JP5025609B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

Info

Publication number
JP5025609B2
JP5025609B2 JP2008244333A JP2008244333A JP5025609B2 JP 5025609 B2 JP5025609 B2 JP 5025609B2 JP 2008244333 A JP2008244333 A JP 2008244333A JP 2008244333 A JP2008244333 A JP 2008244333A JP 5025609 B2 JP5025609 B2 JP 5025609B2
Authority
JP
Japan
Prior art keywords
chamber
processing
inner chamber
disposed
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2008244333A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008306223A5 (enExample
JP2008306223A (ja
Inventor
昭孝 牧野
洋二 高橋
稔 空岡
秀樹 木原
勤 田内
勇造 大平原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008244333A priority Critical patent/JP5025609B2/ja
Publication of JP2008306223A publication Critical patent/JP2008306223A/ja
Publication of JP2008306223A5 publication Critical patent/JP2008306223A5/ja
Application granted granted Critical
Publication of JP5025609B2 publication Critical patent/JP5025609B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Drying Of Semiconductors (AREA)
JP2008244333A 2003-09-04 2008-09-24 真空処理装置 Expired - Lifetime JP5025609B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008244333A JP5025609B2 (ja) 2003-09-04 2008-09-24 真空処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003313200 2003-09-04
JP2003313200 2003-09-04
JP2008244333A JP5025609B2 (ja) 2003-09-04 2008-09-24 真空処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004258568A Division JP4522795B2 (ja) 2003-09-04 2004-09-06 真空処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012086184A Division JP5415583B2 (ja) 2003-09-04 2012-04-05 真空処理装置

Publications (3)

Publication Number Publication Date
JP2008306223A JP2008306223A (ja) 2008-12-18
JP2008306223A5 JP2008306223A5 (enExample) 2009-07-02
JP5025609B2 true JP5025609B2 (ja) 2012-09-12

Family

ID=40234592

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008244333A Expired - Lifetime JP5025609B2 (ja) 2003-09-04 2008-09-24 真空処理装置
JP2010025804A Expired - Fee Related JP5215332B2 (ja) 2003-09-04 2010-02-08 真空処理装置
JP2012086184A Expired - Lifetime JP5415583B2 (ja) 2003-09-04 2012-04-05 真空処理装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2010025804A Expired - Fee Related JP5215332B2 (ja) 2003-09-04 2010-02-08 真空処理装置
JP2012086184A Expired - Lifetime JP5415583B2 (ja) 2003-09-04 2012-04-05 真空処理装置

Country Status (1)

Country Link
JP (3) JP5025609B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142612A (ja) * 2003-09-04 2012-07-26 Hitachi High-Technologies Corp 真空処理装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5206730B2 (ja) 2010-04-28 2013-06-12 株式会社デンソー 触媒通電制御装置
JP6101504B2 (ja) * 2013-02-14 2017-03-22 株式会社日立ハイテクノロジーズ 真空処理装置のモジュール検査装置
JP6463220B2 (ja) * 2015-05-21 2019-01-30 東京エレクトロン株式会社 処理システム
JP6557523B2 (ja) * 2015-06-19 2019-08-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6650841B2 (ja) * 2016-06-27 2020-02-19 東京エレクトロン株式会社 基板昇降機構、基板載置台および基板処理装置
JP6775432B2 (ja) * 2017-01-24 2020-10-28 Ｓｐｐテクノロジーズ株式会社 真空搬送モジュール及び基板処理装置
JP6750928B2 (ja) * 2019-03-01 2020-09-02 株式会社日立ハイテク 真空処理装置
CN112826969B (zh) * 2021-03-09 2025-01-10 军事科学院系统工程研究院卫勤保障技术研究所 一种箱仪一体式化学喷淋洗消装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160031A (ja) * 1991-12-03 1993-06-25 Kokusai Electric Co Ltd Ｃｖｄ装置
JPH0878392A (ja) * 1994-09-02 1996-03-22 Mitsubishi Electric Corp プラズマ処理装置及び半導体ウエハの成膜加工方法
EP0823491B1 (en) * 1996-08-07 2002-02-27 Concept Systems Design Inc. Gas injection system for CVD reactors
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
JP4209539B2 (ja) * 1999-04-21 2009-01-14 東京エレクトロン株式会社 処理装置
JP5025609B2 (ja) * 2003-09-04 2012-09-12 株式会社日立ハイテクノロジーズ 真空処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142612A (ja) * 2003-09-04 2012-07-26 Hitachi High-Technologies Corp 真空処理装置

Also Published As

Publication number Publication date
JP2012142612A (ja) 2012-07-26
JP2010103575A (ja) 2010-05-06
JP5415583B2 (ja) 2014-02-12
JP2008306223A (ja) 2008-12-18
JP5215332B2 (ja) 2013-06-19

Similar Documents

Publication Publication Date Title
JP4246654B2 (ja) 真空処理装置
JP4426343B2 (ja) プラズマ処理装置
JP5415583B2 (ja) 真空処理装置
US7247207B2 (en) Vacuum processing apparatus
JP4522795B2 (ja) 真空処理装置
US8740011B2 (en) Vacuum processing apparatus
JP2006080347A (ja) プラズマ処理装置
JP5596265B2 (ja) 真空処理装置
JP4426342B2 (ja) 真空処理装置
JP4723559B2 (ja) プラズマ処理装置
JP5282008B2 (ja) 真空処理装置
JP5260981B2 (ja) 真空処理装置
JP4814384B2 (ja) 弁体
JP4588393B2 (ja) 真空処理装置
JP2005150173A (ja) 真空処理装置
JP5336452B2 (ja) 真空処理装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080924

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090514

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110510

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110711

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110830

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111129

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120405

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120619

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120619

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150629

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5025609

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term