GB2454813B - High-volume on-wafer heterogeneous packaging of optical interconnects - Google Patents

High-volume on-wafer heterogeneous packaging of optical interconnects

Info

Publication number
GB2454813B
GB2454813B GB0821211A GB0821211A GB2454813B GB 2454813 B GB2454813 B GB 2454813B GB 0821211 A GB0821211 A GB 0821211A GB 0821211 A GB0821211 A GB 0821211A GB 2454813 B GB2454813 B GB 2454813B
Authority
GB
United Kingdom
Prior art keywords
volume
optical interconnects
wafer
heterogeneous packaging
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB0821211A
Other versions
GB2454813A (en
GB0821211D0 (en
Inventor
Edris Mohammed
Daoqiang Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of GB0821211D0 publication Critical patent/GB0821211D0/en
Publication of GB2454813A publication Critical patent/GB2454813A/en
Application granted granted Critical
Publication of GB2454813B publication Critical patent/GB2454813B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
GB0821211A 2007-11-21 2008-11-20 High-volume on-wafer heterogeneous packaging of optical interconnects Active GB2454813B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19497307A 2007-11-21 2007-11-21

Publications (3)

Publication Number Publication Date
GB0821211D0 GB0821211D0 (en) 2008-12-31
GB2454813A GB2454813A (en) 2009-05-20
GB2454813B true GB2454813B (en) 2010-06-09

Family

ID=40230557

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0821211A Active GB2454813B (en) 2007-11-21 2008-11-20 High-volume on-wafer heterogeneous packaging of optical interconnects

Country Status (1)

Country Link
GB (1) GB2454813B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9563028B2 (en) 2013-01-31 2017-02-07 Ccs Technology, Inc. Method to manufacture an optoelectronic assembly
EP3125008A1 (en) 2015-07-29 2017-02-01 CCS Technology Inc. Method to manufacture optoelectronic modules

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
US20040258110A1 (en) * 2003-06-18 2004-12-23 Photodigm, Inc. Packaging and passive alignment of microlens and molded receptacle
US20050094944A1 (en) * 2001-01-10 2005-05-05 Kia Silverbrook Optical fiber terminator package
US20060013542A1 (en) * 2002-03-08 2006-01-19 Infineon Technologies Ag Optoelectronic module and plug arrangement
US20060278821A1 (en) * 1998-11-25 2006-12-14 Rohm And Haas Electronic Materials Llc Optoelectronic component
US20060284295A1 (en) * 2003-10-24 2006-12-21 Miradia Inc. Method and system for hermetically sealing packages for optics

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278821A1 (en) * 1998-11-25 2006-12-14 Rohm And Haas Electronic Materials Llc Optoelectronic component
US20050094944A1 (en) * 2001-01-10 2005-05-05 Kia Silverbrook Optical fiber terminator package
US20060013542A1 (en) * 2002-03-08 2006-01-19 Infineon Technologies Ag Optoelectronic module and plug arrangement
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
US20040258110A1 (en) * 2003-06-18 2004-12-23 Photodigm, Inc. Packaging and passive alignment of microlens and molded receptacle
US20060284295A1 (en) * 2003-10-24 2006-12-21 Miradia Inc. Method and system for hermetically sealing packages for optics

Also Published As

Publication number Publication date
GB2454813A (en) 2009-05-20
GB0821211D0 (en) 2008-12-31

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