CN100335200C - 电镀连续铸型的方法 - Google Patents
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
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- B22D11/059—Mould materials or platings
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Abstract
在电镀连续铸型(2)的工艺中,界定型腔(3)的连续铸型(2)内表面(4)被镀上一种镀层材料以达到或重新达到预定的型腔尺寸。连续铸型(2)作阴极,阳极位于型腔(3)中并使用一种含镀层材料的电解质(25)。充当镀层材料载体的电解质(25)以可控的方式流过连续铸型(2)的型腔(3)。在电镀中,只有型腔的内表面与电解质发生接触,因此型腔的外表面不必覆盖。机械性能可以在整个区域内保持均匀。镀层的获得比使用传统的工艺更快。
Description
本发明涉及一种用于电镀连续铸型的方法。
连续铸型在铸造时经受到不断的磨损,使得型腔并从而使得连续铸坯的截面尺寸不断变大。因此,在一定数量的工作循环之后,所述连续铸型必须更新或再加工。
为使型腔恢复原始几何形状或预定的尺寸,已知有许多再加工铸型的方法。例如,可以通过在心轴上爆炸形成铸型来完成再加工。这种方法不仅比较复杂、昂贵和污染环境,还意味着铸型外形的变形,而这又牵涉到膜周围的水隙的扩大并从而对铸型的冷却造成负面影响。其它已知的用于铸型再成形的挤压工艺,其中首先从外面挤压铸型,然后通过内圆磨削或内面铣切使型腔恢复原始内部尺寸,也具有上述后者缺陷。
最后,从EP-A-0 282 759中知道了通过电镀界定型腔的内表面来使铸型的型腔恢复到预定尺寸。在此类工艺中,充当阴极的铸型与位于型腔中装有可溶性铜碎片(立方体、球、圆盘)的多孔阳极篮一起浸在电解质浴(硫酸铜浴)中。当连通直流电时,铜从电解质浴中分离出来沉积在铸型表面,从电解质浴中分离出来的铜被溶解的阳极铜取代。在此浸镀电解过程中,达到了一个较低的电流密度,例如约15A/dm2。凭经验,在电解浸镀横截面通常为多边形的型腔的情况下,在角落区域会有层的厚度不足即层厚仅为其它区域层厚的约1/4到1/10的危险。这种不均匀的层构造用特殊的阳极形状也只能部分修补。这意味着必须进行进一步的机械再加工。
随着厚镀层的产生又进一步有了形成带封闭腔的角落桥结果使铸型变得不可用的危险。电解浸镀的另一个缺陷是铸型的外表面必须用对电解处理呈惰性的材料覆盖。
本发明的目的在于提出一种上述类型的工艺,通过该工艺即使是在具有多边形横截面型腔的连续铸型中也可以尽可能简单地达到或重新达到预定的型腔尺寸,而不会在型腔的角落区域产生问题区。此外,所要镀覆的连续铸型应尽可能地保持其外部尺寸不变。
根据本发明,此目的是通过一种用于电镀连续铸型的工艺实现的。
本发明的优选进一步实施方案构成从属权利要求的主题。
使用根据本发明所述的工艺,其中使用一种可溶性阳极,电解质以一种水力可控方式流过构成阴极的连续铸型型腔,电解质独自提供镀层材料,由于层构造均匀没有角落缺陷,就既可以提供一种薄的尺寸精确的抗磨材料镀层而无需再加工,又可以提供一种厚镀层(用它至多只需要极少的再加工)。根据本发明所述的工艺的一个重要优点是在电镀期间只有型腔的内表面与电解质发生接触,因此连续铸型的外表面不必非要覆盖。此外,间歇的阳/阴极反转也成为可能,从而可以实现镀层材料的脉冲沉积并影响镀覆。
应当强调的一个优点是,镀层的机械性能,例如硬度,和特别是结构组成在整个区域内可以保持基本一致。镀层的获得比使用传统工艺快。还可以在很大程度上防止镀层表面上的软骨组织。
下面借助于附图对本发明进行更详细的说明。
在附图中:
图1是根据本发明所述工艺的示意图。
图1以纯示意的方式显示了一个设计用来对界定连续铸型2的型腔3的内表面4电镀一种抗磨镀层材料,以获得或重新获得预定的型腔尺寸的装置1。型腔3可以具有例如长方形或正方形的横截面并从而被四个内表面4界定。不过铸型还可以具有其它型腔横截面(例如环形、多边形、纵向角)或是所谓的八字试块铸型。
连续铸型2的表面设有通过贯穿型腔3的阳极7连接在一起的顶片和底片5、6。连续铸型2表面上的密封件8、9将型腔3密封起来。阳极7同样以密封方式插在顶片和底片5、6中,见封口13、14。底片6和顶片5各自都分别具有至少一个、优选多个开口11和12(在图1中每个只显示了一个开口11、12),它们构成将用来电镀的电解质25引入或排出在其它方面都密闭的构成反应器空间的型腔3的入口或排出孔。借助于泵16以一种水力可控方式将所述电解质从储液容器15由底部穿过底片6泵入反应器空间,并随着溢出(无压力)顶片5返回储液容器15和泵16。镀层材料以氧化物形式从容器18计量加入电解质25中。
为进行电镀,连续铸型2作为阴极与标明了翼7’的阳极7可以与直流源20连通从而形成一个直流回路。密封件8、9或封口13、14都同时具有电绝缘作用。阳极的横截面形状与型腔3的横截面形状相配。对于多边形型腔,使用相应的棱柱形阳极。阳极特别由镀铂或镀混合陶瓷的钛材料或由铅制成。还可以构造成不溶性阳极。不过原则上阳极中也可含有镀层材料,例如铜、镍或铬,而在这种情况下,它是块状或片状的。
根据本发明所述的工艺适于施加例如铜、镍或铬层。镀层材料由电解质25单独提供。阳极本身是不溶性的。阳极可以为例如镀铂的钛阳极、Pb板阳极、镀覆的混合陶瓷和其它材料。电解质可以使用甲磺酸、氰化物或硫酸类型的电解质。使用这些高速电解质,在强烈搅拌电解质的情况下可以达到2-40A/dm2的电流密度。通过有效地水力控制电解质流过反应器空间,由于层构造很均匀且没有角落缺陷,就既可能尺寸精确地施加抗磨材料薄层而无需进行再加工,又可能施加厚镀层(用它最多只需要极少的再加工)。根据本发明所述的工艺带来了很多重要优点,特别是在镀铬中,因为正是在传统的电镀铬中会发生严重的角落问题(层的厚度比表面处薄5-10倍),且铬只能通过研磨来再加工。
