WO2006069341A3 - Architecture d'un outil multiple de traitement de substrats - Google Patents

Architecture d'un outil multiple de traitement de substrats Download PDF

Info

Publication number
WO2006069341A3
WO2006069341A3 PCT/US2005/046877 US2005046877W WO2006069341A3 WO 2006069341 A3 WO2006069341 A3 WO 2006069341A3 US 2005046877 W US2005046877 W US 2005046877W WO 2006069341 A3 WO2006069341 A3 WO 2006069341A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing
substrates
cluster tool
reliability
substrate
Prior art date
Application number
PCT/US2005/046877
Other languages
English (en)
Other versions
WO2006069341A2 (fr
Inventor
Tetsuya Ishikawa
Rick J Roberts
Helen R Armer
Leon Volfovski
Jay D Pinson
Michael Rice
David H Quach
Mohsen S Salek
Robert Lowrance
John A Backer
William Tyler Weaver
Charles Carlson
Chongyang Wang
Jeffrey Hudgens
Harald Herchen
Brian Lue
Original Assignee
Applied Materials Inc
Tetsuya Ishikawa
Rick J Roberts
Helen R Armer
Leon Volfovski
Jay D Pinson
Michael Rice
David H Quach
Mohsen S Salek
Robert Lowrance
John A Backer
William Tyler Weaver
Charles Carlson
Chongyang Wang
Jeffrey Hudgens
Harald Herchen
Brian Lue
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36147070&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2006069341(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US11/112,281 external-priority patent/US7357842B2/en
Application filed by Applied Materials Inc, Tetsuya Ishikawa, Rick J Roberts, Helen R Armer, Leon Volfovski, Jay D Pinson, Michael Rice, David H Quach, Mohsen S Salek, Robert Lowrance, John A Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue filed Critical Applied Materials Inc
Priority to EP05855441A priority Critical patent/EP1842225A2/fr
Priority to JP2007548551A priority patent/JP4990160B2/ja
Publication of WO2006069341A2 publication Critical patent/WO2006069341A2/fr
Publication of WO2006069341A3 publication Critical patent/WO2006069341A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte d'une manière générale sur un appareil et un procédé de traitement de substrats utilisant un système à plusieurs chambres (par exemple un outil multiple) qui permettent d'obtenir: un plus grand débit; une plus grande fiabilité; une meilleure répétabilité; et un encombrement réduit du système. Dans une exécution de l'outil multiple, le coût de l'investissement est réduit du fait du groupement des substrats et de leur transfert et traitement par lots de deux ou plus, ce qui accroît le rendement du système, et réduit le nombre de déplacements du robot nécessaires pour transférer un lot de substrats entre les chambres de traitement, ce qui réduit l'usure du robot et accroît la fiabilité du système.
PCT/US2005/046877 2004-12-22 2005-12-21 Architecture d'un outil multiple de traitement de substrats WO2006069341A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05855441A EP1842225A2 (fr) 2004-12-22 2005-12-21 Architecture d'un outil multiple de traitement de substrats
JP2007548551A JP4990160B2 (ja) 2004-12-22 2005-12-21 基板を処理するクラスタツールアーキテクチャ

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US63910904P 2004-12-22 2004-12-22
US60/639,109 2004-12-22
US11/112,932 2005-04-22
US11/112,281 US7357842B2 (en) 2004-12-22 2005-04-22 Cluster tool architecture for processing a substrate
US11/112,932 US20060134330A1 (en) 2004-12-22 2005-04-22 Cluster tool architecture for processing a substrate
US11/112,281 2005-04-22

Publications (2)

Publication Number Publication Date
WO2006069341A2 WO2006069341A2 (fr) 2006-06-29
WO2006069341A3 true WO2006069341A3 (fr) 2006-10-12

Family

ID=36147070

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/046877 WO2006069341A2 (fr) 2004-12-22 2005-12-21 Architecture d'un outil multiple de traitement de substrats

