JP4990160B2 - Cluster tool architecture for processing substrates - Google Patents

Description

Background of the Invention

Field of Invention
[0001] Embodiments of the present invention generally relate to an integrated processing system that includes a plurality of processing stations and a robot capable of processing a plurality of substrates in parallel.

Explanation of related technology
[0002] Typically, electronic device formation processing is performed in a multi-chamber processing system (eg, a cluster tool) that has the capability of continuously processing substrates (eg, semiconductor wafers) within a controlled processing environment. A typical cluster tool is used for the deposition (ie, coating) and growth of photoresist material and is commonly known as a track lithography tool. The tool includes a main frame for housing at least one substrate transfer robot for transferring substrates between the pod / cassette mounting apparatus and a plurality of processing chambers (both connected to the main frame). Yes. In many cases, cluster tools are used so that substrates can be repeatedly processed in a controlled processing environment. A controlled processing environment has many benefits, including minimizing contamination of the surface of the substrate during transfer and during the completion of various substrate processing steps. By performing the process in a controlled environment, the number of defects generated is reduced and the device output is increased.

  [0003] The effectiveness of a substrate manufacturing process is often measured by two important factors related to each other, such as device productivity and cost of ownership (CoO). These factors are important because they directly affect the cost of producing electronic devices and the competitiveness of device manufacturers in the market. CoO is influenced by many factors, but among other things it is greatly influenced by system and chamber throughput, or simply the number of substrates processed in one hour using the desired processing sequence. A processing sequence is generally defined as a sequence of device fabrication steps or processing recipe steps that are completed in one or more processing chambers within a cluster tool. In general, the processing sequence includes various substrate (or wafer) electronics manufacturing process steps. In many cases, electronic device manufacturers try to reduce the processing sequence and chamber processing time in an attempt to reduce CoO in order to achieve the highest possible substrate throughput, taking into account the limitations of the cluster tool architecture and chamber processing time. You spend a lot of time optimizing. In the case of a track lithography type cluster tool, the chamber processing time is considerably short (for example, about one minute until the processing is completed), and the number of processing steps required to complete one typical processing sequence is large. A significant portion of such time will be devoted to the transfer of substrates between the various processing chambers. In general, a typical track lithography process sequence includes the following steps: depositing one or more uniform photoresist (or resist) layers on the surface of the substrate, and then separating the substrate from the cluster tool. To a stepper or scanner tool, where the photoresist layer is exposed to photoresist deformed electromagnetic radiation to create a pattern on the surface of the substrate to grow a patterned photoresist layer. If the robot does not limit the substrate throughput in the cluster tool, the processing sequence throughput is generally limited by the longest processing recipe step. Typically, in the track lithography processing sequence, this is not the case because the processing time is short and the number of processing steps is large. The typical system throughput of a track lithography tool that is performing a conventional fabrication process, such as a typical process, is typically 100 to 120 substrates per hour.

  [0004] Other important factors in CoO calculations are system reliability and start-up time. These factors are very important to the usefulness and / or effectiveness of the cluster tool because the longer the system's substrate dead time, the more chances of processing the substrate within the cluster tool will disappear and the user will suffer damage It is. For this reason, cluster tool users and manufacturers spend a great deal of time developing reliable processes, reliable hardware, and highly reliable systems with increased startup time.

  [0005] By reducing the size of semiconductor devices in the industry, improving device processing speed, and reducing heat generation by the device, industry tolerances to processing indefiniteness have disappeared. Due to the size reduction of semiconductor devices and the ever-increasing demands on device performance, acceptable variations in device manufacturing process uniformity and repeatability have been greatly reduced. An important factor in minimizing process variations in a track lithography process sequence is to ensure that all substrates passing through the cluster tool have the same “wafer history”. In general, the wafer history of a substrate can control variations in all device fabrication processes that can later affect device performance, so that all substrates in the same batch are always processed in the same way. Monitored and controlled by a processing engineer to be able to do. To ensure that all substrates have the same “wafer history”, all substrates must have the same repeatable substrate processing steps (eg, consistent coating, consistent hard bake, consistent refrigeration, etc.) There is a need to experience and for each substrate the time between various fabrication steps must be the same. Lithographic type device fabrication processes may be particularly sensitive to process recipe variability variables and time between final recipe steps, which directly affect process variability and device performance. Accordingly, there is a need for a cluster tool and supporting equipment that can execute a processing sequence that minimizes processing ambiguities and time ambiguities between processing steps. There is also a need for a cluster tool and support device that can perform apparatus fabrication processes that deliver uniform and repeatable process results while achieving the desired substrate throughput.

  [0006] Accordingly, there is a further need for systems, methods, and apparatus that can process substrates in a manner that meets the required device performance goals, increases system throughput, and reduces processing sequence CoO.

Summary of the Invention

  [0007] In general, the present invention provides a cluster tool that includes a plurality of processing stations and a robot capable of processing a plurality of substrates in parallel. A cluster tool for processing a substrate includes a first substrate processing chamber and a second substrate processing chamber, the second substrate processing chamber being spaced apart from the first substrate processing chamber by a fixed vertical distance, and a third substrate. A processing chamber, a fourth substrate processing chamber, a fourth substrate processing chamber positioned at a fixed vertical distance from the third substrate processing chamber, a first substrate processing chamber, and a second substrate processing chamber A first robot assembly adapted to access the first and second robot assemblies, wherein one or more substrates from the first substrate processing chamber and one or more substrates of the second substrate processing chamber are substantially simultaneously And then receiving one or more substrates from the first substrate processing chamber into the third substrate processing chamber and one or more from the second substrate processing chamber. Including, with the second robotic assembly which is adapted to substantially simultaneously depositing the substrate in the fourth substrate processing chamber.

  [0008] Embodiments of the present invention are cluster tools for processing substrates, comprising a first processing rack having a plurality of vertically stacked substrate processing chambers and a plurality of vertically stacked substrate processing chambers. A second processing rack, a first robot blade assembly, the first robot blade assembly comprising a first robot blade and a first robot blade actuator, and a second robot blade assembly, the second robot blade The second robot blade assembly comprising: a second robot blade actuator; and the first robot blade assembly and the second robot blade assembly are vertically spaced apart by a fixed distance; and Robot blade actuator or the second robot breaker A six-axis articulated robot connected to the first robot blade assembly and the second robot blade assembly, which can be separately positioned in a horizontal direction using an actuator, the first robot blade assembly and the first robot blade assembly Two robot blade assemblies are spaced apart by a fixed distance and are positioned in two vertically stacked substrate processing chambers in the first processing rack by operating cooperatively with the six-axis articulated robot. The six-axis joint adapted to access substrates at approximately the same time or to access substrates positioned within the two vertically stacked substrate processing chambers in the second processing rack at approximately the same time And a cluster tool comprising a robot.

  [0009] An embodiment of the present invention is a cluster tool for processing substrates, a cassette adapted to contain two or more substrates, a first module, and an avertical direction. The first module including a first processing rack including two or more substrate processing chambers stacked, and a second processing rack including two or more substrate processing chambers stacked vertically. A first robot assembly adapted to access substrates positioned in at least one substrate processing chamber of the first and second processing racks and in the cassette; A second robot assembly comprising: a robot; a first robot blade connected to the robot; and the first robot blade connected to the robot. And a second robot assembly positioned at a fixed distance from the blade, and wherein the second robot has at least one interior of each of the first and second processing racks. The first and second robot blades are adapted to access a substrate positioned in the substrate processing chamber, and the substrates in at least two substrate processing chambers in each of the first and second processing racks A cluster tool is further provided that is adapted to transport, pick up, and / or lower at substantially the same time.

  [0010] An embodiment of the present invention is a cluster tool for processing a substrate, the first processing rack including a first vertically stacked substrate processing chamber, and a substrate in the first processing rack. A first robot adapted to transfer to the processing chamber; a second processing rack including a first vertically stacked substrate processing chamber; the substrate processing chamber in the first processing rack; and the second processing. A second robot adapted to transfer a substrate between substrate processing chambers in the rack and the substrate passing through the first and second processing racks using the first robot or the second robot; A controller adapted to optimize the operation of the computer and a memory coupled to the controller, the computer embodied therein to direct the operation of the cluster tool And a memory including a computer readable medium having a reading program, wherein the computer readable program includes computer instructions for controlling operations of the first robot and the second robot, and the computer instructions include the first robot. And storing one or more command tasks for the second robot in the memory, reviewing the command tasks for the first robot held in the memory, and holding in the memory In order to review the command task to the second robot and to balance the availability of each robot, the command task is transferred from the first robot to the second robot or from the second robot. There is further provided a cluster tool comprising moving to a first robot.

  [0011] An embodiment of the invention is a cluster tool for processing substrates, including a cassette adapted to contain two or more substrates, and a vertically stacked substrate processing chamber, In addition, the first processing rack extends in the first direction, and the substrate stacked vertically with the first processing rack that can access the substrate processing chamber via the first side. A second processing rack including a processing chamber and having a first side portion of the second processing rack extending in a second direction so that the substrate processing chamber can be accessed via the first side portion; The first side and the second side are spaced apart by a distance, the first side of the second processing rack and the first processing rack. Has a base in a fixed position between the first side A first robot adapted to transfer a substrate to a substrate processing chamber within the first processing rack, the second processing rack, and the cassette; and a substrate processing stacked vertically A third processing rack including a chamber and having a first side portion of the third processing rack extending in a third direction and allowing access to the substrate processing chamber via the third processing rack; , Including vertically stacked substrate processing chambers, and a first side of the second processing rack extends along a fourth direction through which the substrate processing chamber can be accessed. A fourth processing rack, wherein the third side portion and the fourth side portion are spaced apart by a fixed distance, and a second robot assembly, wherein the third processing rack includes: Said A robot having a base at a fixed position between a side and the first side of the fourth processing rack; a first robot blade connected to the robot; and a first robot blade connected to the robot A second robot assembly comprising a second robot blade positioned at a fixed distance from the second robot assembly, wherein the first and second robot blades include the first processing rack, the second processing rack, and a third processing rack. A cluster tool is further provided that is adapted to transfer substrates to the processing rack, the two chambers in the fourth processing rack, substantially simultaneously.

  [0012] Embodiments of the invention are cluster tools for processing substrates, a cassette adapted to contain two or more substrates, and a first adapted to perform a first process on the substrates. A second processing chamber adapted to perform a second processing on a substrate, wherein the first processing chamber and the second processing chamber are substantially adjacent to each other Fluid distribution means adapted to be in fluid communication with a first substrate positioned in the first processing chamber and a second substrate positioned in the second processing chamber, the fluid source; Said fluid distribution means comprising: a nozzle in fluid communication with said fluid source; and fluid delivery means adapted to deliver fluid from said fluid source to said nozzle; and said first processing chamber to said second processing chamber Comprising a movable shutter adapted to al isolate, said cassette, said first processing chamber, and adapted robots to transfer substrates between the second processing chamber further provides a cluster tool.

  [0013] An embodiment of the invention is a cluster tool for processing a substrate, a first processing rack, a first processing module, adapted to perform a first processing on a substrate. A second processing chamber adapted to perform a second processing on a substrate, wherein the first processing chamber and the second processing chamber are substantially adjacent to each other Fluid distribution means adapted to be in fluid communication with a substrate being processed within the first processing chamber and the second processing chamber, wherein the fluid distribution means is in fluid communication with the fluid source. And a fluid delivery means adapted to deliver fluid from the fluid source to the nozzle, and to isolate the first processing chamber from the second processing chamber. Fit A first processing module comprising a movable shutter, a second processing module, a third processing chamber adapted to perform a first process on the substrate, and a second process performed on the substrate. An adapted fourth processing chamber, wherein the first processing chamber and the second processing chamber are in close proximity to each other, and within the third processing chamber and the fourth processing chamber. Fluid distribution means adapted to be in fluid communication with a substrate being processed, the fluid source, a nozzle in fluid communication with the fluid source, and delivering fluid from the fluid source to the nozzle A fluid delivery means adapted to isolate the first processing chamber from a second processing chamber, and a movable shutter adapted to isolate the first processing chamber from the second processing chamber. A substrate is transferred between the first processing rack comprising the second processing module proximate to a module, the first processing chamber, the second processing chamber, the third processing chamber, and the fourth processing chamber. There is further provided a cluster tool comprising a robot adapted to do so.

  [0014] Embodiments of the present invention are cluster tools for processing substrates, cassettes adapted to contain two or more substrates, and processing modules, all in one processing area. A first processing chamber adapted to perform a first process on a substrate, and a second processing chamber adapted to perform a second process on a substrate within a processing region, wherein A robot adapted to transfer and position the second processing chamber, wherein the first processing chamber and the second processing chamber are substantially adjacent to each other, and the first processing chamber and the substrate in the second processing chamber; A robot blade, an actuator adapted to position the robot blade in the first processing chamber and the second processing chamber, and the robot blade The processing module comprising: the robot comprising a heat exchange device in communication with and adapted to control the temperature of the substrate positioned thereon; and a substrate between the cassette and the first processing chamber. A cluster tool is further provided, further comprising a system robot adapted to transfer.

  [0015] An embodiment of the invention is a cluster tool for processing substrates, a cassette adapted to contain two or more substrates, a processing module, a first processing chamber, and the first A processing module comprising a first processing chamber and a second processing chamber substantially proximate; and a first robot adapted to access the first processing chamber and a substrate positioned in the second processing chamber. The first robot is a first robot blade assembly, and is a first robot blade and a second robot blade, and the first robot blade and the second robot blade are separated by a certain distance. A first robot assembly comprising the second robot blade, and a second robot blade assembly, wherein the third robot A second robot blade assembly comprising: a blade; and a fourth robot blade, the third robot blade comprising the third robot blade and the fourth robot blade spaced apart by a distance. A cluster tool, wherein the second robot blade assembly and the first robot assembly are spaced apart by a fixed distance, and wherein the first robot is adapted to access the first processing chamber and the second processing chamber substantially simultaneously. Provide further.

  [0016] An embodiment of the present invention is a cluster tool for processing substrates, a first processing rack comprising two or more vertically stacked substrate processing chambers, the first side and the second side A second processing rack comprising a first processing rack having a portion and two or more vertically stacked substrate processing chambers, the first processing rack having a first side and a second side; A first robot adapted to access the substrate processing chamber in the first processing rack from the first side; and the substrate processing chamber in the first processing rack from the second side. And a second robot adapted to access the substrate processing chamber in the second processing rack from the first side, and the second processing chamber into the substrate processing chamber in the second processing rack. Access from the side And a third robot adapted further provides a cluster tool.

  [0017] An embodiment of the present invention is a cluster tool for processing substrates, a cassette adapted to contain two or more substrates, and a first processing rack, stacked vertically. A first group of two or more substrate processing chambers, wherein the two or more substrate processing chambers include a first side extending along a first direction and a second side extending along a second direction. A first processing rack, and a substrate positioned in at least one substrate processing chamber in the first processing rack, adapted to access from the first side and the cassette. One robot assembly and a second processing rack comprising a second group of two or more substrate processing chambers stacked vertically, the two or more substrate processing chambers extending along a third direction Having a first side and said first side A second processing rack capable of accessing the substrate processing chamber via a second robot assembly, a robot, a first robot blade, a second robot blade, and the first robot blade; Said second robot assembly comprising said second robot blade spaced apart by a fixed distance, said second robot assembly comprising at least two substrate processing chambers in said first processing rack A substrate positioned within the second side to access a substrate positioned within the second side substantially simultaneously, and a substrate positioned within at least one substrate processing chamber in the second processing rack from the third side. It further provides a cluster tool that is adapted to be accessed at approximately the same time.