用本发明所述的工艺还可以实现脉冲沉积镀层材料,其中电解质25单独提供镀层材料,因为除水力控制之外,还可进行间歇的阳/阴极逆转,并可影响涂镀。
根据本发明所述的工艺的一个重要优点在于,在电镀时只有型腔的内表面与电解质25发生接触,因此不必覆盖连续铸型的外表面。
阳极和/或连续铸型原则上可以绕其纵轴旋转地构造,因此就有可能在镀覆时旋转并从而得到改进的镀层。
在涂镀前,连续铸型2通过冲洗过程特别是阶式冲洗进行清洗,对此不进一步详述。连续铸型2在镀覆时和优选在上述冲洗时结合在一个封闭的系统中。
连续铸型由金属材料或复合材料,如铜、铝或镍,或由塑料或复合塑料或陶瓷材料或其它材料制成。
此外还可以提供一个整流装置,通过它可以逆转电流方向以获得均匀的镀层。
此外如果用铜作镀层材料,可以预先使用可商购的氧化铜,其中通过洗涤/溶解过程来降低其过高的氯含量。
或者,连续铸型2可以只在某些区域镀覆或在这些区域镀得更厚,即层的厚度更大,运行中在这些区域发生的磨损程度相对更高,例如在浴槽的表面区域,特别是由于罩面材料的原因会发生额外的磨损。由此可以获得有效的镀层。这种部分镀覆可以通过部分覆盖阳极或插入非导电屏障或通过类似的手段来实现。
在电镀进行中,可以用未进一步示出的磁铁产生电磁场,由此可以导引或指引镀层材料的粒子,使得在某些区域、优选在连续铸型的边缘区域沉积与其它区域厚度相同的层。
上面的陈述对本发明进行了充分说明。当然也可以以其它变体进行说明。
Claims (13)
1.一种用于电镀连续铸型(2)的工艺,其中界定型腔(3)的连续铸型(2)内表面(4)被镀上一种镀层材料以达到或重新达到预定的型腔尺寸,连续铸型(2)用作阴极,阳极(7)位于型腔(3)中并使用一种含镀层材料的电解质(25),该工艺特征在于充当镀层材料载体的电解质(25)以可控的方式流过连续铸型(2)的型腔(3),还在于通过具有换极功能的整流装置周期性地改变电流的方向,并通过相应地选择此周期变化用这种方法获得了均匀的镀层。
2.根据权利要求1所述的工艺,特征在于用铜、镍或铬作镀层材料,且在每种情况下都以氧化物形式计量加入电解质(25)中。
3.根据权利要求1或2所述的工艺,特征在于使用含甲磺酸、氰化物或硫酸的电解质(25)。
4.根据权利要求1或2所述的工艺,特征在于不可溶的阳极(7)镀有铂或混合陶瓷或由铅制成。
5.根据权利要求1或2所述的工艺,特征在于电解质(25)通过泵(16)泵入被型腔(3)的内表面(4)包围并在表面处被底片和顶片(6、5)封闭的反应器空间中,并从中返回泵(16)。
6.根据权利要求1或2所述的工艺,特征在于阳极(7)和/或连续铸型(2)可绕其纵轴旋转构造,因此使得可在镀覆时进行旋转。
7.根据权利要求1或2所述的工艺,特征在于在涂镀前,对连续铸型(2)通过冲洗过程进行清洗。
8.根据权利要求1或2所述的工艺,特征在于连续铸型(2)结合在一个封闭的系统中,以进行镀覆和进行冲洗。
9.根据权利要求1或2所述的工艺,特征在于连续铸型(2)由金属材料或复合材料制成。
10.根据权利要求1所述的工艺,特征在于如果使用铜作为镀层材料,预先使用可商购的氧化铜,其中通过洗涤/溶解过程来降低其过高的氯含量。
11.根据权利要求1或2所述的工艺,特征在于连续铸型(2)只在某些运行中会发生更高磨损的区域镀覆或镀得更厚。
12.根据权利要求1所述的工艺,特征在于镀层材料铜、镍或铬用作阳极。
13.根据权利要求1或2所述的工艺,特征在于在电镀过程中镀层材料的粒子受电磁场导引,以在型腔的不同区域中调控沉积层的厚度。
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EP (1) | EP1507612B1 (zh) |
JP (1) | JP5008111B2 (zh) |
KR (1) | KR101082896B1 (zh) |
CN (1) | CN100335200C (zh) |
AU (1) | AU2003236679B2 (zh) |
BR (1) | BR0311374B1 (zh) |
CA (1) | CA2504369C (zh) |
ES (1) | ES2452727T3 (zh) |
MX (1) | MXPA04011734A (zh) |
PL (1) | PL206254B1 (zh) |
RU (1) | RU2318631C2 (zh) |
WO (1) | WO2003099490A1 (zh) |
ZA (1) | ZA200408991B (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9039401B2 (en) | 2006-02-27 | 2015-05-26 | Microcontinuum, Inc. | Formation of pattern replicating tools |
US9307648B2 (en) | 2004-01-21 | 2016-04-05 | Microcontinuum, Inc. | Roll-to-roll patterning of transparent and metallic layers |
US7329334B2 (en) * | 2004-09-16 | 2008-02-12 | Herdman Roderick D | Controlling the hardness of electrodeposited copper coatings by variation of current profile |
US8062495B2 (en) * | 2005-01-21 | 2011-11-22 | Microcontinuum, Inc. | Replication tools and related fabrication methods and apparatus |