Country Status (4)

Country Link
EP (1) EP1842225A2 (fr)
JP (1) JP4990160B2 (fr)
KR (1) KR101006685B1 (fr)
WO (1) WO2006069341A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685584B2 (ja) 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
JP5267691B2 (ja) * 2012-02-15 2013-08-21 東京エレクトロン株式会社 塗布、現像装置、その方法及び記憶媒体
US9543186B2 (en) 2013-02-01 2017-01-10 Applied Materials, Inc. Substrate support with controlled sealing gap
KR102037900B1 (ko) * 2017-11-10 2019-10-29 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US20200194297A1 (en) * 2018-12-14 2020-06-18 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Track system and method of processing semiconductor wafers
US11413767B2 (en) 2019-10-29 2022-08-16 Applied Materials, Inc. Sensor-based position and orientation feedback of robot end effector with respect to destination chamber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
US20040091349A1 (en) * 1997-11-28 2004-05-13 Farzad Tabrizi Methods for transporting wafers for vacuum processing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3816929B2 (ja) * 1995-12-12 2006-08-30 東京エレクトロン株式会社 半導体処理装置
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US20040091349A1 (en) * 1997-11-28 2004-05-13 Farzad Tabrizi Methods for transporting wafers for vacuum processing
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
JP4990160B2 (ja) 2012-08-01
KR101006685B1 (ko) 2011-01-10
JP2008526032A (ja) 2008-07-17
WO2006069341A2 (fr) 2006-06-29
KR20080016782A (ko) 2008-02-22
EP1842225A2 (fr) 2007-10-10

Similar Documents

Publication Publication Date Title
WO2006069341A3 (fr) Architecture d'un outil multiple de traitement de substrats
TW200707621A (en) Cartesian robot cluster tool architecture
WO2008085681A3 (fr) Conception de système de nettoyage en phase liquide
WO2006055236A3 (fr) Fabrication des plaquettes
TW200707113A (en) Substrate processing apparatus
TW200731445A (en) Batch forming apparatus, substrate processing system, batch forming method, and batch forming program
WO2008070004A3 (fr) Dispositif d'alignement d'encoches de galette de rendement élevé
MY160715A (en) System for batch processing of magnetic media
WO2008002780A3 (fr) Plate-forme de traitement de mélange pour ald et cvd
WO2008005773A3 (fr) outil multiposte pour un traitement frontal avancé
WO2008031031A3 (fr) Configuration cartésienne d'outil de grappe pour des processus de type lithographie
WO2010082750A3 (fr) Système de traitement de substrats et procédé de transfert de substrats
FR2828428B1 (fr) Dispositif de decollement de substrats et procede associe
WO2006055984A3 (fr) Appareil de traitement de substrats au moyen d'une chambre de traitement par lots
AU2003276895A1 (en) A method and apparatus for the compensation of edge ring wear in a plasma processing chamber
TW200741954A (en) Substrate processing apparatus and substrate handling method
WO2004086465A3 (fr) Procedes et appareil de manipulation d'objets a grande vitesse
WO2008039702A3 (fr) Système et procédé de traitement de substrats
WO2006071406A3 (fr) Procede de sequençage de substrats
WO2009072426A1 (fr) Appareil de traitement sous vide et procédé de traitement de substrat
WO2003010800A1 (fr) Appareil et procede de traitement
WO2009004977A1 (fr) Appareil de traitement de substrat, procédé de traitement de substrat et support de stockage
WO2007041012A3 (fr) Systeme de manipulation de tranches par lots
CN103215572A (zh) 半导体设备工艺控制方法和半导体设备工艺控制装置
WO2006124472A3 (fr) Procede et appareil permettant le transport vertical de substrats semi-conducteurs dans un module de nettoyage

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200580048568.X

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007548551

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020077016988

Country of ref document: KR

Ref document number: 2005855441

Country of ref document: EP