  [0018] Embodiments of the present invention are cluster tools for processing substrates, cassettes adapted to contain two or more substrates, twelve or more coater / developer chambers, bake chambers, HMDS Twelve or more processing chambers selected from the group consisting of processing chambers, PEB chambers, and a transfer system, essentially comprising at least one of the coater / developer chambers, at least one of the processing chambers, A first robot adapted to access a substrate positioned therein; and a second robot adapted to access a substrate positioned within at least one of the coater / developer chamber and at least one of the processing chambers. A robot assembly, wherein the second robot includes a robot and the robot. A first robot blade connected to the robot and a second robot blade connected to the robot and positioned at a fixed distance from the first robot blade, the second robot comprising: To access at least one substrate positioned in at least two coater / developer chambers substantially simultaneously, and to access at least one substrate positioned in at least two processing chambers substantially simultaneously A cluster tool is further provided comprising the transfer system being adapted.

  [0019] Embodiments of the present invention further provide a method of processing a substrate in a cluster tool that includes a plurality of processing stations and a robot capable of processing a plurality of substrates in parallel. A method of processing substrates in a cluster tool, wherein a first robot is used to insert at least one substrate into each of two or more vertically stacked processing chambers in a first processing rack. Processing a substrate in the two or more processing chambers in the first processing rack; and stacking the two or more vertically in the first rack using a second robot. Removing the substrate from the processing chamber substantially simultaneously, and using the second robot, simultaneously transferring the substrate to the two or more vertically stacked processing chambers in the second processing rack. And, using the second robot, depositing the substrate in the two or more vertically stacked processing chambers in the second processing rack.

  [0020] An embodiment of the present invention is a method of processing a substrate in a cluster tool, wherein a first robot is used to move at least one substrate vertically to two or more vertical in a first processing rack. Inserting into the stacked processing chambers; processing the substrate in the two or more processing chambers in the first processing rack; and using a second robot in the first processing rack. Removing the substrate from the two or more vertically stacked processing chambers at substantially the same time, so that the blade does not access the first vertically stacked processing chamber. 2 repositioning the robot blade connected to the support attached to the robot and positioning the robot blade separately connected to the support in the second vertically stacked processing chamber; Positioning the substrate positioned in the second vertically stacked processing chamber on the robot blade; and removing the robot blade from the second vertically stacked processing chamber Removing the substrate, and using the second robot to transfer the substrate to two sets of two or more vertically stacked processing chambers. A method is further provided.

  [0021] An embodiment of the invention is a method of processing a substrate in a cluster tool, wherein the first robot is used to position at least one substrate in two or more vertical positions within the cluster tool. Inserting through the first side of the processing chamber stacked on the substrate, processing the substrate in the processing chamber, and using a second robot to transfer two or more substrates to the two Removing substantially simultaneously through the second side of the vertically stacked processing chambers, and simultaneously transferring the two or more substrates to a desired location using the second robot; There is further provided a method comprising:

  [0022] An embodiment of the present invention is a method of processing a substrate in a cluster tool, the step of removing the substrate from the cassette using a robot, and the first substrate in proximity to the second processing chamber. Inserting into a positioned first processing chamber and isolating the first processing chamber from the second processing chamber by positioning a shutter between the first processing chamber and the second processing chamber. Dispensing a processing fluid onto a surface of the substrate positioned in the first processing chamber using a nozzle connected to a fluid distribution system; and a second substrate in the second processing chamber And processing on the surface of the second substrate positioned in the second processing chamber using the nozzle connected to the fluid distribution system. Further provides a method comprising the steps of dispensing a fluid.

[0023] An embodiment of the invention is a method of processing a substrate in a cluster tool comprising:
Positioning a substrate on a substrate changer in the first process chamber positioned proximate to the second process chamber; and a robot blade refrigerated from the substrate changer in the first process chamber Using the refrigerated robot blade, wherein the substrate receiving surface is adapted to control the temperature of the substrate held therein; Transferring the substrate to the second processing chamber; and transferring the substrate to the third processing chamber using the refrigerated robot plate, wherein the third processing chamber is the second processing chamber. Is further provided.

  [0024] An embodiment of the present invention is a method of processing a substrate in a cluster tool, wherein the substrate is positioned on a substrate changer in a first processing chamber positioned proximate to the second processing chamber. Transferring the substrate from the substrate changer in the first processing chamber to a substrate receiving surface of a refrigerated robot blade, wherein the substrate receiving surface holds the temperature of the substrate held thereon A step adapted to control the substrate, using the refrigerated robot blade to transfer the substrate to the second processing chamber, and to bring the substrate in the second processing chamber to a desired temperature. Heating the substrate to the third processing chamber using the refrigerated robot, wherein the third processing chamber is the second processing chamber. A step in proximity to the chamber, further provides a method comprising the steps of cooling the substrate of the third processing chamber to a desired temperature.

  [0025] An embodiment of the invention is a method of processing a substrate in a cluster tool, the step of transferring the substrate from a cassette containing two or more substrates, wherein the cassette is the cluster tool. Holding in the substrate; completing a final processing step on the substrate in the processing chamber; transferring the substrate from the processing chamber to a refrigeration chamber adapted to perform a refrigeration process; Transferring the substrate from the refrigeration chamber to the cassette.

Detailed description

  [0026] Reference will now be made to the embodiments, examples of which are illustrated in the accompanying drawings, to better understand the features of the invention listed above, and to make the invention briefly summarized above more specific. A method is described. However, the attached drawings only illustrate exemplary embodiments of the present invention, and the present invention allows other embodiments having equivalent effects, so the accompanying drawings are not intended to limit the present invention. Note that it is not considered as

  [00112] The present invention generally increases system throughput, increases system reliability, increases the number of repeatable wafer processing histories (or wafer histories) within the cluster tool, and reduces the cluster tool footprint. An apparatus and method for processing a substrate using the multi-chamber processing system (eg, cluster tool) is provided. In one embodiment, the cluster tool is adapted to perform a track lithography process. The track lithography process involves coating a substrate with a photosensitive material, then transporting the substrate to a stepper / scanner where the photosensitive material is exposed to some form of radiation to form a pattern on the photosensitive material, and then the cluster tool. In the developing process completed within the above, a specific portion of the photosensitive material is removed.

  [00113] FIGS. 1A and 1C are isometric views of one embodiment of a cluster tool 10 illustrating a number of aspects of the present invention that may be used to advantage. One embodiment of the cluster tool 10 illustrated in FIGS. 1A and 1C includes a front end module 50, a center module 150, and a rear module 200. The front end module 50 generally includes one or more pod assemblies 105 (eg, parts 105A-105D), a front end robot 108 (FIG. 1B), and a front end processing rack 52. The central module 150 generally includes a first central processing rack 152, a second central processing rack 154, and a central robot 107 (FIG. 1B). The rear module 200 generally includes a rear processing rack 202 and a rear robot 109 (FIG. 1B). In one embodiment, the cluster tool 10 includes a front end robot 108 adapted to access a processing chamber in the front end processing rack 52, a front end processing rack 52, a first central processing rack 152, and a second central processing rack 154. And / or a central robot 107 adapted to access the processing chamber in the rear processing rack 202, and access to the processing chamber in the rear processing rack 202, and in some cases, the substrate is moved to the stepper / scanner 5 (FIG. 1B). ) And a rear robot 109 adapted to replace. In one embodiment, shuttle robot 110 moves substrates between two or more adjacent processing chambers held in one or more processing racks (eg, front-end processing rack 52, first central processing rack 152, etc.). It is adapted to transport. In one embodiment, the front end enclosure 104 is used to control the environment around the front end robot 108 and the environment between the pod assembly 105 and the front end processing rack 52.

  [00114] FIG. 1B illustrates a top view of the embodiment illustrated in FIG. 1A and includes further details of usable processing chamber configurations that can be viewed in aspects of the present invention. Referring to FIG. 1B, the front end module 50 generally includes one or more pod assemblies 105, a front end robot 108, and a front end processing rack 52. One or more pod assemblies 105, or front-end open integrated pods (FOUPs), are typically one or more cassettes 106 that can contain one or more substrates “W” or wafers that are processed in the cluster tool 10. Is adapted to accept. The front end processing rack 52 includes a plurality of processing chambers (eg, bake chamber 90, refrigeration chamber 80, etc.) adapted to perform various processing steps found in the substrate processing sequence. In one embodiment, the front end robot 108 is adapted to transfer substrates between cassettes mounted in the pod assembly 105 and between one or more processing chambers held in the front end processing rack 52. .

  [00115] Generally, the central module 150 includes a central robot 107, a first central processing rack 152, and a second central processing rack 154. The first central processing rack 152 and the second central processing rack 154 may include various processing chambers (eg, coater / developer chamber 60, bake chamber 90, refrigeration chamber) adapted to perform various processing steps found in the substrate processing sequence. 80). In one embodiment, central robot 107 is adapted to transfer substrates between front end processing rack 52, first central processing rack 152, second central processing rack 154, and / or rear processing rack 202. In one aspect, the central robot 107 is positioned at a central location between the first central processing rack 152 and the second central processing rack 154 of the first central module 150.

  [00116] The rear module 200 generally includes a rear robot 109 and a rear processing rack 202. The rear processing rack 202 includes processing chambers (eg, coater / developer chamber 60, bake chamber 90, refrigeration chamber 80, etc.) adapted to perform various processing steps commonly found in substrate processing sequences. . In one embodiment, the rear robot 109 is adapted to transfer substrates between the rear processing rack 202 and the stepper / scanner 5. The stepper / scanner 5 is manufactured by Canon USA, Inc. (San Jose, CA), Nikon Precision Inc. (Belmont, CA), ASML US, Inc. For example, lithographic projection equipment used in the manufacture of integrated circuits (ICs). The scanner / stepper tool 5 exposes individual layers of integrated circuit (IC) devices that are formed on the surface of the substrate by exposing the photosensitive material (photoresist) deposited on the substrate in the cluster tool with some electromagnetic radiation. A circuit pattern related to the above is generated on the substrate.

  [00117] In one embodiment, the system controller 101 is used to control all components in the cluster tool 10 and all processes performed within the tool. The system controller 101 is generally adapted to communicate with the stepper / scanner 5 to monitor and control aspects of processing performed within the cluster tool 10 and also to all aspects of the overall substrate processing sequence. Is adapted to control. The system controller 101 is typically a microprocessor-based controller that receives input from a user and / or input from various sensors built into one of the processing chambers, and the various inputs and controllers. Are configured to properly control the processing chamber components in accordance with software instructions stored in the memory. The system controller 101 generally includes a memory and a CPU (not shown). These controllers hold various programs by the controller, process the programs, and execute the programs as necessary. Used. A memory (not shown) is connected to the CPU, and one or more ready-to-use memories, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or others It may be a local or remote digital storage device of the form Software instructions and data can be coded and stored in memory to instruct the CPU. In order to support the processor in a conventional manner, a support circuit (not shown) is also connected to the CPU. Support circuitry may include caches, power supplies, clock circuits, input / output circuits, subsystems, etc., which are well known in the art. A program (or computer instructions) readable by the system controller 101 determines the tasks to be performed in the processing chamber (s). This program is software readable by the system controller 101, and preferably includes instructions to monitor and control the processing based on the defined rules and the input data.

  [00118] FIG. 2A is a plan view illustrating another embodiment of the cluster tool 10 including a front end module 50 attached to a stepper / scanner 5. FIG. The front end module 50 of this configuration may include a front end robot 108, a front end processing rack 52, and a rear robot 109A in communication with the step / scanner 5. Also in this configuration, the front-end processing rack 52 includes a plurality of processing chambers (eg, coater / developer chamber 60, bake chamber 90, refrigeration chamber 80, etc.) that can be used for various processing operations found in the substrate processing sequence. It is adapted to perform the steps. In this configuration, the front end robot 108 is adapted to transfer substrates between the cassette 106 mounted in the pod assembly 105 and one or more processing chambers held in the front end processing rack 52. Yes. Also in this configuration, the rear robot 109A is adapted to transfer substrates between the front end processing rack 52 and the stepper / scanner 5. In one embodiment, shuttle robot 110 may include two or more adjacent processing chambers that are held in one or more processing racks (eg, front-end processing rack 52, first central processing rack 152 (FIG. 1B), etc.). It is adapted to transfer substrates between them. In one embodiment, cluster tool 10 includes front end module 50 but does not include rear robot 109A and is not interfaced to stepper / scanner 5.

  [00119] FIG. 2B is a plan view illustrating another embodiment of the cluster 10 shown in FIG. 2A. The cluster 10 in this embodiment is not adapted to communicate with the stepper / scanner 5. In this configuration, the cluster tool 10 can be used as a stand-alone tool for performing a desired processing sequence utilizing the processing chambers contained within the front end processing rack 52.

  [00120] FIG. 2C is a plan view illustrating yet another embodiment of the cluster tool 10, which includes a front end module 50 and a center module 150, which are stepper / scanner 5s. And is handled by the front end robot 108 and the central robot 107. In one embodiment, central robot 107 is adapted to transfer substrates between front end processing rack 52, first central processing rack 152, second central processing rack 154, and / or stepper / scanner 5. In one embodiment, the shuttle robot 110 transfers substrates between two or more adjacent processing chambers that are held in one or more processing racks (eg, front-end processing rack 52, first central processing rack 152, etc.). Is adapted to be.

  [00121] FIG. 2D is a plan view of yet another embodiment of the cluster tool 10, which includes a front end module 50, a center module 150, a rear module 300, and a rear processing rack 302 is the first. The first rear processing rack 302 and the second rear processing rack 304 are configured to be included. In this configuration, the rear robot 109 is a substrate from the first central processing rack 152, the second central processing rack 154, the first rear processing rack 302, the second rear processing rack 304, the central robot 107, and / or the stepper / scanner 5. Is adapted to transport Also in this configuration, the central robot 107 is configured to transfer substrates from the first central processing rack 152, the second central processing rack 154, the first rear processing rack 302, the second rear processing rack 304, and / or the rear robot 109. Can be adapted. In one embodiment, the shuttle robot 110 transfers substrates between two or more adjacent processing chambers that are held in one or more processing racks (eg, front-end processing rack 52, first central processing rack 152, etc.). Is adapted to be.

  [00122] FIG. 2E illustrates a top view of the embodiment illustrated in FIG. 1B, which includes a photoresist coating step 520 (FIGS. 3A-3C) or a development step 550 in both processing chambers. It includes a twin coater / developer chamber 350 (FIGS. 9A-9B) mounted in a second central processing rack 314 (FIG. 4J) that can be adapted to perform (FIGS. 3A-3C). This configuration is advantageous because it can share some of the common components found in the two processing chambers 370 to reduce system cost, complexity, and footprint. 9A-9B described below illustrate various aspects of the twin coater / developer chamber 350. FIG. FIG. 2E also includes a bake / refrigeration chamber 800 mounted in the first central processing rack 322 (FIG. 4K), which can be used for various bake steps (eg, a post-BARC bake step 512) in the desired processing sequence. , PEB step 540, etc. (FIGS. 3A-3C)) and refrigeration steps (eg, post-BARC refrigeration step 514, post-PEB refrigeration step 542, etc. (FIGS. 3A-3C)). Bake / refrigeration chamber 800 is described below in connection with FIGS. 18A-18B.

