JP5008111B2 - 連続鋳造鋳型を電解コーティングする方法 - Google Patents

連続鋳造鋳型を電解コーティングする方法 Download PDF

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Publication number
JP5008111B2
JP5008111B2 JP2004507003A JP2004507003A JP5008111B2 JP 5008111 B2 JP5008111 B2 JP 5008111B2 JP 2004507003 A JP2004507003 A JP 2004507003A JP 2004507003 A JP2004507003 A JP 2004507003A JP 5008111 B2 JP5008111 B2 JP 5008111B2
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Japan
Prior art keywords
mold
mold cavity
electrode
coating
electrolyte
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Expired - Fee Related
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JP2004507003A
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English (en)
Japanese (ja)
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JP2005527705A (ja
JP2005527705A5 (fr
Inventor
シュティリ，アイドリアン
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コンカスト アクチェンゲゼルシャフト
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
    • B22D11/059—Mould materials or platings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Continuous Casting (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Mold Materials And Core Materials (AREA)
JP2004507003A 2002-05-27 2003-05-19 連続鋳造鋳型を電解コーティングする方法 Expired - Fee Related JP5008111B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH8762002 2002-05-27
CH20020876/02 2002-05-27
PCT/EP2003/005238 WO2003099490A1 (fr) 2002-05-27 2003-05-19 Procede d'enduction galvanique d'une coquille pour la coulee continue

Publications (3)

Publication Number Publication Date
JP2005527705A JP2005527705A (ja) 2005-09-15
JP2005527705A5 JP2005527705A5 (fr) 2006-05-18
JP5008111B2 true JP5008111B2 (ja) 2012-08-22

Family

ID=29555531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004507003A Expired - Fee Related JP5008111B2 (ja) 2002-05-27 2003-05-19 連続鋳造鋳型を電解コーティングする方法

Country Status (13)

Country Link
EP (1) EP1507612B1 (fr)
JP (1) JP5008111B2 (fr)
KR (1) KR101082896B1 (fr)
CN (1) CN100335200C (fr)
AU (1) AU2003236679B2 (fr)
BR (1) BR0311374B1 (fr)
CA (1) CA2504369C (fr)
ES (1) ES2452727T3 (fr)
MX (1) MXPA04011734A (fr)
PL (1) PL206254B1 (fr)
RU (1) RU2318631C2 (fr)
WO (1) WO2003099490A1 (fr)
ZA (1) ZA200408991B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US7329334B2 (en) * 2004-09-16 2008-02-12 Herdman Roderick D Controlling the hardness of electrodeposited copper coatings by variation of current profile
EP1849181A4 (fr) * 2005-01-21 2009-03-18 Microcontinuum Inc Outils de replication et appareil et procedes de fabrication correspondants
EA008676B1 (ru) * 2005-08-22 2007-06-29 Республиканское Унитарное Предприятие "Белорусский Металлургический Завод" Способ нанесения двухслойного гальванического покрытия на медные гильзы и плиты кристаллизаторов
WO2007100849A2 (fr) 2006-02-27 2007-09-07 Microcontinuum, Inc. Formation d'outils de reproduction de motifs
DE102006037728A1 (de) * 2006-08-11 2008-02-14 Sms Demag Ag Kokille zum Stranggießen von flüssigem Metall, insbesondere von Stahlwerkstoffen
DE202009013126U1 (de) 2009-09-29 2009-12-10 Egon Evertz Kg (Gmbh & Co.) Kokille zum Stranggießen
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
CN107034497A (zh) * 2017-04-28 2017-08-11 长安大学 一种用于油井管接箍内表面的电镀装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51116123A (en) * 1975-04-04 1976-10-13 Pioneer Electronic Corp Electrocasting mold drawing method
DE2936177A1 (de) * 1979-09-07 1981-05-21 Evertz, Egon, 5650 Solingen Verfahren und vorrichtung zur behandlung von kokillenwaenden
JPS5647592A (en) * 1979-09-25 1981-04-30 Satoosen:Kk Plating method of inner surface of casting mold for continuous casting
JPS5937704B2 (ja) * 1980-06-02 1984-09-11 川崎製鉄株式会社 連続鋳造用鋳型の製造法
JPS60145247A (ja) * 1983-12-29 1985-07-31 Kawasaki Steel Corp 連続鋳造用鋳型とその製造方法
JPS63104752A (ja) * 1986-10-22 1988-05-10 Sumitomo Metal Ind Ltd 連続鋳造用鋳型の表面処理方法
JPH0222495A (ja) * 1988-07-11 1990-01-25 Mitsubishi Heavy Ind Ltd 連続鋳造用モールドのメッキ方法
JPH02149696A (ja) * 1988-11-30 1990-06-08 Kawasaki Steel Corp 電気めっきにおける板エッジ部でのめっき付着量の制御方法
JPH071086A (ja) * 1993-06-15 1995-01-06 Daido Steel Co Ltd 銅製鋳造モールドの補修方法
JPH07118889A (ja) * 1993-09-02 1995-05-09 Yamaha Motor Co Ltd めっき液、めっき方法及び内面めっきエンジンシリンダ
US5516415A (en) * 1993-11-16 1996-05-14 Ontario Hydro Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
JP3333025B2 (ja) * 1993-12-08 2002-10-07 日本パーカライジング株式会社 金属材料の電気複合めっき方法および装置
JPH07169714A (ja) * 1993-12-15 1995-07-04 Casio Comput Co Ltd メッキ方法およびその装置
TW318320B (fr) * 1995-08-07 1997-10-21 Eltech Systems Corp
FR2750438B1 (fr) * 1996-06-27 1998-08-07 Usinor Sacilor Procede et installation de revetement electrolytique par une couche metallique de la surface d'un cylindre pour coulee continue de bandes metalliques minces
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
JP3375549B2 (ja) * 1998-09-29 2003-02-10 本田技研工業株式会社 筒状部材の複合メッキ方法
FR2806098B1 (fr) * 2000-03-09 2002-08-16 Usinor Dispositif d'electrodeposition d'une piece metallique annulaire de forme complexe

Also Published As

Publication number Publication date
CN100335200C (zh) 2007-09-05
KR20050004877A (ko) 2005-01-12
JP2005527705A (ja) 2005-09-15
CA2504369A1 (fr) 2003-12-04
ZA200408991B (en) 2007-08-29
KR101082896B1 (ko) 2011-11-11
CA2504369C (fr) 2008-11-18
MXPA04011734A (es) 2005-11-04
PL371684A1 (en) 2005-06-27
BR0311374B1 (pt) 2011-08-23
WO2003099490A1 (fr) 2003-12-04
EP1507612B1 (fr) 2013-12-11
RU2004138096A (ru) 2005-06-10
RU2318631C2 (ru) 2008-03-10
CN1655893A (zh) 2005-08-17
ES2452727T3 (es) 2014-04-02
AU2003236679B2 (en) 2008-08-28
AU2003236679A1 (en) 2003-12-12
BR0311374A (pt) 2005-03-15
PL206254B1 (pl) 2010-07-30
EP1507612A1 (fr) 2005-02-23

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