GB0821211D0 - High-volume on-wafer heterogeneous packaging of optical interconnects - Google Patents

High-volume on-wafer heterogeneous packaging of optical interconnects

Info

Publication number
GB0821211D0
GB0821211D0 GBGB0821211.0A GB0821211A GB0821211D0 GB 0821211 D0 GB0821211 D0 GB 0821211D0 GB 0821211 A GB0821211 A GB 0821211A GB 0821211 D0 GB0821211 D0 GB 0821211D0
Authority
GB
United Kingdom
Prior art keywords
volume
optical interconnects
wafer
heterogeneous packaging
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0821211.0A
Other versions
GB2454813B (en
GB2454813A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of GB0821211D0 publication Critical patent/GB0821211D0/en
Publication of GB2454813A publication Critical patent/GB2454813A/en
Application granted granted Critical
Publication of GB2454813B publication Critical patent/GB2454813B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
GB0821211A 2007-11-21 2008-11-20 High-volume on-wafer heterogeneous packaging of optical interconnects Active GB2454813B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19497307A 2007-11-21 2007-11-21

Publications (3)

Publication Number Publication Date
GB0821211D0 true GB0821211D0 (en) 2008-12-31
GB2454813A GB2454813A (en) 2009-05-20
GB2454813B GB2454813B (en) 2010-06-09

Family

ID=40230557

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0821211A Active GB2454813B (en) 2007-11-21 2008-11-20 High-volume on-wafer heterogeneous packaging of optical interconnects

Country Status (1)

Country Link
GB (1) GB2454813B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9563028B2 (en) 2013-01-31 2017-02-07 Ccs Technology, Inc. Method to manufacture an optoelectronic assembly
EP3125008A1 (en) 2015-07-29 2017-02-01 CCS Technology Inc. Method to manufacture optoelectronic modules

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7208725B2 (en) * 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
AUPR245701A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM10)
US7371012B2 (en) * 2002-03-08 2008-05-13 Infineon Technologies Ag Optoelectronic module and plug arrangement
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
US6999494B2 (en) * 2003-06-18 2006-02-14 Photodigm, Inc. Packaging and passive alignment of microlens and molded receptacle
US7303645B2 (en) * 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics

Also Published As

Publication number Publication date
GB2454813B (en) 2010-06-09
GB2454813A (en) 2009-05-20

Similar Documents

Publication Publication Date Title
FI3629011T3 (en) Integrated optical device
IL214090A0 (en) Ophthalmic lens precursor
GB0816308D0 (en) Optical module
GB2470419B (en) Outer lens for goggles
ZA201102246B (en) Accomodating intraocular lens
HK1142411A1 (en) Optical vortex retarder micro-array
EP2328502A4 (en) Foldable package
GB2463226B (en) Optical sub-assembly
EP2308101A4 (en) Semiconductor light converting construction
EP2327111A4 (en) Optical cup for lighting module
EP2453293A4 (en) Ophthalmic lens
AU331600S (en) Light device packaging
EP2308104A4 (en) Semiconductor light converting construction
EP2242152A4 (en) Optical module
GB0818822D0 (en) Reduction of stray light
GB2474108B (en) Optical module
HK1157020A1 (en) Optical lens
GB2461377B (en) Centrifuge cup
ZA201108940B (en) Wavelength specific silicon light emitting structure
PL2123976T3 (en) Recessed light
EP2317961A4 (en) Opthalmic lens capsule support
EP2256877A4 (en) Optical module
GB2454813B (en) High-volume on-wafer heterogeneous packaging of optical interconnects
EP2487525A4 (en) Optical body
EP2274805A4 (en) Dual diode converging module