  [00123] FIG. 2F is a plan view of yet another embodiment of the cluster tool 10, which includes a front end module 306 and a central module 310. FIG. In this embodiment, the front end module 306 may include a first processing rack 308 and a second processing rack 309, and the central module 310 includes a first central processing rack 312 and a second central processing rack 314. May be. The front end robot 108 is located between the cassette 106 mounted in the pod assembly 105, the first processing rack 308, the second processing rack 309, the first central processing rack 312, the second central processing rack 314, and / or the central robot 107. Adapted to transport the substrate. The central robot 107 transfers substrates between the first processing rack 308, the second processing rack 309, the first central processing rack 312, the second central processing rack 314, the first end robot 108, and / or the stepper / scanner 5. It is adapted to transfer. In one embodiment, the front end robot 108 and the central robot 107 are articulated robots (described below). In one embodiment, shuttle robot 110 moves substrates between two or more adjacent processing chambers held in one or more processing racks (eg, first processing rack 308, first central processing rack 312 etc.). It is adapted to transport. In one aspect, the front end robot 108 is positioned at a location in the center between the first processing rack 308 and the second processing rack 309 of the front end module 306. In another aspect, the central robot 107 is positioned at a central location between the first central processing rack 312 and the second central processing rack 314 of the central module 310.

  FIG. 2G is a plan view of yet another embodiment of the cluster tool 10. This embodiment is similar to the embodiment shown in FIG. 2F, but with the addition of a rear module 316 that can be attached to the stepper / scanner 5. In this embodiment, the front end module 306 can include a first processing rack 308 and a second processing rack 309, the central module 310 can include a first central processing rack 312 and a second central processing rack 314, and the rear module 316 can be a first module 316. One rear processing rack 318 and a second rear processing rack 319 can be included. The front end robot 108 is between the cassette 106, the first processing rack 308, the second processing rack 309, the first central processing rack 312, the second central processing rack 314, and / or the central robot 107 mounted in the pod assembly 105. It is adapted to transport the substrate. The central robot 107 includes a first processing rack 308, a second processing rack 309, a first central processing rack 312, a second central processing rack 314, a first rear processing rack 318, a second rear processing rack 319, a front end robot 108, and / or Or it is adapted to transfer the substrate between the rear robots 109. The rear robot 109 transfers substrates between the first central processing rack 312, the second central processing rack 314, the first rear processing rack 318, the second rear processing rack 319, the central robot 107, and / or the stepper / scanner 5. Is adapted to be. In one embodiment, the one or more front end robots 108, the central robot 107, and the rear robot 109 are articulated robots (described below). In one embodiment, shuttle robot 110 moves substrates between two or more adjacent processing chambers held in one or more processing racks (eg, first processing rack 308, first central processing rack 312 etc.). It is adapted to transport. In one aspect, the rear robot 109 is positioned at a central location between the first rear processing rack 318 and the second rear processing rack 319 of the rear module 316.

  [00125] In the embodiment illustrated in FIGS. 2F and 2G, the gap formed between the processing racks forms a relatively open space to access cluster tool components that have become inoperable by maintenance personnel. It is advantageous because it is easy. As shown in FIGS. 2F and 2G, in one aspect of the present invention, the width of the gap is about the same as the space between the processing racks, and the height is about the same as the processing racks. Because system downtime and system availability are important components in determining the CoO for a given tool, the ability to easily contact and maintain cluster tool components is This is advantageous compared to the configuration.

FIG. 2H is a plan view of yet another embodiment of the cluster tool 10. This embodiment is similar to the embodiment shown in FIG. 2F, but allows the base of the front end robot 108 and the central robot 107 to be translated along the length of the cluster tool (respectively labeled A ₁ and A ₂ ). A slide assembly 714 (FIG. 16H) is added. With this configuration, the reach of each robot is extended, and “robot overlap” is improved. Robot overlap is the ability of a robot to access a processing chamber in a processing rack of another module. FIG. 2H illustrates the front end robot 108 and the central robot 107 on a single slide assembly 714, whereas in another embodiment, each robot (reference number) is within the scope of the invention. 107, 108) is on its own slide assembly, or only one robot is mounted on the slide assembly and another robot is mounted on the floor or system frame.

FIG. 2I is a plan view of another embodiment of the cluster tool 10. This embodiment is similar to the embodiment shown in FIG. 2G, but in addition, the base of the front end robot 108 and the bases of the central robot 107 and the rear robot 109 are the lengths of the cluster tool 10 (respectively designated as A ₁ , A ₂ , A ₃ ), two slide assemblies 714A, 714B (described in FIG. 16H) are used. FIG. 2I illustrates the front end robot 108 on one slide assembly 714A and the central robot 107 and rear robot 109 on a single slide assembly 714B, and in another embodiment alters the spirit of the invention. 1 or more robots (symbols 107, 108, 109) can be placed on a slide assembly (not shown) or on a shared slide assembly, or all three robots can be single slide assemblies. (Not shown).

Photolithographic processing sequence
[00128] FIG. 3A illustrates one embodiment of a series of method steps 501 that can be used to deposit, expose, and develop a layer of photoresist material formed on the surface of a substrate. A lithographic process generally includes: Step 508A for removing the substrate from the pod, BARC coating step 510, BARC post-baking step 512, BARC post-cooling step 514, photoresist coating step 520, post-photoresist coating baking step 522, step 524 after photoresist refrigeration, optical edge bead Removal (OEBR) step 536, exposure step 538, post-exposure bake (PEB) step 540, post-PEB refrigeration step 542, development step 550, installation step 508B in the pod. In another embodiment, a series of method steps 501 can be rearranged and modified without changing the basic scope of the invention, removing one or more steps, or combining two or more steps into one Can be a step.

  [00129] The step 508A of removing the substrate from the pod is generally defined as a process that causes the front end robot 108 to remove the substrate from the cassette 106 that is stationary in one of the pod assemblies 1105. The cassette 106 includes one or more substrates “W”, and further, by a user or some external device (not shown) to allow the substrates to be processed in the cluster tool 10 by a substrate processing sequence. It is installed on the pod assembly 105. The substrate processing sequence is defined by the user and controlled by software held in the system controller 101.

  [00130] The BARC coating step 510, or bottom antireflective coating process (hereinafter BARC), is a step used to deposit organic material on the surface of the substrate. Typically, the BARC layer is an organic coat that is applied onto the substrate before the photoresist layer absorbs light, and for this organic coat, an exposure step 538 performed in the stepper / scanner 5 is performed. Light is reflected off the surface of the substrate and can return into the photoresist. If these reflections were not prevented, an optical standing wave was established in the photoresist layer, which caused the feature size to vary from one location on the circuit to another according to the local thickness of the photoresist. The result is that (one or more) are different. Also, since surface topography variation always appears after completion of multiple electronic device fabrication steps, the BARC layer can also be used to smooth (or planarize) the surface topology of the substrate. Filling the periphery and top of the feature with the BARC material allows the photoresist to be more evenly applied, and prevents local variations in photoresist thickness. Typically, the BARC coat step 510 is performed using a conventional spin-on photoresist distribution process. This conventional process is to deposit a certain amount of BARC material on the surface of a rotating substrate, thereby vaporizing the solution in the BARC material, thereby changing the material properties of the deposited BARC material. is there. In many cases, the solution vaporization process and the properties of the layer formed on the surface of the substrate are controlled by controlling the velocity of the air and exhaust streams in the BARC process chamber.

  [00131] The post-BARC bake step 512 is used to ensure that all solution is removed from the BARC layer deposited in the BARC coat step 510, and in some cases promotes adhesion of the BARC layer to the surface of the substrate. Also used to do. The temperature of the post-BARC bake step 512 depends on the type of BARC material deposited on the surface of the substrate, but is generally less than about 250 ° C. The time required to complete the post-BARC bake step 512 depends on the temperature of the substrate during the post-BARC bake step, but is generally less than about 60 seconds.

  [00132] The post-BARC refrigeration step 514 is a step used to control the time that the substrates are held at a temperature above ambient temperature in order to match all the substrates to the same time / temperature profile; As a result, processing variations can be minimized. In many cases, controlling the profile minimizes process variations because variations in the BARC process time / temperature profile, which is a factor in the wafer history of the substrate, can affect the properties of the deposited film layer. Turn into. The post-BARC refrigeration step 514 is typically used to cool the substrate to or near ambient temperature after the post-BARC bake step 512. The time required to complete the post BARC refrigeration step 514 depends on the temperature of the substrate exiting the post BARC bake step, but is generally less than about 30 seconds.

  [00133] The photoresist coating step 520 is a step used to deposit a photoresist layer on the surface of the substrate. The photoresist layer deposited during this photoresist coating step 520 is typically a photosensitive organic coat. This photoresist layer is applied onto the substrate and later exposed within the stepper / scanner 5 to form pattern features on the surface of the substrate. The photoresist coating step 520 is typically performed using a conventional spin-on photoresist distribution process. This conventional process deposits a certain amount of photoresist material on the surface of the substrate while rotating the substrate, thereby evaporating the solution in the photoresist material, thereby material properties of the deposited photoresist layer. Is something that changes. Controlling the vaporization process and the characteristics of the layer formed on the surface of the substrate is performed by controlling the velocity of the air flow and exhaust flow in the photoresist processing chamber. In some cases, the pressure of the solution above the surface of the substrate is partially controlled by controlling the exhaust flow rate and / or injecting the solution near the surface of the substrate, and the photoresist during the photoresist coating step. It is necessary to control the vaporization of the solution from. Referring to FIG. 5A, to complete the photoresist coating step 520, the substrate is first positioned on the spin chuck 1033 in the coater chamber 60A. While the motor rotates the spin chuck 1033 and the substrate, the photoresist is distributed on the center of the substrate. The rotation distributes the angular torque on the photoresist, which pushes the photoresist radially and finally completely covers the substrate.

  [00134] A post-photoresist coat bake step 522 is performed to ensure that all or much of the solution is removed from the photoresist layer deposited during the photoresist coat step 520 and, in some cases, the photoresist layer. A step used to promote adhesion to the BARC layer. The temperature of the post photoresist coat bake step 522 depends on the type of photoresist material deposited on the surface of the substrate, but is generally less than about 250 ° C. The time required to complete the post-photoresist coat bake step 522 depends on the substrate temperature during the post-photoresist bake step, but is generally less than about 60 seconds.

  [00135] Step 524 after refrigeration of the photoresist is the step used to control the time that the substrate is at a temperature above ambient temperature in order to match all the substrates with the same time / temperature profile; This minimizes processing variation. Time / temperature profile variations are often controlled to minimize process variations because they can affect the properties of the deposited film layer. Therefore, after the post-photoresist coating bake step 522 is completed, the temperature of step 524 after refrigeration of the photoresist is used to cool the substrate to ambient temperature or a temperature close thereto. The time required to complete step 524 after refrigeration of the photoresist depends on the temperature of the substrate exiting the step after the photoresist bake, but is generally less than about 30 seconds.

  [00136] Optical edge bead removal (OEBR) step 536 is formed during the deposited photosensitive photoresist layer (s), eg, a layer formed during photoresist coating step 520 or BARC coating step 510. The exposed BARC layer is exposed with a radiation source (not shown) so that one or both of these layers can be removed from the edge of the substrate, and the edge exclusion area of the deposited layer is more evenly controlled It is a process used to make it possible. The wavelength and intensity of the radiation used to expose the surface of the substrate depends on the type of BARC and the photoresist layer deposited on the surface of the substrate. For example, USHIO America. , Inc. OEBR tools can be purchased from (Cypress, CA).

  [00137] The exposure step 538 is a lithographic projection step applied by a lithographic projection apparatus (eg, stepper scanner 5) for the purpose of forming a pattern for use in the manufacture of an integrated circuit (IC). In the exposure step 538, a photosensitive material such as a photoresist layer formed in the photoresist coating step 520 or a BARC layer formed in the BARC coating step 510 (photoresist) is exposed with some electromagnetic radiation. Circuit patterns associated with each layer of the integrated circuit (IC) device are formed on the surface of the substrate. The stepper / scanner 5 can be purchased from Cannon, Nikon, ASML.

  [00138] Post-exposure bake (PEB) step 540 simulates the diffusion of the photoactive compound (s) and heats the substrate immediately after exposure step 538 to reduce the effects of standing waves in the photoresist layer. It is a step used for the purpose. In the case of chemically sensitized photoresists, the PEB step further causes a catalytic chemical reaction, which changes the solubility of the photoresist. Temperature control during PEB is very important for micro dimension (CD) control. The temperature of PEB step 540 depends on the type of photoresist material deposited on the surface of the substrate, but is generally less than about 250 ° C. The time required to complete the PEB step 540 depends on the temperature of the substrate during the PEB step, but is generally less than about 60 seconds.

  [00139] Post-exposure bake (PEB) refrigeration step 542 is used to reliably control the time that the substrates are at a temperature above ambient temperature to match all substrates to the same time / temperature profile. Step, which minimizes process variation. Since variations in PEB processing time / temperature profile can affect the properties of the deposited film layer, this is often controlled to minimize processing variations. Accordingly, the temperature in the post-PEB refrigeration step 542 is used to cool the substrate to or near ambient temperature after the PEB step 540. The time required to complete the post-PEB refrigeration step 542 depends on the temperature of the substrate exiting the PEB step, but is generally less than about 30 seconds.

  [00140] In the development step 550, the pattern formed during the exposure step 538 is created using a solution to cause chemical or physical changes in the exposed and unexposed photoresist and BARC layers. Expose. The development process may be a spray, immersion or paddle type process used to distribute the developer solution. In one embodiment of the development step 550, a rinsing step can be performed after dispensing the solution onto the surface of the substrate to rinse the solution material from the surface of the substrate. The rinse solution dispensed on the surface of the substrate may include deionized water and / or a surfactant.

  [00141] Inserting a substrate in the pod step 508B is generally defined as the process of causing the front end robot 108 to return the substrate to the cassette 106 stationary within one of the pod assemblies 105.

  [00142] FIG. 3B illustrates another embodiment that includes a series of method steps 502 used to perform a track lithographic process on the surface of the substrate. The lithographic process in method step 502 includes all the steps seen in FIG. 3A, except that the BARC coat step 510 and the post-BARC bake step 512 are hexamethyldisilazane (hereinafter “HMDS”). Instead of processing step 511 and refrigeration step 513 after HMDS. In another embodiment, a series of method steps 502 can be rearranged, modified, one or more steps removed, or a combination of two or more steps within a range that does not change the basic scope of the present invention. It can be a single step.

  [00143] The HMDS processing step 511 typically includes a certain amount of HMDS vapor for a short period of time (eg, less than 120 seconds) by heating the substrate to a temperature greater than about 125 degrees. It includes the step of promoting the adhesion of a photoresist layer that is subsequently deposited in a processing sequence by exposing the processing gas to the preparation and drying of the surface of the substrate. Although the use of HMDS vapor was previously described in detail as a chemical used with the HMDS processing step 511, the HMDS processing step 511 is more generally similar to this, promoting the adhesion of the photoresist layer. FIG. 2 illustrates the grade of processing utilized to prepare and dry the surface of the substrate for use. Accordingly, the use of the term “HMDS” herein is not intended to limit the scope of the present invention. In some cases, the HMDS step is referred to as a “steam prime” step.

  [00144] In the post-HMDS refrigeration step 513, the substrate temperature is controlled so that the initial processing temperature of all the substrates entering the photoresist processing step is the same. Variations in the temperature of the substrate entering the photoresist coating step 520 can greatly affect the characteristics of the deposited film layer, so controlling this often minimizes variations in processing. Therefore, the temperature of the post-HMDS refrigeration step 513 is used to cool the substrate to the ambient temperature or a temperature near this after the HMDS treatment step 511. The time required to complete the post-HMDS refrigeration step 513 is typically less than about 30 seconds, depending on the temperature of the substrate exiting the HMDS processing step 511.