EA008676B1 (ru) * | 2005-08-22 | 2007-06-29 | Республиканское Унитарное Предприятие "Белорусский Металлургический Завод" | Способ нанесения двухслойного гальванического покрытия на медные гильзы и плиты кристаллизаторов |
DE102006037728A1 (de) * | 2006-08-11 | 2008-02-14 | Sms Demag Ag | Kokille zum Stranggießen von flüssigem Metall, insbesondere von Stahlwerkstoffen |
DE202009013126U1 (de) | 2009-09-29 | 2009-12-10 | Egon Evertz Kg (Gmbh & Co.) | Kokille zum Stranggießen |
US9589797B2 (en) | 2013-05-17 | 2017-03-07 | Microcontinuum, Inc. | Tools and methods for producing nanoantenna electronic devices |
CN107034497A (zh) * | 2017-04-28 | 2017-08-11 | 长安大学 | 一种用于油井管接箍内表面的电镀装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS571543A (en) * | 1980-06-02 | 1982-01-06 | Kawasaki Steel Corp | Production of mold for continuous casting |
JPS60145247A (ja) * | 1983-12-29 | 1985-07-31 | Kawasaki Steel Corp | 連続鋳造用鋳型とその製造方法 |
JPS63104752A (ja) * | 1986-10-22 | 1988-05-10 | Sumitomo Metal Ind Ltd | 連続鋳造用鋳型の表面処理方法 |
US5496463A (en) * | 1993-12-08 | 1996-03-05 | Nihon Parkerizing Co., Ltd. | Process and apparatus for composite electroplating a metallic material |
FR2806098A1 (fr) * | 2000-03-09 | 2001-09-14 | Usinor | Dispositif d'electrodeposition d'une piece metallique annulaire de forme complexe |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51116123A (en) * | 1975-04-04 | 1976-10-13 | Pioneer Electronic Corp | Electrocasting mold drawing method |
DE2936177A1 (de) * | 1979-09-07 | 1981-05-21 | Evertz, Egon, 5650 Solingen | Verfahren und vorrichtung zur behandlung von kokillenwaenden |
JPS5647592A (en) * | 1979-09-25 | 1981-04-30 | Satoosen:Kk | Plating method of inner surface of casting mold for continuous casting |
JPH0222495A (ja) * | 1988-07-11 | 1990-01-25 | Mitsubishi Heavy Ind Ltd | 連続鋳造用モールドのメッキ方法 |
JPH02149696A (ja) * | 1988-11-30 | 1990-06-08 | Kawasaki Steel Corp | 電気めっきにおける板エッジ部でのめっき付着量の制御方法 |
JPH071086A (ja) * | 1993-06-15 | 1995-01-06 | Daido Steel Co Ltd | 銅製鋳造モールドの補修方法 |
JPH07118889A (ja) * | 1993-09-02 | 1995-05-09 | Yamaha Motor Co Ltd | めっき液、めっき方法及び内面めっきエンジンシリンダ |
US5516415A (en) * | 1993-11-16 | 1996-05-14 | Ontario Hydro | Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube |
JPH07169714A (ja) * | 1993-12-15 | 1995-07-04 | Casio Comput Co Ltd | メッキ方法およびその装置 |
TW318320B (zh) * | 1995-08-07 | 1997-10-21 | Eltech Systems Corp | |
FR2750438B1 (fr) * | 1996-06-27 | 1998-08-07 | Usinor Sacilor | Procede et installation de revetement electrolytique par une couche metallique de la surface d'un cylindre pour coulee continue de bandes metalliques minces |
