JP5029372B2 - 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法 - Google Patents

異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法 Download PDF

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Publication number
JP5029372B2
JP5029372B2 JP2008002485A JP2008002485A JP5029372B2 JP 5029372 B2 JP5029372 B2 JP 5029372B2 JP 2008002485 A JP2008002485 A JP 2008002485A JP 2008002485 A JP2008002485 A JP 2008002485A JP 5029372 B2 JP5029372 B2 JP 5029372B2
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Japan
Prior art keywords
circuit
anisotropic conductive
conductive adhesive
connection
film
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JP2008002485A
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Japanese (ja)
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JP2009088465A (ja
JP2009088465A5 (enExample
Inventor
貢 藤縄
猛 堀内
正寿 松下
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008002485A priority Critical patent/JP5029372B2/ja
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Publication of JP2009088465A5 publication Critical patent/JP2009088465A5/ja
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  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
JP2008002485A 2007-09-14 2008-01-09 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法 Active JP5029372B2 (ja)

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JP2008002485A JP5029372B2 (ja) 2007-09-14 2008-01-09 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007239328 2007-09-14
JP2007239328 2007-09-14
JP2008002485A JP5029372B2 (ja) 2007-09-14 2008-01-09 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法

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JP2009088465A JP2009088465A (ja) 2009-04-23
JP2009088465A5 JP2009088465A5 (enExample) 2010-12-09
JP5029372B2 true JP5029372B2 (ja) 2012-09-19

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5742161B2 (ja) * 2009-10-08 2015-07-01 デクセリアルズ株式会社 離型剤組成物、離型フィルム及び粘着フィルム
JP2011233609A (ja) * 2010-04-26 2011-11-17 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板の接続構造及びそれを備えた電子機器
JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
JP5975930B2 (ja) * 2013-04-16 2016-08-23 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6238655B2 (ja) 2013-09-12 2017-11-29 デクセリアルズ株式会社 接続構造体、及び異方性導電接着剤
KR102183420B1 (ko) * 2013-09-17 2020-11-27 엘지디스플레이 주식회사 필름 제조 방법
KR101737173B1 (ko) * 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
JP2020088146A (ja) * 2018-11-26 2020-06-04 トヨタ自動車株式会社 回路基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JPH08255958A (ja) * 1995-03-15 1996-10-01 Seiko Epson Corp フレキシブル基板及びその接続構造及びその接続方法
JP4054268B2 (ja) * 2003-03-03 2008-02-27 富士フイルム株式会社 感光性平版印刷版
JP4534716B2 (ja) * 2004-10-26 2010-09-01 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造体及び接続方法

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