  [00145] FIG. 3C illustrates another embodiment of a process sequence or method step 503 for performing a track lithographic process on a substrate. This lithographic process generally includes the following steps: removal from pod 508A, pre-BARC refrigeration step 509, BARC coat step 510, post-BARC bake step 512, post-BARC refrigeration step 514, photoresist. Coating step 520, post-coating bake step 522, post-photo resist refrigeration step 524, antireflection topcoat step 530, post-topcoat bake step 532, post-topcoat refrigeration step 534, optical edge bead removal (OEBR) step 536, Exposure step 538, post-exposure bake (PEB) step 540, post-PEB refrigeration step 542, development step 550, SAFIER ™ (contraction auxiliary film for resolution enhancement) coating step 551 Development bake step 552, the developer after refrigeration step 554 may incorporate the installation step 508B to the pod. The lithographic processing in method step 503 includes all the steps seen in FIG. 3A plus an anti-reflective topcoat step 530, a post-topcoat bake step 532, a post-topcoat refrigeration step 534, a post-development gating step 552, a development. Includes a post-refrigeration step 554 and a SAFIER ™ coat step 551. In another embodiment, the sequence of method steps 503 can be rearranged and modified, one or more steps can be removed, or two or more steps can be combined within a range that does not change the basic scope of the present invention. Can be in one step.

  [00146] The pre-BARC refrigeration step 509 controls the substrate temperature so that the initial processing temperatures of all substrates entering the BARC processing step are the same. The temperature variation of all the substrates entering the BARC coating step 510 can greatly affect the characteristics of the deposited film layer and is often controlled for the purpose of minimizing process variations. Therefore, the temperature of step 509 before BARC is used to cool or heat the substrate transferred from the POD to or near ambient temperature. The time required to complete the pre-BARC refrigeration step 509 depends on the temperature of the substrate in the cassette 106, but is generally less than about 30 seconds.

  [00147] An anti-reflective top coat step 530 or top anti-reflective coat process (hereinafter "TARC") is used to deposit organic material over the photoresist layer deposited during the photoresist coat step 520. It is. The TARC layer is typically used to absorb light, otherwise, if the TARC layer is not used, the light is transmitted to the substrate during the exposure step 538 performed in the stepper / scanner 5. It is reflected by the surface and returns to the photoresist. If this reflection is not prevented, an optical low standing wave is established in the photoresist layer, which causes the feature size to vary from one location on the circuit to another according to the local thickness of the photoresist. The result is that (one or more) are different. The TARC layer can also be used to smooth (or planarize) the surface topography of the substrate that always appears on the device substrate. The antireflective topcoat step 530 is typically performed using a conventional spin-on photoresist distribution process. In this process, a certain amount of TARC material is deposited on the surface of the substrate while rotating the substrate, thereby vaporizing the solution in the TARC material and densifying the TARC layer. The velocity of the air flow and exhaust flow in the coater chamber 60A is controlled to control the solution vaporization process and the properties of the layer formed on the surface of the substrate.

  [00148] The post-topcoat bake step 532 is a step used to ensure removal of all solution from the TARC layer deposited in the anti-reflective topcoat step 530. The temperature of the post-topcoat bake step 532 depends on the type of TARC material deposited on the surface of the substrate, but is generally less than about 250 degrees. The time required to complete the post-topcoat bake step 532 depends on the temperature of the processing performed during the post-topcoat bake step, but is generally less than about 60 seconds.

  [00149] The post-topcoat refrigeration step 534 controls the time that the substrate is at a temperature above ambient temperature so that the time / temperature profiles of all the substrates are matched to minimize processing variations. Is the step used for Variations in the TARC process time / temperature profile, which is a component of the substrate wafer history, can affect the properties of the deposited film layer and are often controlled to minimize process variations. Typically, the post-topcoat refrigeration step 534 is used to cool the post-topcoat bake step 532 to or near ambient temperature. The time required to complete the post-topcoat refrigerated step 534 depends on the temperature of the substrate exiting the post-topcoat bake step 532, but is generally less than about 30 seconds.

  [00150] The post-develop bake step 552 is a step used to ensure removal of all developer solution from the photoresist layer remaining after the development step 550. The temperature of the post-develop bake step 552 depends on the type of photoresist material deposited on the surface of the substrate, but is generally less than about 250 ° C. The time required to complete the post-develop bake step 552 depends on the temperature of the substrate during the post-photoresist bake step, but is generally less than about 60 seconds.

  [00151] The post-development refrigeration step 554 reliably controls the time that the substrate is at a temperature above ambient temperature so as to minimize processing variations by matching the time / temperature profiles of all substrates. Is the step used for Since variations in development processing time / temperature profile may affect the characteristics of the deposited film layer, the processing variations are often minimized by control. Therefore, the temperature of the post-development refrigeration step 554 is used to cool the substrate to ambient temperature or a temperature close thereto after the post-development bake step 552. The time required to complete the post-development refrigeration step 554 depends on the temperature of the substrate exiting the post-development bake step 552, but is generally less than about 30 seconds.

  [00152] The SAFIER ™ (resolution enhancement shrinkage assisting film) coating step 551 is a process in which material is deposited on the photoresist layer remaining after the development step 550, and this is baked in the post-development baking step 552. It is. Typically, the SAFIER ™ process is used to cause physical shrinkage of IC trench patterns, vias, and contact holes while keeping profile degradation very low and further improving line edge roughness (LER) Is done. The SAFIER ™ coating step 551 is typically performed using a conventional spin-on photoresist dispensing process that dispenses a quantity of SAFIER ™ material onto the surface of the rotating substrate.

Processing rack
[00153] FIGS. 4A-4J illustrate a front end processing rack 52, a first central processing rack 152, a second central processing rack 154, a rear processing rack 202, a first rear processing rack 302, a second rear processing rack 304, a first A side view of one embodiment of processing rack 308, second processing rack 309, first central processing rack 312, second central processing rack 314, first rear processing rack 318, and second rear processing rack 319 is illustrated. These processing racks include a plurality of substrate processing chambers that perform various aspects of the substrate processing sequence. In general, the processing rack illustrated in FIGS. 4A-4J includes one or more coater chambers 60A, one or more developer chambers 60B, one or more refrigeration chambers 80, one or more bake chambers 90, one or more PEB chamber 130, one or more support chambers 65, one or more OEBR chambers 62, one or more twin coater / developer chambers 350, one or more bake / refrigeration chambers 800, and / or one or more HMDS chambers One or more processing chambers such as 70 are included, and these processing chambers are further described below. The orientation, type, positioning, and number of processing chambers shown in FIGS. 4A-4J are not intended to limit the scope of the invention, but are intended to illustrate various embodiments of the invention. In one embodiment, the footprint of the cluster tool 10 is reduced by stacking process chambers vertically, or positioning one chamber substantially above another chamber, as shown in FIGS. 4A-4J. ing. In another embodiment, stacking chambers vertically allows the processing chambers to be positioned in a horizontally staggered pattern with one chamber partially riding on top of another chamber, thus providing different physical sizes. When more than one chamber is used, the processing rack space can be used more efficiently. In yet another embodiment, the processing chambers are staggered vertically and / or one side of the processing chamber shares the same plane as another processing chamber, such that the base of the processing chamber does not share the same plane. It is arranged in a staggered manner in the horizontal direction. Minimizing the cluster tool footprint is an important factor in the development of cluster tools because the clean room space where cluster tools are installed is often limited and the construction and maintenance of tools is very expensive.

  [00154] FIG. 4A illustrates a side view of the front end processing rack 52 facing the central robot 107 and located in front of the pod assembly 105 from the outside of the cluster tool 10. FIG. Therefore, this figure corresponds to the diagrams shown in FIGS. 1A to 1B and FIGS. 2A to 2C. In one embodiment shown in FIG. 4A, the front-end processing rack 52 has four coater / developer chambers 60 (labels CD1-CD4), twelve refrigeration chambers 80 (labels C1-C12), and six bake chambers 90. (Labels B1-B6) and / or six HMDS processing chambers 70 (labels P1-P6).

  FIG. 4B illustrates a side view of the first central processing rack 152 facing the central robot 107 as viewed from outside the cluster tool 10. Therefore, this figure corresponds to the diagrams shown in FIGS. 1A to 1B and FIGS. 2A to 2C. In one embodiment shown in FIG. 4B, the first central processing rack 152 includes 12 refrigeration chambers 80 (labels C1-C12) and 24 bake chambers 90 (labels B1-B24).

  FIG. 4C illustrates a side view of the second central processing rack 154 facing the central robot 107 as viewed from outside the cluster tool 10. Therefore, this figure corresponds to the diagrams shown in FIGS. 1A to 1B and FIGS. 2A to 2C. In one embodiment shown in FIG. 4C, the second central processing rack 154 includes four coater / developer chambers 60 (labels CD1-CD4) and four support chambers 65 (labels S1-S4). In one embodiment, four coater / developer chambers 60 are substituted for four support chambers 65.

  FIG. 4D illustrates a side view of the rear processing rack 202 facing the central robot 107 as viewed from outside the cluster tool 10. Therefore, this figure corresponds to the figures shown in FIGS. 1A to 1B and 2B. In one embodiment shown in FIG. 4D, the rear processing rack 202 has four coater / developer chambers 60 (labeled CD1-4), eight refrigerated chambers 80 (labeled C1-8), and two bake chambers 90 (labeled). B1-24) includes four OEBR chambers 62 (labeled OEBR1-4) and six PEB chambers 130 (labeled PEB1-4).

  FIG. 4E illustrates a side view of the first rear processing rack 302 facing the rear robot 109 as viewed from outside the cluster tool 10. Therefore, this figure is the same as that shown in FIG. 2C. In one embodiment shown in FIG. 4E, the first rear processing rack 302 includes four coater / developer chambers 60 (labeled CD1-4), eight refrigerated chambers 80 (labeled C1-8), and two bake chambers. 90 (labels B1 to 24), four OEBR chambers 62 (labels OEBR1 to 4), and six PEB chambers 130 (PEB1 to 6).

  FIG. 4F illustrates a side view of the second rear processing rack 304 facing the rear robot 109 from the outside of the cluster tool 10. Therefore, this figure corresponds to the figure shown in FIG. 2C. In one embodiment shown in FIG. 4F, the second rear processing rack 304 includes four coater / developer chambers 60 (labeled CD1-4) and four support chambers 65 (labeled S1-4). In one embodiment, four coater / developer chambers 60 are substituted for four support chambers 65.

  FIG. 4G illustrates a side view of the first processing rack 308 facing the front end robot 108 from the outside of the cluster tool 10. Therefore, this figure corresponds to the figures shown in FIGS. 2F to 2G. In one embodiment shown in FIG. 4G, the first processing rack 308 includes twelve bake / refrigeration chambers 800 (labeled BC1-12) described below in connection with FIG.

  FIG. 4H illustrates a side view of the second processing rack 309 facing the front end robot 108 from the outside of the cluster tool 10. Therefore, this figure corresponds to the figures shown in FIGS. 2F to 2G. In one embodiment shown in FIG. 4H, the second processing rack 309 includes four coater / developer chambers 60 (labeled CD1-4) and four support chambers 65 (labeled S1-4). In one embodiment, four coater / developer chambers 60 are substituted for four support chambers 65.

  FIG. 4I illustrates a side view of the first central processing rack 312 or the first rear processing rack 318 facing the central robot 107 or the rear robot 109 as viewed from the outside of the cluster tool 10. Therefore, this figure corresponds to the figures shown in FIGS. 2F to 2G. In the embodiment shown in FIG. 4I, the first central processing rack 312 or the first rear processing rack 318 includes eight refrigeration chambers 80 (labeled C1-8) and 14 bake chambers 90 (labeled B1, B2, B3, B5, B6, B7, and the like), four OEBR chambers 62 (labeled OEBR1 to 4), and six PEB chambers 130 (labeled PEB1 to 6). In another embodiment, the first central processing rack 312 or the first rear processing rack 318 is arranged in a configuration that includes 12 refrigeration chambers 80 and 24 bake chambers 90 as illustrated in FIG. 4G. Can do.

  [00163] FIG. 4J illustrates a side view of the second central processing rack 314 or the second rear processing rack 319 facing the central robot 107 (or rear robot 109) as viewed from outside the cluster tool 10. . Therefore, this figure corresponds to the figures shown in FIGS. 2F to 2G. In one embodiment shown in FIG. 4J, the second central processing rack 314 or the second rear processing rack 319 includes four twin coater / developer chambers 350, which include the coater chamber 60A. 4 pairs of processing chambers 370, which can be configured as developer chambers 60B, or combinations thereof.

  FIG. 4K illustrates a side view of the first processing rack 322 facing the front end robot 108 from the outside of the cluster tool 10. Therefore, this figure corresponds to the figure shown in FIG. 2E. In one embodiment shown in FIG. 4K, the first processing rack 322 includes 12 bake / refrigeration chambers 800 (labeled BC1-12). This will be described later in connection with FIGS. 18A-18B.

Coater / Developer Chamber
[00165] The coater / developer chamber 60 may include a BARC coat step 510, a photoresist coat step 520, an anti-reflective top coat step 530, a development step 550, and / or a SAFIER ™ coat step 551 as shown, for example, in FIGS. 3A-3C. A processing chamber that can be adapted to perform In general, the coater / developer chamber 60 can be configured into two main types of chambers: a coater chamber 60A shown in FIG. 5A and a developer chamber 60B (described below) shown in FIG. 5D.

  [00166] FIG. 5A is a vertical cross-sectional view of one embodiment of a coater chamber 60A that can be adapted to perform a BARC coat step 510, a photoresist coat step, and an anti-reflective topcoat step 530. The coater chamber 60A may include an enclosure 1001, a gas flow distribution system 1040, a coater cup assembly 1003, and a fluid distribution system 1025. The enclosure 1001 generally includes a sidewall 1001A, a base wall 1001B, and a top wall 1001C. The coater cup assembly 1003 including the processing region 1004 for processing the substrate “W” further includes a cup 1005, a rotatable spin chuck 1034, and a lift assembly 1030. The rotatable spin chuck 1034 generally includes a spin chuck 1033, a shaft 1032, a rotary motor 1031, and a vacuum source 1015. The spin chuck 1033 is attached to a rotary motor 1031 by a shaft 1032 and includes a sealing surface 1033A adapted to hold a rotating substrate. The substrate is attached to the sealing surface 1033A by using a vacuum generated by a vacuum source 1015. The cup 1005 can be a plastic material (eg, PTFE, PFA, polypropylene, PVDF, etc.), a ceramic material, a metal coated with a plastic material (eg, aluminum or SST coated with either PVDF, Halar, etc.), or a fluid distribution system 1025. It is manufactured from other materials that are compatible with the processing fluid delivered from the factory. In one embodiment, the rotary motor 1031 is adapted to rotate a 300 mm substrate at about 1 to 4000 revolutions per minute (RPM).

  [00167] Generally, the lift assembly 1030 is an actuator (not shown), such as a pneumatic cylinder or servo motor, and a linear ball bearing slide adapted to raise and lower the rotatable spin chuck 1034 to a desired position. A simple guide (not shown) is included. Therefore, the lift assembly 1030 positions the substrate mounted on the rotatable spin chuck 1034 in the cup 1005 during processing, and also includes an external robot (eg, front end robot 108, central robot 107, robot not shown). 109) is adapted to lift the substrate above the top of the cup 1005A. A robot blade 611 attached to an external robot is attached to the enclosure 1001 via an access port 1002 formed in the side wall 1001A.