US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
JP3375549B2 (ja) * | 1998-09-29 | 2003-02-10 | 本田技研工業株式会社 | 筒状部材の複合メッキ方法 |
-
2003
- 2003-05-19 ES ES03735416.4T patent/ES2452727T3/es not_active Expired - Lifetime
- 2003-05-19 EP EP03735416.4A patent/EP1507612B1/de not_active Expired - Lifetime
- 2003-05-19 RU RU2004138096/02A patent/RU2318631C2/ru not_active IP Right Cessation
- 2003-05-19 JP JP2004507003A patent/JP5008111B2/ja not_active Expired - Fee Related
- 2003-05-19 PL PL371684A patent/PL206254B1/pl unknown
- 2003-05-19 CN CNB038124483A patent/CN100335200C/zh not_active Expired - Fee Related
- 2003-05-19 MX MXPA04011734A patent/MXPA04011734A/es active IP Right Grant
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- 2003-05-19 KR KR1020047019176A patent/KR101082896B1/ko not_active IP Right Cessation
- 2003-05-19 AU AU2003236679A patent/AU2003236679B2/en not_active Ceased
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- 2003-05-19 WO PCT/EP2003/005238 patent/WO2003099490A1/de active Application Filing
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS571543A (en) * | 1980-06-02 | 1982-01-06 | Kawasaki Steel Corp | Production of mold for continuous casting |
JPS60145247A (ja) * | 1983-12-29 | 1985-07-31 | Kawasaki Steel Corp | 連続鋳造用鋳型とその製造方法 |
JPS63104752A (ja) * | 1986-10-22 | 1988-05-10 | Sumitomo Metal Ind Ltd | 連続鋳造用鋳型の表面処理方法 |
US5496463A (en) * | 1993-12-08 | 1996-03-05 | Nihon Parkerizing Co., Ltd. | Process and apparatus for composite electroplating a metallic material |
FR2806098A1 (fr) * | 2000-03-09 | 2001-09-14 | Usinor | Dispositif d'electrodeposition d'une piece metallique annulaire de forme complexe |
Also Published As
Publication number | Publication date |
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EP1507612B1 (de) | 2013-12-11 |
AU2003236679B2 (en) | 2008-08-28 |
CA2504369C (en) | 2008-11-18 |
RU2318631C2 (ru) | 2008-03-10 |
BR0311374A (pt) | 2005-03-15 |
JP5008111B2 (ja) | 2012-08-22 |
KR20050004877A (ko) | 2005-01-12 |
BR0311374B1 (pt) | 2011-08-23 |
CN1655893A (zh) | 2005-08-17 |
RU2004138096A (ru) | 2005-06-10 |
MXPA04011734A (es) | 2005-11-04 |
JP2005527705A (ja) | 2005-09-15 |
PL371684A1 (en) | 2005-06-27 |
WO2003099490A1 (de) | 2003-12-04 |
ZA200408991B (en) | 2007-08-29 |
AU2003236679A1 (en) | 2003-12-12 |
KR101082896B1 (ko) | 2011-11-11 |
EP1507612A1 (de) | 2005-02-23 |
CA2504369A1 (en) | 2003-12-04 |
PL206254B1 (pl) | 2010-07-30 |
ES2452727T3 (es) | 2014-04-02 |
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