JP4990160B2 - 基板を処理するクラスタツールアーキテクチャ - Google Patents
基板を処理するクラスタツールアーキテクチャ Download PDFInfo
- Publication number
- JP4990160B2 JP4990160B2 JP2007548551A JP2007548551A JP4990160B2 JP 4990160 B2 JP4990160 B2 JP 4990160B2 JP 2007548551 A JP2007548551 A JP 2007548551A JP 2007548551 A JP2007548551 A JP 2007548551A JP 4990160 B2 JP4990160 B2 JP 4990160B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- robot
- processing chamber
- assembly
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63910904P | 2004-12-22 | 2004-12-22 | |
US60/639,109 | 2004-12-22 | ||
US11/112,932 | 2005-04-22 | ||
US11/112,281 | 2005-04-22 | ||
US11/112,281 US7357842B2 (en) | 2004-12-22 | 2005-04-22 | Cluster tool architecture for processing a substrate |
US11/112,932 US20060134330A1 (en) | 2004-12-22 | 2005-04-22 | Cluster tool architecture for processing a substrate |
PCT/US2005/046877 WO2006069341A2 (fr) | 2004-12-22 | 2005-12-21 | Architecture d'un outil multiple de traitement de substrats |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011224043A Division JP2012069957A (ja) | 2004-12-22 | 2011-10-11 | 基板を処理するクラスタツールアーキテクチャ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008526032A JP2008526032A (ja) | 2008-07-17 |
JP2008526032A5 JP2008526032A5 (fr) | 2008-08-28 |
JP4990160B2 true JP4990160B2 (ja) | 2012-08-01 |
Family
ID=36147070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007548551A Expired - Fee Related JP4990160B2 (ja) | 2004-12-22 | 2005-12-21 | 基板を処理するクラスタツールアーキテクチャ |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1842225A2 (fr) |
JP (1) | JP4990160B2 (fr) |
KR (1) | KR101006685B1 (fr) |
WO (1) | WO2006069341A2 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4685584B2 (ja) | 2005-03-11 | 2011-05-18 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP5283842B2 (ja) * | 2006-12-18 | 2013-09-04 | キヤノン株式会社 | 処理装置 |
US8636458B2 (en) * | 2007-06-06 | 2014-01-28 | Asml Netherlands B.V. | Integrated post-exposure bake track |
JP5267691B2 (ja) * | 2012-02-15 | 2013-08-21 | 東京エレクトロン株式会社 | 塗布、現像装置、その方法及び記憶媒体 |
US9543186B2 (en) | 2013-02-01 | 2017-01-10 | Applied Materials, Inc. | Substrate support with controlled sealing gap |
KR102037900B1 (ko) * | 2017-11-10 | 2019-10-29 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
US20200194297A1 (en) * | 2018-12-14 | 2020-06-18 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Track system and method of processing semiconductor wafers |
US11413767B2 (en) | 2019-10-29 | 2022-08-16 | Applied Materials, Inc. | Sensor-based position and orientation feedback of robot end effector with respect to destination chamber |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3650495B2 (ja) * | 1995-12-12 | 2005-05-18 | 東京エレクトロン株式会社 | 半導体処理装置、その基板交換機構及び基板交換方法 |
JP3816929B2 (ja) * | 1995-12-12 | 2006-08-30 | 東京エレクトロン株式会社 | 半導体処理装置 |
TW318258B (fr) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
US6176667B1 (en) | 1996-04-30 | 2001-01-23 | Applied Materials, Inc. | Multideck wafer processing system |
US6315512B1 (en) | 1997-11-28 | 2001-11-13 | Mattson Technology, Inc. | Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber |
US6142722A (en) * | 1998-06-17 | 2000-11-07 | Genmark Automation, Inc. | Automated opening and closing of ultra clean storage containers |
US6293713B1 (en) * | 1999-07-02 | 2001-09-25 | Tokyo Electron Limited | Substrate processing apparatus |
JP3957445B2 (ja) * | 1999-07-02 | 2007-08-15 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2005
- 2005-12-21 KR KR1020077016988A patent/KR101006685B1/ko active IP Right Review Request
- 2005-12-21 JP JP2007548551A patent/JP4990160B2/ja not_active Expired - Fee Related
- 2005-12-21 WO PCT/US2005/046877 patent/WO2006069341A2/fr active Application Filing
- 2005-12-21 EP EP05855441A patent/EP1842225A2/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2006069341A3 (fr) | 2006-10-12 |
KR101006685B1 (ko) | 2011-01-10 |
WO2006069341A2 (fr) | 2006-06-29 |
JP2008526032A (ja) | 2008-07-17 |
EP1842225A2 (fr) | 2007-10-10 |
KR20080016782A (ko) | 2008-02-22 |
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