  [00168] The gas flow distribution system 1040 is adapted to deliver a uniform gas flow through the enclosure 1001 and coater cup assembly 1003 to the exhaust system 1012. In one embodiment, the gas flow distribution system 1040 is a HEPA filter assembly that generally includes a HEPA filter 1041 and a filter enclosure 1044. The HEPA filter 1041 and the filter enclosure 1044 form a plenum 1042. The plenum 1042 may flow from the gas source 1043 and equalize the gas flow through the HEPA filter 1041, the enclosure 1001, and the coater cup assembly 1003. In one embodiment, the gas source 1043 is adapted to deliver gas (eg, air) to the processing region 1004 at a desired temperature and humidity.

  [00169] The fluid distribution system 1025 generally includes one or more fluid source assemblies 1023 that deliver one or more solutions to the surface of the substrate mounted on the spin chuck 1033. FIG. 5A illustrates a single fluid source assembly 1023 that includes a discharge nozzle 1024, a supply tube 1026, a pump 1022, a filter 1021, a suction return valve 1020, and a fluid source 1019. Support arm actuator 1028 is adapted to move discharge nozzle 1024 and dispensing arm 127 to a desired position. Thereby, the processing fluid can be distributed from the discharge nozzle 1024 to a desired position on the substrate. The processing fluid can be delivered to the discharge nozzle 1024 using the pump 1022. The pump 1022 removes the processing fluid from the fluid source 1019 and discharges the processing fluid onto the surface of the substrate through the filter 1021, the suction return valve 1020, and the discharge nozzle 1024. The processing solution discharged from the discharge nozzle 1024 can be distributed onto the substrate “W” being rotated by the spin chuck 1033. The suction return valve 1020 is adapted to draw a certain amount of solution back from the discharge nozzle 1024 after a desired amount of processing fluid has been dispensed onto the substrate to prevent unwanted material from dripping onto the substrate. Has been. The distributed processing solution is scattered from the edge portion of the substrate by rotating the substrate, collected by the inner wall of the cup 1005, sent to the drain pipe 1011, and finally sent to the waste collection system 1010.

Photoresist thickness control chamber
[00170] FIG. 5B is a side view of another embodiment of a coater chamber 60A that can be adapted to perform a BARC coat step 510, a photoresist coat step, an anti-reflective topcoat step 530, for example. The embodiment shown in FIG. 5B can be used during one or more stages of the deposition step to control the vaporization of the solution from the surface of the material deposited on the surface of the substrate to improve the thickness uniformity process results. It can be adapted to form an enclosure around the substrate. Traditionally, thickness uniformity control in a typical spin-on type coating process relies on control of substrate rotation speed and discharge flow rate to control the vaporization of the uniformity of the last deposited layer. Control of thickness uniformity depends on the air flow across the surface of the substrate during the processing step. The rotational speed during processing typically increases the diameter of the substrate processed in the coater chamber 60A as the likelihood of aerodynamic variation across the surface of the substrate (eg, laminar to turbulent transition) increases. It is lowered by that. It is believed that the aerodynamic variation is caused by variations in the wind speed as a function of the substrate radius due to the “pumping effect” caused by the speed applied to the air interacting with the substrate surface. One problem arises in that the time taken to complete the coating step varies depending on the ability to diffuse and remove the required amount of solution into the thin photoresist layer, i.e., each substrate rotation speed. The faster the rotation speed, the shorter the processing time. Thus, in one embodiment, an enclosure is placed around the substrate to control the ambient environment around the surface of the substrate, thereby improving thickness uniformity control for larger substrates. An enclosure formed around the substrate tends to block gas flow across the surface of the substrate, which allows the photoresist to diffuse before a significant amount of solution evaporates from the photoresist, thus ensuring uniformity. It is believed that the improved control is due to the control of solution vaporization.

  [00171] The coater chamber 60A in this embodiment generally includes an enclosure 1001, a gas flow distribution system 1040, a coater cup assembly 1003, a processing enclosure assembly 1050, and a fluid distribution system 1025. The embodiment illustrated in FIG. 5B includes a number of components described above with reference to the coater chamber 60A described in FIG. 5A, and therefore, for clarity purposes, the same or similar components are labeled with the same reference numerals. Also used in 5B. Note that in this embodiment, the spin chuck 1033 illustrated in FIG. 5A is replaced by an enclosure coater chuck 1056 having an enclosure coater chuck sealing surface 1056A on which the substrate rests and a chuck base region 1056B. Should.

  [00172] FIG. 5B illustrates the processing enclosure assembly 1050 in the processing position. Because the enclosure lid 1052 is separate from the chuck base region 1056B, it can be attached to an external robot (eg, front end robot 108, central robot 107, etc.) when in the “exchange position” (not shown). Note that the robot blade 611 can be used to transfer the substrate to the enclosure coater chuck 1056. The processing enclosure assembly 1050 includes an enclosure lid 1052 and a chuck base region 1056B to form a processing region 1051 around the substrate so that the processing environment can be controlled during multiple different stages of the coating process. In general, the processing enclosure assembly 1050 includes an enclosure lid 1052, a spin chuck 1033, a rotating assembly 1055, and a lift assembly 1054. The lift assembly 1054 generally includes a lift actuator 1054A and a lift mounting bracket 1053 that are attached to the surfaces of the rotating assembly 1055 and the enclosure 1001. The lift actuator 1054A generally includes an actuator (not shown) such as an air cylinder or a DC servo motor and a guide (not shown) such as a linear ball bearing slide. These are adapted to raise and lower all components except the spin chuck 1033 contained within the processing enclosure assembly 1050.

  [00173] The rotating assembly 1055 generally includes one or more rotating bearings (not shown) and a housing 1055A. These are adapted to rotate the enclosure lid 1052 with the rotation of the enclosure coater chuck 1056. In one embodiment, when the spin chuck 1033 is rotated by the rotary motor 1031, the housing 1055 </ b> A rotates due to friction generated by the contact between the enclosure lid 1052 and the chuck base region 1056 </ b> B. The enclosure lid 1052 is attached to the rotary bearing via a lid shaft 1052A. In one embodiment, contact between enclosure lid 1052 and chuck base region 1056B is initiated by operation of lift assembly 1030, lift assembly 1054, or both of these cooperating lift assemblies.

  [00174] In one embodiment, a seal is formed when the enclosure lid 1052 and the chuck base region 1056B are in contact, creating an enclosed processing environment around the substrate. In one embodiment, the volume of the processing region 1051 is provided somewhat smaller to control the evaporation of the solution from the photoresist on the surface of the substrate, eg, up to the substrate in the enclosure lid 1052 and / or chuck base region 1056B. The gap may be about 3 mm.

  [00175] In one embodiment, the enclosure lid 1052 and chuck base region 1056B are in contact and the substrate is rotated at a first rotational speed while the photoresist material is a clearance hole (not shown) in the lid shaft 1052A. It is sent to the processing area 1051 through an inner pipe (not shown). In this step, the photoresist is diffused due to the centrifugal force effect caused by the rotation, but the solution-rich vapor is formed on the surface of the substrate, thereby regulating the ability of the photoresist to change properties. Is done. After dispensing the photoresist, the enclosure lid 1052 and the enclosure coater chuck 1056 can be rotated at a second rotational speed until the photoresist is thin, and when the desired thinness is obtained, the enclosure lid 1052 is raised from the surface of the enclosure coater chuck 1056 to allow the solution remaining in the photoresist to escape. This completes the final solution evaporation process.

  [00176] In another embodiment, the photoresist is dispensed using a conventional extrusion dispensing process (eg, flushing a photoresist dispensing arm (not shown) over a stationary substrate) and then processing the substrate. Enclosed in enclosure assembly 1050 and rotated at the desired speed to achieve a uniform layer of the desired thickness. When the desired thickness is achieved, the enclosure lid 1052 is separated from the enclosure coater chuck 1056 to allow the solution to evaporate from the photoresist.

  [00177] In one embodiment of the enclosure lid 1052, a plurality of holes 1052B are formed in the outer wall of the enclosure lid 1052 for removing excess photoresist from the processing area 1051 during processing. In this configuration, since there are no inflow and / or outflow points, the air flow across the surface of the substrate is blocked or minimized by centrifugal forces acting on the air and the photoresist. In this configuration, air and photoresist flow out of hole 1052B due to the centrifugal force acting on it, and the pressure in processing region 1051 drops below ambient pressure. In one embodiment, changing the rotational speed of the substrate, enclosure lid 1052, and enclosure coater chuck 1056 changes the pressure in the process area during the different stages of the process, thereby evaporating the photoresist. Can be controlled.

  [00178] In one embodiment, during processing, solution rich vapor is injected into the processing region 1051 from the hole in the lid shaft 1052A to control the final thickness and uniformity of the photoresist layer. Is done.

Showerhead fluid distribution system for solution / developer distribution
[00179] In prior art designs, in an attempt to achieve a uniform and repeatable photoresist layer on the surface of the substrate, the coater chamber cup profile design, the method of spinning the substrate, the change in air flow over the chamber processing region, the photo The design of photoresist distribution hardware to improve the resist layer distribution process is emphasized. These designs achieve a level of uniformity at various levels of complexity and cost. Further improvements are needed due to the need to reduce CoO and meet ever increasing processing uniformity.

  [00180] FIG. 5C illustrates one embodiment of a coater / developer chamber 60 that includes a fluid distribution device 1070 adapted to deliver fluid to the surface of the substrate and expand the results of process uniformity. . In one aspect of the invention, the vaporization process can be controlled by using the fluid found in the photoresist layer. In this configuration, the lift assembly 1074 can be used to raise and lower the fluid distribution device 1070 relative to the surface of the substrate. Thereby, an optimal gap can be achieved between the fluid distribution device 1070 and the surface of the substrate, and the surface of the deposited layer can be evenly saturated with the distributed fluid. In one embodiment, this gap is about 0.5-15 mm. The lift assembly 1074 generally includes a lift actuator 1074A and a lift mounting bracket 1073 that can be attached to the surface of the showerhead assembly 1075 and the enclosure 1003. The lift actuator 1074 generally includes an actuator (not shown) such as an air cylinder or a DC servo motor and a guide (not shown) such as a linear ball bearing slide, which is a fluid distribution device 1070. It is adapted to raise and lower all components within.

  [00181] FIG. 5C illustrates the fluid distribution device 1070 in the processing position. The fluid distribution device 1070 includes a showerhead assembly 1075 that forms a processing region 1071 between the substrate and the fluid distribution device 1070 so that the processing environment can be controlled during different stages of the coating process. In general, the fluid distribution device 1070 includes a showerhead assembly 1075, a fluid source 1077, and a lift assembly 1074.

  [00182] The showerhead assembly 1075 generally includes a showerhead base 1072, a shaft 1072A, and a showerhead plate 1072D. Shaft 1072A is attached to showerhead base 1072 and has a central hole 1072B formed in the shaft for delivering fluid from fluid source 1077 to plenum 1072C formed in showerhead base 1072. A plurality of holes 1072F are formed in the showerhead plate 1072D attached to the showerhead base 1072, and these holes connect the plenum 1072C and the fluid source 1077 to the lower surface 1072E of the showerhead 1072D. During processing, the processing fluid is distributed from the fluid source 1077 into the central hole 1072B, and the processing fluid enters the plenum 1072C and passes through the plurality of holes 1072F to form a processing region 1071 formed between the substrate and the lower surface 1072E. It flows in. In one embodiment, the size of the holes, the number of holes, and the distribution of the plurality of holes 1072F across the showerhead plate 1072D are designed to deliver the processing fluid evenly to the processing region 1071. In another embodiment, the size of the holes, the number of holes, and the distribution of the plurality of holes 1072F across the showerhead plate 1072D is unequal across the showerhead plate 1072D delivering a desired unequal distribution of processing fluid to the processing region 1071. Are separated. Uneven patterns are useful for correcting thickness variations caused by aerodynamics or other effects that can cause thickness variations in the deposited photoresist layer.

  [00183] In one embodiment, the showerhead assembly 1075 includes a motor 1072G and a rotating seal 1072H, which are adapted to rotate during processing and deliver processing fluid to the showerhead assembly 1075. The rotational seal 1072H may be a dynamic lip seal or other similar device as is well known in the art.

Photoresist nozzle rinse system
[00184] FIGS. 6A-6B are isometric views illustrating one embodiment of the fluid source assembly 1023 described above further including a containment vessel assembly 1096. FIG. To reduce the possibility of contamination of the discharge nozzle 1024 during an ideal time or between processing steps, to try to prevent the processing fluid in the supply tube 1026 from drying out and / or to fluid The discharge nozzle 1024 is positioned above the container opening 1095A (see FIG. 6A) to clean various components of the source assembly 1023 (eg, the discharge nozzle 1024, supply tube outlet 1026A, etc.) and within the environmental region 1099 The controlled region is formed. This configuration is advantageous when using processing fluids such as photoresists that are easy to dry and flake and cause particle problems when the discharge nozzle 1024 is moved over the surface of the substrate in subsequent processing steps. In one embodiment, the discharge nozzle 1024 shown in FIGS. 6A-6B is a nozzle body configured to hold and support the supply tube 1026 so that process fluid can be cleanly and repeatedly dispensed from the supply tube outlet 1026A. Includes 1024A.

  [00185] FIG. 6A illustrates a configuration in which the discharge nozzle 1024 is separate from the enclosure assembly 1096 so that it can be rotated to dispense processing fluid onto the surface of the substrate. Generally, the enclosed container assembly 1096 includes one or more rinse nozzles 1090, a container 1095, a drain 1094, and a container opening 1095A. A rinse nozzle 1090 connected to the tube 1090A is in communication with one or more fluid delivery sources 1093 (two fluid delivery sources are shown in FIGS. 6A-6B, see 1093A-1093B). In general, drain pipe 1094 is connected to a waste collection system 1094A.

  [00186] Referring to FIG. 6B, in an attempt to reduce contamination of the substrate during processing, one or more rinse nozzles 1090 attached to the fluid delivery source 1093 for delivering one or more cleaning solutions to the nozzle. Is used to clean the discharge nozzle 1024 and the supply tube outlet 1026A. In one embodiment, the cleaning solution is capable of removing residual photoresist after completion of the application process. The number of nozzles and their orientation can be arranged in such a way that all sides and surfaces of the discharge nozzle 1024 and supply tube outlet 1026A are cleaned. After cleaning, the residual vapor held in the environmental region 1099 of the container 1095 is used to prevent the processing fluid (one or more types) held in the supply pipe 1026 from drying out completely. it can.

When to use photoresist temperature control
[00187] Since the temperature of the distributed photoresist has a significant effect on properties and processing results, the temperature of the distributed photoresist is often tightly controlled to ensure a uniform and repeatable coating process. The optimum distribution temperature varies from photoresist to photoresist. As such, coater chamber 60A may include multiple fluid source assemblies 1023 to perform different processing recipes that include different photoresist materials, so that the desired processing results are consistently and reliably obtained. Each of the temperatures of the fluid source assembly 1023 needs to be controlled. Embodiments of the present invention provide various hardware and methods for controlling the temperature of the photoresist prior to dispensing on the surface of the substrate during the coating or developing process.

