、該配列の構成は離間して配置された複数の第1のストリート領域と離間して配置された複数の第2のストリート領域とを含み、該第2のストリート領域は、前記第1のストリート領域と交差して配列構造を形成し、
予め定められた厚さを有し、当該予め定められた厚さの中に複数の凹部領域を含み、第2の配列として空間的に配置された透明要素と、前記凹部領域のそれぞれは、支持領域により画定され、該支持領域は前記予め定められた厚さの一部により規定される厚さを有し、
前記透明要素は、第1の側面と第2の側面とを有し、前記第1の側面は前記第2の側面と平行であり、前記第1の側面と前記第2の側面とは反射防止材料でコーティングされ、
前記基板と前記透明要素とは前記複数の凹部領域のそれぞれを前記複数のチップの対応する1つと結合するように配置され、前記支持領域は、対応する一つの前記凹部領域の中に前記チップのそれぞれを配置するように、前記複数の第1のストリート領域のそれぞれに結合されかつ前記複数の第2のストリート領域のそれぞれに結合され、
少なくとも前記一つの凹部領域内のチップのそれぞれを画定するための結合処理によって、前記透明要素の前記支持領域を前記複数の第1及び第2のストリート領域に接触させることにより、前記対応する一つの凹部領域内の前記チップのそれぞれが溶融密封される、デバイスの溶融密封システム。 - 前記第1のストリート領域のそれぞれは、0.5mmから1.0mmの大きさの範囲の第1の幅を有し、前記第2のストリート領域のそれぞれは、0.5mmから1.0mmの大きさの範囲の第2の幅を有する、請求項30に記載のシステム。
- 前記透明要素は、99%より大きい光学出力透過率を有する、請求項30に記載のシステム。
- 前記透明要素は、熱膨張係数αTを有し、該熱膨張係数は、基板の熱膨張係数αSとほぼ同一である、請求項30に記載のシステム。
- 前記透明要素は、前記凹部領域のそれぞれの表面領域と重なるように配置された反射防止コーティングを有する、請求項30に記載のシステム。
- 前記凹部領域のそれぞれは、ドライまたはウェットエッチング、レーザ加工、音響加工、及び注型加工から選択された処理により形成された、請求項30に記載のシステム。
- 前記透明要素は、支持層に重なる第1の透明部材を有し、前記支持層は前記支持領域を含む、請求項30に記載のシステム。
- 前記支持層は第2の透明部材を有する、請求項30に記載のシステム。
- 前記結合処理は、少なくともプラズマ励起結合、共融結合、接着剤層または接着結合、溶接、陽極結合及び溶融結合から選択される、請求項30に記載のシステム。
- 前記透明要素は、0.1mmから1.2mmの範囲の厚さを有する、請求項30に記載のシステム。
- 前記チップのそれぞれは、前記対応する一つの凹部領域内の不活性雰囲気中に保持される、請求項30に記載のシステム。
- 前記不活性雰囲気は、窒素、アルゴン、または窒素及びアルゴンの混合物から選択される、請求項40に記載のシステム。
- 前記不活性雰囲気は減衰作用を有する、請求項41に記載のシステム。
- 前記不活性雰囲気は電気的切断を軽減する、請求項41に記載のシステム。
- 前記チップのそれぞれは、相互結合領域を有し、該相互結合領域は前記凹部領域の外側に配置される、請求項30に記載のシステム。
- 前記相互結合領域は、貫通孔を介して前記透明要素上に露出される、請求項44に記載のシステム。
- 前記相互結合領域は、複数の結合パッドを有する、請求項45に記載のシステム。
- 前記基板は含シリコン材料である、請求項30に記載のシステム。
- 前記基板はシリコンウェハである、請求項47に記載のシステム。
- 前記凹部領域のそれぞれは、第2の表面領域に結合された第1の表面領域を有し、前記第1の表面領域と前記第2の表面領域とは光学品質を有する、請求項30に記載のシステム。
- 前記第1の表面領域は、2μm×2μmの面積について、20nm以下の二乗平均表面粗度を有する、請求項49に記載のシステム。
- 前記凹部領域のそれぞれは、環状の形状を有する、請求項30に記載のシステム。
- 前記凹部領域のそれぞれは、0.5mmまたはこれより小さい深さを有する、請求項30に記載のシステム。
- 反射防止材料からなる前記コーティングは、前記第1の側面と前記第2の側面とにおいて、可視光の反射率を側面あたり2%より小さいように減少させる、請求項30に記載のシステム。
- 前記反射防止材料はMgF2から構成される、請求項30に記載のシステム。
- リードフレーム構造をさらに備え、
前記第1のストリート領域のそれぞれの一部を画線しかつ前記第2のストリート領域のそれぞれの一部を画線することにより、前記チップの少なくとも1つが切断され、
前記一つの対応する凹部領域内の前記チップの少なくとも1つがリードフレーム構造に装着され、
前記装着されたチップの一部が前記リードフレーム構造の一部に配線結合され、
前記装着されたチップの配線結合された部分と前記リードフレーム構造の一部とが封止されるとともに、封止材のない前記凹部領域上に規定される前記透明基板の表面領域が保持される、請求項30に記載のシステム。 - 前記凹部領域のそれぞれは光を排除する外周領域を有する、請求項30に記載のシステム。
- 前記凹部領域のそれぞれは、前記対応する一つの凹部領域に重なる開口領域を形成する、請求項30に記載のシステム。
- 前記複数のマイクロミラーデバイスの少なくとも1つは、複数の電荷結合デバイス、複数の変形デバイス、複数の感知デバイス及びICデバイスを有する、請求項30に記載のシステム。
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US9096424B2 (en) | 2009-05-11 | 2015-08-04 | Stmicroelectronics S.R.L. | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
US10555091B2 (en) | 2017-09-15 | 2020-02-04 | Stmicroelectronics S.R.L. | Method for manufacturing a thin filtering membrane and an acoustic transducer device including the filtering membrane |
US11317219B2 (en) | 2017-09-15 | 2022-04-26 | Stmicroelectronics S.R.L. | Method for manufacturing a thin filtering membrane and an acoustic transducer device including the filtering membrane |
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CN101202272A (zh) | 2008-06-18 |
US7671461B2 (en) | 2010-03-02 |
US7948000B2 (en) | 2011-05-24 |
US20070072328A1 (en) | 2007-03-29 |
DE102004051361A1 (de) | 2006-01-19 |
CN100454535C (zh) | 2009-01-21 |
GB2408145A (en) | 2005-05-18 |
US20070128818A1 (en) | 2007-06-07 |
US8022520B2 (en) | 2011-09-20 |
US8288851B2 (en) | 2012-10-16 |
CN101202272B (zh) | 2010-06-02 |
US20050101059A1 (en) | 2005-05-12 |
CN101183675B (zh) | 2010-06-09 |
KR20050039635A (ko) | 2005-04-29 |
US20110186839A1 (en) | 2011-08-04 |
CN101183675A (zh) | 2008-05-21 |
JP2005167209A (ja) | 2005-06-23 |
US7303645B2 (en) | 2007-12-04 |
US20070235852A1 (en) | 2007-10-11 |
TWI253182B (en) | 2006-04-11 |
US20060284295A1 (en) | 2006-12-21 |
US20080014682A1 (en) | 2008-01-17 |
CN101252122A (zh) | 2008-08-27 |
GB2408145B (en) | 2007-06-06 |
TW200525769A (en) | 2005-08-01 |
CN101252122B (zh) | 2012-01-25 |
GB0423507D0 (en) | 2004-11-24 |
CN1638115A (zh) | 2005-07-13 |
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