  [00188] In one embodiment as shown in FIGS. 6A, 6B, the discharge nozzle 1024 heats and / or cools the nozzle body 1024A, the supply tube 1026, and the processing fluid contained in the supply tube 1026. A heat exchange device 1097 adapted to the above. In one embodiment, the heat exchange device is a resistive heater adapted to control the temperature of the process fluid. In another embodiment, the heat exchange device 1097 controls the temperature of the processing fluid using a fluid temperature controller (not shown) that directs the working fluid to the fluid heat exchanger to control the temperature of the processing fluid. Is a fluid heat exchanger adapted to In another embodiment, the heat exchange device is a thermoelectric device adapted to heat or cool the process fluid. 6A and 6B show a heat exchange device 1097 in communication with the nozzle body 1024A, and another embodiment of the present invention provides the heat exchange device 1097 to efficiently control the temperature of the processing fluid. Configurations in contact with tube 1026 and / or nozzle body 1024A may be included. In one embodiment, the length of the supply tube 1026 is temperature controlled using a second heat exchanger 1097A. This ensures that all of the dispensed processing fluid volume retained within the supply tube internal volume 1026B can be dispensed onto the surface of the substrate at the desired temperature during the next processing step. The second heat exchanger 1097A may be an electric heater, a thermoelectric device and / or a fluid heat exchange device as described above.

  [00189] In one embodiment, the enclosure container assembly 1096 sets the temperature of the processing fluid in the nozzle body 1024A and supply tube 1026 when the discharge nozzle 1024 is positioned above the container opening 1095A (see FIG. 6B). Temperature controlled to maintain a consistent temperature. With reference to FIGS. 6A-6B, a container heat exchange apparatus 1098 attached to the wall of the container 1095 can be used to heat or cool the container 1095. The vessel heat exchange device 1098 may be a thermoelectric device and / or a fluid heat exchange device as described above, which are used with the system controller 101 to control the temperature of the vessel 1095.

  [00190] In one embodiment, the temperature of the rinse nozzle 1090 connected to the tubing 1090A is sprayed to the discharge nozzle 1024 and the supply tube outlet 1026A so that the processing fluid in the supply tube 1026 is not heated or refrigerated during the cleaning process. The temperature is controlled so that the cleaning solution is at the desired temperature.

Coater nozzle installation system
[00191] In order to ensure uniform and repeatable processing results, it is preferable to strictly control the position on the surface of the substrate on which the photoresist material is dispensed. The uniformity of the deposited photoresist layer is affected by the position at which the photoresist is deposited on the surface of the substrate. Therefore, it is common to precisely control the position of the dispensing arm 1027 using an often expensive support arm actuator 1028 that allows accurate positioning of the discharge nozzle 1024. It is common for coater chamber 60A to have a plurality of discharge nozzles 1024 to dispense a plurality of different photoresist materials, but this necessitates precise or precise control of a number of dispensing arms 1027, so that the coater The cost and complexity of the chamber 60A is greatly increased. Accordingly, various embodiments of the present invention provide an apparatus and method that utilizes a single dispensing arm 1027 that is easy to calibrate because only one arm performs calibration and precise control. In this configuration, the multiple discharge nozzles 1024 found in the various fluid source assemblies 1023 can be replaced with a single dispensing arm 1192 using the shuttle assembly 1180 (FIG. 7A). In one embodiment, the distribution arm 1192 is adapted to provide only one degree of freedom for control (eg, one linear direction (z direction)). Thus, this configuration allows for more precise and repeatable discharge nozzle 1024 position control, reducing arm complexity, system cost, usable substrate scrap, and the need for calibration.

  [00192] FIG. 7A is a plan view of one embodiment of a dispensing arm system 1170 found in the coater chamber 60A utilizing a dispensing arm 1192 having one degree of freedom. In this configuration, the dispensing arm system 1170 generally includes a dispensing arm assembly 1190, a shuttle assembly 1180, and a carrier assembly 1160. In general, the dispensing arm assembly 1190 includes a dispensing arm 1192, a nozzle mounting location 1193 formed in or on the dispensing arm 1192, and an actuator 1191. In one embodiment, the nozzle retention feature 1194 is adapted to grip the discharge nozzle 1024 placed at the nozzle mounting location 1193 by the shuttle assembly 1180. The nozzle retention feature 1194 may be a spring loaded or pneumatic actuator that grips or interlocks with the feature on the discharge nozzle. The actuator 1191 is, for example, an air cylinder or another device that can move the distribution arm 1192 up and down. In one embodiment, the actuator 1191 further includes a linear guide (not shown) that assists in controlling the placement or movement of the dispensing arm 1192 as it moves from one position to another.

  [00193] The carrier assembly 1160 generally includes two or more fluid source assemblies including a nozzle support 1161, a discharge nozzle 1024 and a supply tube 1026 (showing six discharge nozzles 1024 and a fluid source assembly 1023). 1023 and a rotary actuator (not shown). The rotary actuator is adapted to rotate the nozzle support 1161 and all the discharge nozzles 1024 and associated supply pipes to a desired position using instructions from the system controller 101.

  [00194] The shuttle assembly 1180 is adapted to pick up the discharge nozzle 1024 from the carrier assembly 1160 and rotate the discharge nozzle 1024 to transfer it to the nozzle mounting location 1193 on the dispensing arm 1192. The shuttle assembly 1180 generally includes an actuator assembly 1181, a shuttle arm 1182, and a nozzle transfer feature 1183. The nozzle transfer feature 1183 is adapted to engage with or grasp the discharge nozzle 1024. Thus, the discharge nozzle 1024 can be removed from the carrier assembly 1160 and transferred to the nozzle mounting position 1193, and returned to the carrier assembly 1160 from the nozzle transfer position 1193 after the processing is completed. Actuator assembly 1181 typically includes one or more actuators that are adapted to raise and lower shuttle assembly 1180 and rotate shuttle arm 1182 to a desired position. Actuator assembly 1181 includes, for example, one or more of an air cylinder, an AC servo motor attached to a lead screw, and an AC servo linear motor to complete a lifting task. In addition, the actuator assembly 1181 can include, for example, one or more of an air cylinder, a stepper motor, and an AC servo motor to complete the rotation task.

  [00195] Shuttle arm 1182 rotates from a home position (see symbol “A” in FIG. 7A) to a position above carrier assembly 1160 and then vertically until it reaches a nozzle pick-up position (not shown) Moving. Thereafter, the carrier assembly 1160 rotates so that the discharge nozzle 1024 can engage the nozzle transfer feature 1183 (see reference “B”). Next, the shuttle arm 1182 moves vertically to separate the discharge nozzle 1024 from the carrier assembly 1160 and then rotate until the discharge nozzle 1024 is positioned over the nozzle mounting position 1193 in the dispensing arm 1192. The shuttle arm 1182 moves vertically until the discharge nozzle 1024 is placed over the nozzle mounting position 1193. After the shuttle arm 1182 moves vertically, the shuttle arm 1182 rotates to return to the home position (see reference numeral “A”). Next, an actuator 1191 in the dispensing arm assembly 1190 moves the discharge nozzle to a desired position (see reference “W”) on the surface of the substrate so that a substrate processing step can be initiated. To remove the discharge nozzle 1024, the steps are reversed.

  [00196] FIG. 7B illustrates another embodiment of a dispensing arm system 1170 in which the dispensing arm assembly 1190 has two degrees of freedom, such as two degrees of freedom, or one degree of linear freedom (x-direction). ), And has a vertical degree of freedom (z direction). The dispensing arm assembly 1190 that is part of the embodiment shown in FIG. 7A is not part of the dispensing arm system 1170 shown in FIG. 7B, thus reducing the complexity of the coater chamber 60A. In one embodiment, the nozzle, retention feature 1184 is adapted to grip or hold the discharge nozzle 1024 when positioned within the nozzle transfer feature 1183. FIG. 7B further illustrates another usable configuration of a nozzle retention feature 1184 useful for holding and transporting the discharge nozzle 1024. In operation, the shuttle arm 1182 rotates from the home position (reference “A” in FIG. 7B) to a position above the carrier assembly 1160 and then moves vertically until it reaches a nozzle pick-up position (not shown). The carrier assembly 1160 then rotates so that the discharge nozzle 1024 can engage the nozzle transfer feature 1183 (see reference “B”). Subsequently, the shuttle arm 1182 moves vertically to cause the discharge nozzle 1024 to become separate from the carrier assembly 1160 and then rotate until the discharge nozzle 1024 is positioned over a desired position on the surface of the substrate. Once the shuttle arm 1182 has moved vertically until it reaches the desired position on the surface of the substrate (see reference “W”), the processing step can begin. To remove the discharge nozzle 1024, the steps continue in the reverse direction.

  [00197] In one embodiment, the carrier assembly 1160 waits for the nozzle body 1024A and processing fluid in the supply tube 1026 to be transferred to the shuttle assembly 1180 and carried over the surface of the substrate. A plurality of enclosure assemblies 1096 (not shown in FIGS. 7A-7B (see FIGS. 6A-6B)) that are temperature controlled to ensure that they are maintained at a consistent temperature.

Developer chamber
[00198] Referring to FIG. 5D, there is a side view of one embodiment of a developer chamber 60B that can be adapted to perform, for example, a development step 550 and a SAFIER ™ coat step 551. In one embodiment, developer chamber 60B generally includes all components contained within coater chamber 60A, so that reference is made to developer chamber 60B (which is "developer chamber 60A"?). Some components of the developer chamber 60B that are the same or similar to those described have the same number.

  [00199] In one embodiment, a developer chamber 60B containing the fluid distribution device 1070 described above is adapted to deliver an even flow of developer processing fluid to the surface of the substrate during development processing. In one embodiment, the size of the holes, the number of holes, and the distribution of the plurality of holes 1072F are designed to deliver the processing fluid evenly to the processing region 1071 formed between the substrate and the bottom surface of the fluid distribution device 1070. ing. In another embodiment, the size of the holes, the number of holes, and the distribution of the plurality of holes 1072F may result in an unequal distribution of developer processing fluid to the processing region 1071 formed between the substrate and the bottom surface of the fluid distribution device 1070. Designed to send out.

Developer endpoint detection mechanism
[00200] FIG. 8A is a side view of one embodiment of a developer chamber 60B that includes a developer endpoint detector assembly 1400. FIG. Developer endpoint detector assembly 1400 performs a light scatterometry type technique using a laser and one or more detectors to determine the endpoint of development step 550. In one embodiment, a single wavelength of radiation or beam (see reference “A”) emitted from laser 1401 is applied to the surface of the substrate on which the exposed photoresist layer is deposited. Collide at an angle less than a right angle. Beam “A” is reflected off the surface of the substrate, and detection 1410 detects the intensity of the reflected radiation “B”. In one embodiment, the detector 1410 is oriented to receive the primary reflection from the surface of the substrate and is therefore aligned with the incident beam (eg, at the same angle and in the same direction relative to the surface). Aligned). The intensity of the detected radiation as the soluble portion of the photoresist dissolves in the developer during the development step 550 due to interference between the impinging beam and the pattern formed in the photoresist during the exposure step 538 This creates a “grating” type pattern that more and more interferes with the collision beam. Therefore, the collision beam is scattered by the interference with the photoresist pattern, and the detected main reflection is reduced. In one embodiment, endpoint detection is asymptotically approaching zero with the reflected intensity measured at detector 1410.

  [00201] The range on the surface of the substrate onto which the beam emitted from laser 1401 is projected is defined as the detection range. In one embodiment, the size of this detection range is changed or controlled to minimize the amount of noise included in the detected signal. Noise in the detected signal is generated due to variations in pattern topology seen near the detection range during processing.

  [00202] In one embodiment, a tunable laser is used instead of a single wavelength laser to more easily detect changes in photoresist pattern sharpness as the development process proceeds. The amount of interference depends on the “grating” formed and the wavelength of the incident radiation. In another embodiment, a plurality of detectors (see 1410-1412) that can detect primary reflections and the amount of scattered radiation assist in determining the development endpoint. In another embodiment, a CCD (Charge Coupled Device) array is used to scatter and shift the intensity of the reflected radiation. In one embodiment, noise is prevented from being generated from reflections emitted from the processing fluid held on the surface of the substrate during processing, and the reflections reach the detector by using slits. This can be prevented.

  [00203] For a product substrate that typically already has a pattern on the surface of the substrate, the steps shown in FIG. 8B can be used. This processing step includes a measurement of the initial intensity of the scattered radiation prior to the execution of the development step 550 (1480). Next, the contribution from the pattern present on the surface of the substrate is obtained by measuring the intensity during the development process and comparing it with the initial data (reference numeral 1482). This method may only be necessary if a photoresist profile is desired. Where all intensity changes over the development period are desirable, the use of a single wavelength is all that is necessary, so the information related to the underlying scattering is generally unnecessary.

  [00204] If detailed knowledge of the pattern is required, an active modification of variable refraction (reference 1484 in FIG. 8C) is probably required at the developer surface. The active correction unit works by having a plurality of small mirrors (reference numerals 1425-27) that adjust variations in the developer fluid surface by external variations and adjust in place to correct for angular changes. . Further, FIG. 8C illustrates one such mirror, which uses knowledge of the change in refraction of the incident beam “A” obtained via input from the vertical beam (reference C). Yes. In particular, as the developer fluid surface deviates from flatness and undulation, the normal reflection of the laser beam (reference C) from the laser 1451 is detected in the detector 1453 using the beam splitter 1452. In this configuration, the detector 1453 may be a CCD that can sense the change in angle of the reflected beam caused by the change in angle that causes the beam “C” to strike the surface of the developer fluid. The system controller 101 can detect a change in the position of the peak intensity on the CCD array in relation to the CCD array, and thus know the amount of change in the reflection angle. Knowing this amount of change, the angle of the active mirrors 1425-1427 can be adjusted and the position of the reflected beam “B” can be sent to one or more detectors 1410-1412. This instantaneous deviation in the spatial position of the reflection needs to correlate well with the deviation at the developer fluid surface. Therefore, using a suitable control system, a spatial correlation for the reflected beam can be created using a mirror (reference numerals 1425-1427) that actively positions the detected reflected beam position variations.

  [00205] The active mirrors 1425-1427 may be small and compact, such as those used on micromirror chips sold by TI (Dallas, TX) (reference numerals 1425-1427). These are clearly shown more widely apart in FIG. 8C. Active mirrors are designed to correct for developer surface variations that cause beam divergence as described above.

Twin coater and developer chamber
[00206] FIGS. 9A-9B are top views of one embodiment of a twin coater / developer chamber 350 that includes two separate processing chambers 370 and a central region 395. FIG. This configuration is advantageous because it allows several common components in the two chambers to be shared, thereby increasing system reliability and reducing system cost and cluster tool complexity and footprint. It is. In one embodiment, processing chamber 370 generally includes all of the processing components described above in connection with coater chamber 60A or developer chamber 60B. In this case, however, the two chambers are adapted to share a fluid distribution system 1025. Central region 395 includes shutter 380 and a plurality of nozzles 391 that are included in nozzle holder assembly 390. As described above, the fluid distribution system 1025 used in the coater or developer chamber includes one or more fluid source assemblies 1023 that deliver one or more processing fluids to the surface of the substrate mounted on the spin chuck 1033. Is included. Each nozzle 391 included in the fluid source assembly 1023 is typically connected to a supply tube 1026, a pump 1022, a filter 1021, a suction return valve 1020, a fluid source 1019 and emits one type of processing fluid. Has been adapted to. This allows each fluid source assembly 1023 to be used in either the left or right process chamber 370, thus reducing the redundancy required for each process chamber. 9A-9B illustrate a configuration in which the nozzle holder assembly 390 includes five nozzles 391, but in another embodiment, the nozzle holder assembly 390 does not change the basic scope of the present invention. Less than or more than five nozzles can be included.

  [00207] FIG. 9A illustrates a twin coater / developer chamber 350 that positions the nozzle arm assembly 360 above the right processing chamber 370 and distributes processing fluid onto the substrate "W" held on the spin chuck 1033. It is a top view. The nozzle arm assembly 360 includes an arm 362 and a nozzle holding mechanism 364. The nozzle arm assembly 360 is attached to an actuator 363 adapted to transport the nozzle arm assembly 360 and position it at any position along the guide mechanism 361. In one embodiment, the actuator is adapted to move the nozzle arm assembly 360 vertically, so that the nozzle 391 is accurately positioned above the substrate during processing, and the nozzle holding mechanism 364 causes the nozzle holder assembly 390 to move. The nozzle 391 can be taken up and lowered. The system controller 101 is adapted to control the position of the nozzle arm assembly 360 so that the nozzle holding mechanism 364 can pick up and lower the nozzle 391 from the nozzle holder assembly 390. To prevent cross-contamination of the substrate during processing, a shutter 380 is closed so that one processing chamber and yet another processing chamber 370 is closed and moved vertically to isolate it from the central region 395. Have been adapted. In one aspect, the shutter 380 is adapted to sealably isolate one processing chamber 370 and yet another processing chamber 370 from the central region 395 during processing. By using a conventional O-ring and / or another lip seal, it is possible to have the shutter separably isolate the two processing chambers.

  [00208] FIG. 9B is a plan view of a twin coater / developer chamber 350 with the nozzle arm assembly 360 positioned above the left processing chamber 370 to distribute the processing fluid onto the substrate held on the spin chuck 1033. FIG. It is.

  [00209] In one embodiment, a twin coater / developer chamber 350, not shown, includes two nozzle arm assemblies 360. The nozzle arm assembly 360 is adapted to access the nozzles 391 in the central region 395 to position one nozzle above the surface of the substrate. In this configuration, each processing chamber shares a pump and distributes from two different nozzles 391 to process two substrates using the same processing fluid, or two types within each chamber. Different processing fluids can be dispensed.

Refrigerated chamber
[00210] FIG. 10A is adapted to perform a post-BARC refrigeration step 514, a photoresist refrigeration step 524, a topcoat refrigeration step 534, a PEB refrigeration step 542, and / or a post-development refrigeration step 554. 2 is a vertical cross-sectional view illustrating one embodiment of a possible refrigeration chamber 80. FIG. In general, the refrigeration chamber 80 includes an enclosure 86, a refrigeration plate assembly 83, a support plate 84, and a lift assembly 87. The enclosure 86 is formed by a plurality of walls (reference numerals 86B to 86, reference numeral 85) for forming the processing region 86A by isolating the processing executed in the refrigeration chamber 80 from the surrounding environment. In one aspect of the invention, it is adapted to thermally isolate and minimize the possibility of air pollution in the refrigeration chamber 80.

  [00211] Generally, the refrigeration plate assembly 83 includes a heat exchange device 83A and a refrigeration plate block 83B. The refrigeration plate block 83B is a material that is refrigerated by the heat exchange device 83A to perform the various refrigeration processes described above (for example, the pre-BARC refrigeration step 509, the BARC refrigeration step 514, the post-photoresist refrigeration step 524, etc.). Is a heat conduction block. The refrigeration plate block 83B is thermally conductive in order to improve temperature uniformity during processing. In one embodiment, the refrigeration plate block 83B may be made from aluminum, graphite, aluminum nitride, or other thermally conductive material. In one embodiment, the surface of the refrigeration plate block 83B that is in contact with the substrate “W” is Teflon-saturated anode aluminum, silicon carbide, or other substrate back surface when the back surface of the substrate is in contact with the refrigeration plate block 83B. Coated with a material that minimizes the formation of particles in In one embodiment, the substrate “W” is stationary on pins (not shown) embedded in the surface of the refrigeration plate block 83B, so that the gap between the substrate and the refrigeration plate block 83B is reduced. Production is reduced. In another embodiment shown in FIG. 10A, the heat exchange device 83A is formed on the surface of the refrigeration plate block 83B and is temperature controlled using a heat exchange fluid that flows continuously in the channel 83C. It consists of A fluid temperature controller (not shown) is adapted to control the temperature of the heat exchange fluid as well as the refrigeration plate block 83B. The heat exchange fluid may be, for example, a perfluoropolyether (eg, Galden®) that is temperature controlled to about 5-20 ° C. The heat exchange fluid may be refrigerated water delivered at a desired temperature of about 5-20 ° C. Further, the heat exchange fluid may be a temperature controlled gas such as argon or nitrogen.

  [00212] In one embodiment of the refrigeration plate, the heat exchange device 83A is adapted to heat and cool a substrate that is stationary on the surface of the refrigeration plate block 83B. This configuration is advantageous because the time required to achieve the desired process low point temperature depends on the temperature difference between the substrate and the refrigeration plate block 83B. Therefore, when the refrigeration plate block 83B is set to a fixed temperature, or when it is desirable to cool the substrate to this fixed temperature, the fixed temperature is brought about by a small temperature difference between the substrate and the refrigeration plate block 83B. It takes a very long time to cool the last few degrees to reach. By actively controlling the temperature of the refrigeration plate block 83B, a large temperature difference is maintained between the substrate and the refrigeration plate block 83B until the substrate temperature reaches or near the desired set point temperature, and then the refrigeration plate block If the 83B temperature is adjusted to minimize the amount of undershoot or overshoot within the substrate temperature, the time required to achieve the desired temperature can be reduced. The temperature of the refrigeration plate block 83B is removed from the refrigeration plate block 83B by the heat exchange device 83A, or a conventional temperature sensing device used with the system controller 101 for the purpose of changing the amount of energy delivered to the refrigeration plate block 83B. (E.g. thermocouple (not shown)). Therefore, in this embodiment, the heat exchange device 83A has both the ability to heat and cool the refrigeration plate block 83B. In one embodiment, the heat exchange device 83A is a thermoelectric device used to cool and / or heat the refrigeration plate block 83B. In one embodiment, the heat exchanging device 83A is a heat tube design adapted to heat and cool the substrate, described below in connection with the PEB chamber 130. In one embodiment, it may be advantageous to improve the ability to control the substrate temperature by minimizing the capacity of the refrigeration plate block 83B and / or increasing the thermal conductivity.

  [00213] The support plate 84 is generally a plate for supporting the refrigeration plate assembly 83 and insulating it from the base 85. In general, the support plate 84 may be made of a thermally insulating material such as a ceramic material (eg, zirconia, alumina, etc.) that reduces the loss or increase of external heat.

  [00214] Referring to FIG. 10A, the lift assembly 87 generally includes a lift bracket 87A, an actuator 87B, a lift pin plate 87C, three or more lift pins 87D (only two are shown in FIG. 10A). is doing. These are adapted to lift and lower the substrate “W” away from the extended robot blade (not shown) and to place the substrate on the surface of the refrigeration plate block 83B when the robot blade is retracted. . A robot blade (not shown) is adapted to enter the refrigeration chamber 80 through an opening 88 provided in the side wall 86D of the enclosure 86. In order to prevent substrate processing variability and damage to the substrate by misaligning the substrate within the chamber, the robot typically picks up the substrate from a transfer position aligned with the center point between the lift pins, Calibrated to lower. In one embodiment, three lift pins moving through lift pin holes 89 provided in base 85, support plate 84, and refrigeration plate assembly 83 are adapted to raise and lower the substrate by use of actuator 87B. Has been. This actuator may be an air cylinder or a conventional usable substrate lifting means.

Bake chamber
[00215] FIG. 10B illustrates one embodiment of a bake chamber 90. As shown in FIG. The bake chamber 90 may be adapted to perform a post BARC bake step 512, a post photoresist coat bake step 522, a post top coat bake step 532, and / or a post development bake step 552. In general, the bake chamber 90 includes an enclosure 96, a bake plate assembly 93, a support plate 94, and a lift assembly 97. The enclosure 96 generally includes a plurality of walls (reference numerals 96B-D and elements 95) that tend to isolate the environment performed within the bake chamber 90 from surrounding environments to form a processing region 96A. Is included. In one aspect of the invention, the enclosure is thermally isolated and adapted to minimize contamination of the bake chamber 90 by the surrounding environment.

  [00216] The bake plate assembly 93 generally includes a heat exchange device 93A and a bake plate block 93B. The baking plate block 93B is made of a material that is heated by the heat exchange device 93A to perform the various baking processes described above (for example, baking step 512 after BARC, baking step 522 after photoresist coating). It is a block. The baking plate 93B is thermally conductive in order to improve temperature uniformity during processing. In one embodiment, the bake plate block 93B is made of aluminum, graphite, aluminum nitride, or other thermally conductive material. In one embodiment, the surface of the bake plate block 93B that is in contact with the substrate “W” is the substrate when the back side of the substrate contacts the bake plate block 93B, such as Teflon saturated anodic aluminum, silicon carbide, or otherwise. Coated with a material that minimizes the formation of particles on the backside. In one embodiment, the substrate “W” rests on pins (not shown) embedded in the surface of the bake plate block 93B, thus reducing the gap between the substrate and the bake plate block 93B. Production is reduced. In one embodiment, the heat exchange device 93A is a thermoelectric device used to use the bake plate block 93B. In another embodiment shown in FIG. 10B, the heat exchanging device 93A is formed on the surface of the bake plate block 93B and is temperature controlled using a heat exchanging fluid that flows continuously in the channel 93C. It consists of A fluid temperature controller (not shown) is adapted to control the temperature of the heat exchange fluid as well as the bake plate block 93B. The heat exchange fluid may be, for example, a perfluoropolyether (eg, Galden®) that is temperature controlled to a temperature of about 30-250 ° C. The heat exchange fluid may be a temperature-controlled gas such as argon or nitrogen.

  [00217] The support plate 94 is generally a plate for supporting the bake plate assembly 93 and insulating it from the base 95. In general, the support plate 94 may be made of a thermally insulating material such as a ceramic material (eg, zirconia, alumina, etc.) that reduces external heat loss.

  [00218] Referring to FIG. 10B, the lift assembly 97 generally includes a lift bracket 97A, an actuator 97B, a lift pin plate 97C, three or more lift pins 97D (only two are shown in FIG. 10B). is doing. These are adapted to lift and lower the substrate “W” away from the extended robot blade (not shown) and to place the substrate on the surface of the bake plate block 9s3B when the robot blade is retracted. . In one embodiment, three lift pins moving through lift pin holes 99 provided in base 95, support plate 94, and bake plate assembly 93 are adapted to raise and lower the substrate by use of actuator 97B. Yes. The actuator may be an air cylinder or other conventionally usable substrate lifting means. A robot blade (not shown) is adapted to enter the bake chamber 90 through an opening 98 provided in the side wall 96D of the enclosure 96.

HMDS chamber
[00219] FIG. 10C is a side view illustrating one embodiment of an HMDS processing chamber 70 adapted to perform HMDS processing step 511. As shown in FIG. In one embodiment shown in FIG. 10C, the HMDS processing chamber 70 includes some of the components included in the bake chamber 90 shown in FIG. 10B, so that some components of the HMDS processing chamber 70 are , The same or similar to the components described with reference to the bake chamber 790 described above. Therefore, the same numbers are used as appropriate.

  [00220] The HMDS processing chamber 70 also includes a lid assembly 75 that is used to form a sealed processing region 76. Within this sealed process region 76, process gas is delivered to the substrate “W” heated by the HMDS bake plate assembly 73. Generally, the HMDS bake plate assembly 73 includes a heat exchange device 73A and a HMDS bake plate block 73B. The HMDS bake plate block 73B is a heat conduction block made of a material that is heated by the heat exchange device 73A to perform the various HMDS processing steps described above. The HMDS bake board block 73B is thermally conductive in order to improve temperature uniformity during processing. In one embodiment, the HMDS bake plate block 73B may be made from aluminum, graphite, aluminum nitride, or other thermally conductive material. In one embodiment, the surface of the HMDS bake plate block 73B that is in contact with the substrate “W” is Teflon-saturated anodic aluminum, silicon carbide, or other, when the back surface of the substrate is in contact with the HMDS bake plate block 73B. Coated with a material that minimizes the formation of particles on the backside of the substrate. In one embodiment, the substrate “W” is stationary on pins (not shown) embedded in the surface of the HMDS bake plate block 73B, so that the gap between the substrate and the HMDS bake plate block 73B is small. Particle generation is reduced. In one embodiment, the heat exchange device 73A is a thermoelectric device used to heat the HMDS bake plate block 73B. In another embodiment shown in FIG. 10C, the heat exchange device 73A is composed of a plurality of channels 73C formed on the surface of the HMDS bake plate block 73B. The temperature of the channel 73C is controlled by using a heat exchange fluid that continuously flows inside. A fluid temperature controller (not shown) is adapted to control the temperature of the heat exchange fluid as well as the HMDS bake plate block 73B. The heat exchange fluid may be, for example, a perfluoropolyether (eg, Galden®) that is temperature controlled to a temperature of about 30-250 ° C. The heat exchange fluid may be a temperature-controlled gas such as argon or nitrogen.

  [00221] In general, the lid assembly 75 includes a lid 72A, one or more O-ring seals 72C, and an actuator assembly 72. The actuator assembly 72 generally includes an actuator 72B and an O-ring seal 72D. The O-ring seal 72D is designed to isolate the HMDS processing region 77 from the environment outside the HMDS processing chamber 70. The actuator 72B is generally adapted to raise and lower the lid 72A to transfer the substrate to or from the lift pins 97D within the lift assembly 97. In order to form the processing region 76 and to prevent the processing gas used during the HMDS processing step 511 from escaping into the HMDS processing region 77, the lid 72A is within the lid 72A (or on the HMDS base 74). Is adapted to form a seal between the HMDS bases 74 by the use of an O-ring seal 72D held in place.

  [00222] During processing, the actuator 72B lowers the lid 72A, thereby forming a leak-proof seal between the lid 72A, the O-ring seal 72C, and the HMDS base 74. Process gas delivery system 71 delivers process gas (s) to process region 76 to perform HMDS process step 511. In order to deliver process gas (s), the HMDS vaporization system 71A passes HMDS vapor and carrier gas over the surface of the substrate, through the isolation valve 71B and the inlet 71F formed in the HMDS base 74. To the scrubber 71E from the outlet 71G formed in the HMDS base 74. In one embodiment, after the HMDS vapor containing the processing gas is sent to the processing region, the purified gas is sent from the purified gas source 71 </ b> C to the processing region 76 to remove any remaining HMDS vapor. The purified gas source 71C is isolated from the DHMDS vaporization system 71A by the use of an isolation valve 71. In one embodiment, one of the conventional gas heat exchange means (not shown) is used to heat or cool the purified gas delivered from the purified gas source 71C to Perform temperature control.

Bake chamber after exposure
[00223] During an exposure process using a positive photoresist, a non-soluble photoresist material is transferred into the soluble material. During the exposure process, the components in the photoresist, including the photoacid generator (or PAG) attack the unexposed areas of the photoresist, and the sharpness of the pattern formed in the photoresist layer during the exposure process Generate organic photoacids that affect Thus, the unexposed photoresist attack is affected by the movement of the generated photoacid, which is a diffusion dominant process. Since the photoacid attack of the formed pattern is a diffusion dominant process, the attack speed depends on two related variables, time and temperature. Therefore, it is important to control these variables in order to make micro-dimension (CD) uniformity acceptable and to make it consistent across all substrates.

  [00224] In one embodiment, the PEB step 540 is performed in the bake chamber 90 as shown in FIG. 10B. In another embodiment, a substrate held on the HMDS bake plate assembly 73 by performing PEB step 540 in the HMDS processing chamber 70 where temperature controlled gas is delivered from the purified gas source 71C to the processing region 76. Heat or cool.

  [00225] In another embodiment, the PEB step 540 is performed in the PEB chamber 130. FIG. 10D illustrates a side view of the PEB chamber 130. By optimizing the mass of the processing region 138 and the PEB plate assembly 133 inside the PEB chamber 130, thermal uniformity is improved, temperature can be changed at high speed, and / or processing repeatability is improved. To do. In one embodiment, the PEB plate assembly utilizes a low temperature PEB plate assembly 133 and a heat exchange source 143 to provide rapid heating and / or cooling of the substrate in communication with the top surface 133F of the PEB plate assembly 133. In this configuration, the PEB plate assembly 133 includes a substrate support region 133B having a top surface 133F on which the substrate rests, a heat exchange region 133A, and a base region 133C. A temperature sensing device (not shown) is used to control the temperature of the substrate support region 133B. This temperature sensing device is used in conjunction with the system controller 101 to change the amount of energy delivered from the heat exchange area 133A to the PEB plate assembly 133.

  [00226] The heat exchange region 133A is a region surrounded by the substrate support region 133B, the base region 133C, and the side wall 133G. The heat exchange area 133A further communicates with the heat exchange source 143 via one or more inlet ports 133D and one or more outlet ports 133E. The heat exchange region 133A is also adapted to receive various heat exchange fluids delivered from the heat exchange source 143 to heat and cool the substrate in thermal communication with the top surface 133F. In one aspect of the present invention, the material thickness of the top surface 133F (ie, the distance between the heat exchange region 133A and the top surface 133F), and thus the mass of the top surface 133F, is minimized, thereby rapidly heating the substrate. And allows cooling.

  [00227] In one embodiment, the heat exchange region 133A may include a resistive heater or thermoelectric device to control the temperature of the substrate. In another embodiment, the heat exchange area 133A is adapted to control the temperature of the PEB plate assembly 133 using a radiation heat transfer method such as a halogen lamp mounted under the substrate support area 133B, for example. ing.

  [00228] The PEB plate assembly 133 is made of one single material, using conventional means (eg, machining, welding, brazing, etc.) or to form an optimal PEB plate assembly 133 for each material. It can be formed from a composite material (eg, a material that includes many different materials) that maximizes thermal conductivity, thermal expansion, and thermal shock properties. In one embodiment, the PEB plate assembly 133 is made from thermal conduction such as aluminum, copper, graphite, aluminum nitride, boron carbide, and / or another material.

  [00229] Generally, the heat exchange source 143 includes at least one heat exchange fluid delivery system adapted to deliver heat exchange fluid to the heat exchange region 133A. In one embodiment shown in FIG. 10D, the heat exchange source 143 includes two heat exchange fluid delivery systems that are a heat source 131 and a cooling source 142.

  [00230] In one embodiment, the heat source 131 is a conventional heat pipe used to heat the substrate. In general, a heat pipe is a container that has been evacuated of contents that are typically circular in cross-section and filled with a small amount of working fluid that transfers heat from a heat source 131 to a heat sink (eg, substrate support region 133B and substrate). Can be returned. The heat transfer is performed by vaporizing the working fluid in the heat source 131 and condensing the working fluid in the heat exchange region 133A. During operation, the heat exchange area 133A is evacuated by a vacuum pump (not shown), and then energy is added to the working fluid held in the heat source 131, so that the heat exchange area 133A has a gap between the heat source 131 and the heat exchange area 133A. A pressure gradient is created. This pressure gradient forces the steam to flow to the cooler part where it condenses and the energy is cut off by the latent heat of vaporization. Next, the working fluid returns to the heat source 131 through the outlet port 133E and the outlet line 131B by gravity and capillary action. The temperature of the substrate support region 133B is controlled by using a temperature sensing device (not shown) together with the system controller 101 and changing the amount of energy delivered to the heat exchange region 133A (for example, the flow of working fluid).

  [00231] In another embodiment, heated gas, vapor, or liquid is transferred from a fluid source (not shown) by a heat source 131 to a heat exchange region 133A to transfer heat to the substrate by a convective heat transfer type process. Is sent to. In this configuration, heated gas, vapor, or liquid is delivered to the heat exchange region 133A via the outlet port 133E and then to the waste collection source 142Aa. The waste collection source 142A may be a scrubber or a typical discharge system.

  [00232] In one embodiment shown in FIG. 10D, the heat exchange source 143 also includes a cooling source 142A adapted to cool the substrate to a desired temperature. In one embodiment of the cooling source 142, the cooling source delivers liquid nitrogen to the heat exchange area 133A to remove heat from the substrate support area 133B and further from the substrate. In another embodiment of the cooling source 142, the cooling source delivers liquid nitrogen to the heat exchange region 133A to remove heat from the substrate support region 133B and the substrate. In another embodiment, the cooling source cools the substrate by delivering refrigerated gas, liquid, and vapor to the heat exchange region 133A. In one aspect of the invention, the cooling source is used to cool the substrate to near ambient temperature.

  [00233] In another embodiment of the PEB plate assembly 133, a heat exchange device 134 is installed on the base region 133C to heat or cool the PEB plate assembly 133. In one aspect of the invention, the heat exchanging device 134 is used to cool the base region 133C that is in thermal contact with the substrate support region 133C via a plurality of thermally conductive pillars 133H (only two shown). The In this configuration, the substrate is heated by injecting a high-temperature fluid from the heat source 131 and is cooled using the heat exchange device 134. In this configuration, the cooling source 142 for cooling the substrate is not necessary. The plurality of heat conducting pillars 133H are regions where heat can be transferred from the substrate support region 133B to the base region 133C or vice versa. Conductive pillars 133H can be arranged in any pattern, size and density (eg, the number of pillars 133H per unit range) so that heat can flow evenly into or out of heat exchanger 134. In addition, the fluid can be evenly delivered from the heat source to communicate with the substrate support region 133B.

  [00234] Referring to FIG. 10D, in one aspect of the present invention, the lid assembly 137 is positioned above the substrate “W” to form a controlled environment around the substrate. Arranged in contact with top surface 133F. Generally, the lid assembly includes a lid 137A and a lid actuator 139. The lid actuator 139 is a device that can transfer the substrate to and from the cluster tool robot (not shown) and the top surface 133F by the lift assembly 140 because it is adapted to raise and lower the lid 137A. In one embodiment, the lid actuator 139 is an air cylinder. Since the lid is in contact with the top surface 133F when in the processing position shown in FIG. 10D, a processing region 138 is formed that surrounds the substrate and creates a controlled thermal environment.

  [00235] In one embodiment, the lid assembly 137 exchanges heat to improve the thermal uniformity across the substrate being processed by controlling the temperature of the lid 137A to create a conformal environment around the substrate. Device 137B may be included. In this configuration, the heat exchange device 137B is adapted to act as a heat pipe in a manner similar to that described above to quickly heat and cool the lid assembly 137. In one embodiment, both the heat exchanging device 137B and the heat exchanging region 133A are adapted to act as heat pipes to control the temperature of the substrate quickly and evenly. In another embodiment, the heat exchange device 137B is adapted to control the temperature of the lid assembly 137 using radiant (eg, heat lamps) or convective heat transfer means (described above).

  [00236] In another embodiment of the lid assembly 137, a heated fluid source for flowing a temperature-controlled process fluid over the surface of the substrate and further out of the lid outlet port 137D to the waste collection device 141B. 141 is connected to the processing region 138 via a lid inlet port 137C. Generally, the heated fluid source 141 includes a fluid source 141A, a fluid heater 141C, and a waste collection device 141B (eg, typically a discharge system or scrubber). The fluid source 141A can deliver a gas or liquid to control the temperature of the substrate during processing. In one aspect of the invention, fluid source 141A delivers an inert gas such as argon, nitrogen, helium, for example.

  [00237] Referring to FIG. 10D, the PEB chamber 130 generally includes an enclosure 136, a PEB plate assembly 133, and a lift assembly 140. Generally, the enclosure 136 includes a plurality of walls (reference numerals 136B-D, reference numeral 135) that are isolated from the environment surrounding the processing performed in the PEB chamber 130. In one aspect of the invention, the enclosure is adapted to be thermally isolated from the environment surrounding the PEB chamber 130 to minimize contamination. Generally, the lift assembly 147 includes a lift bracket 140A, an actuator 140B, a lift pin plate 140C, three or more lift pins 140D (only two are shown in FIG. 10D), which are extended. It is adapted to raise and lower the substrate “W” away from the robot blade (not shown) and to place the substrate on the surface of the PEB plate assembly 133 when the robot blade is retracted. The lift pin holes 132 are configured to allow the lift pins 140D to access the substrate in order to raise and lower the PEB plate assembly 133 from the surface. Actuator 140B may be an air cylinder or other conventionally usable substrate lifting means. A robot blade (not shown) is adapted to enter the enclosure 136 through an opening 136E provided in the side wall 136D of the enclosure 136.

Variable heat transfer valve
[00238] FIG. 11A is a side view illustrating one embodiment of a plate assembly that can be used to rapidly heat and cool a substrate. As used hereinafter, the term “plate assembly” generally refers to a PEB plate assembly 133, refrigeration plate assembly 83, bake plate assembly 93, or HMDS bake plate that can be adapted to benefit from this configuration. It is intended to describe an embodiment of assembly 73. Referring to FIG. 11A, in one embodiment, plate assembly 250 includes conductive block 254, cooling region 253, conductive block 254, and cooling region 253 having a block surface 254A that is in thermal communication with substrate “W” during processing. It includes a gap 259 formed therebetween, an inlet region 257, an outlet region 258, and a fluid delivery system 275.

  [00239] Conductive block 254 is used to support the substrate and includes a heating plate 255 adapted to heat the substrate in thermal communication with block surface 254A. Conductive block 254 may be made from a thermally conductive material, such as aluminum, copper, graphite, aluminum nitride, boron nitride, and / or other materials. The heating device 255 may be a resistive heater or thermoelectric device that is used to heat the conductive block 254. In another embodiment, the heating device 255 is comprised of a plurality of channels formed in the surface of the conduction block 254 (not shown), which use a heat exchange fluid that flows continuously therein. Temperature controlled. A fluid temperature controller (not shown) is adapted to control the temperature of the heat exchange fluid as well as the conduction block 254. The heat exchange fluid may be, for example, a perfluoropolyether (eg, Galden®) temperature controlled at a temperature of about 30-250 ° C. Further, the heat exchange fluid may be a temperature controlled gas such as argon or nitrogen.

  [00240] The cooling region 253 is an area of the plate assembly 250 that is used to cool the conduction block 254 as the conductive working fluid is delivered to the gap 259 by the fluid delivery system 275. Is isolated from the conduction block 254 and maintained at a low temperature. The cooling region 253 includes a cooling device 265 that is used to cool this area of the plate assembly 250. The cooling region 253 may be made from a thermally conductive material, such as aluminum, copper, graphite, aluminum nitride, boron nitride, and / or other materials. The cooling device 265 may be a thermoelectric element that is used to cool the cooling region 253. In another embodiment, the cooling device 265 is composed of a plurality of channels (not shown) formed in the surface of the cooling region 253, which use a heat exchange fluid that flows continuously therein. Temperature controlled. A fluid temperature controller (not shown) is adapted to control the temperature of the heat exchange fluid as well as the cooling zone 253. The heat exchange fluid may be, for example, a perfluoropolyether (eg, Galden®) temperature controlled at about 5-20 ° C. Further, the heat exchange fluid may be a temperature controlled gas such as argon or nitrogen.

[00241] The fluid delivery system 275 generally includes a fluid delivery source 270 adapted to deliver a conductive working fluid to a gap 259 formed between the conductive block 254 and the cooling region 253. The fluid delivery system 275 causes the conductive working fluid to flow from the fluid delivery system 275 via the inlet region 257 to the gap 259 and then drain from the outlet region 258. The discharged conductive working fluid returns to the fluid delivery system 275. As such, the conductive working fluid is used to increase the thermocouple between the cooling region 253 and the conductive block 254 to heat and cool the substrate during different stages in the process. The conductive working fluid may be a liquid, vapor, or gas that can increase the thermocouple between the conductive block 254 and the cooling region 253. In one embodiment, the conductive working fluid is a liquid metal alloy of gallium, indium, tin (eg, galinstan); mercury (HG); galden; polyethylene glycol. In another embodiment, the conductive working fluid is a gas such as helium, argon, carbon dioxide (CO ₂ ).

  [00242] In one embodiment, the plate assembly 250 is used to perform a PEB step 540, for example, to bake a substrate in a PEB chamber. In this configuration, first, the substrate is delivered to the block surface 254A while the conductive working fluid flows through the gap 259, whereby the cooling region 253 communicates with the conductive block 254, thereby maintaining the block surface at a low temperature. The When the substrate contacts the block surface 254A, the conductive working fluid stops its flow and is removed from the gap 259. Thereby, the cooling region 253 is separated from the conductive block 254. In one embodiment, gas source 272 is used to force the remaining conductive working fluid back to fluid transfer system 275. Next, the conduction block 254 is heated by the energy delivered from the heating device 255 until it reaches its desired processing temperature. After maintaining the desired processing temperature for a certain period of time, the heating device 255 is shut off and the conductive working fluid is delivered to the gap 259 to cool the conductive block 254 by a thermocouple between the conductive block 254 and the cooling region 253. The The substrate is removed from the processing chamber when the desired temperature is reached.

  [00243] In one embodiment of the plate assembly 250 shown in FIG. 11A, a conductive block 254 is made by roughening the block surface 256 using a machining process such as a bead blasting, knurling, or other machining process. This reduces the chance that the material will be damaged by thermal shock and expands the surface area where the cooling region 253 is bonded to the conductive block 254.

PEB processing endpoint detection system
[00244] In an attempt to reduce processing time in the bake chamber, PEB chamber and / or HMDS processing chamber and improve repeatability of processing results, the endpoint detector is integrated into the chamber to Can be notified to the system controller 101 that the transfer to the next refrigeration chamber 80 is possible. This design minimizes the need to keep the process running longer than necessary, or “overbake”, and also allows confirmation that the chamber process is complete. This process is particularly important in PEB chambers in preventing organic acids produced during exposure from attacking unexposed portions of the photoresist.

  [00245] To solve this problem, in one embodiment, PEB, HMDS, bake chamber reaction by-products in gases and vapors on the surface of previously identified or previously-deposited photoresist layers. The treatment endpoint is determined by measuring the concentration of the product. FIG. 12A illustrates one embodiment of an endpoint detection system 190 adapted to detect changes in the concentration of by-products diffused from the photoresist layer surface (not shown) of the substrate “W”. In this configuration, laser 191 emits a beam (see reference “A”). The beam is tuned to reduce the intensity of the signal received by detector 192 by interaction with by-products that are diffused into the gas or vapor on the photoresist surface during the processing step. Released. The wavelength and intensity of the laser are also adjusted to prevent the laser from potentially exposing the photoresist further. In general, typical photoresist processing by-products are, for example, materials including hydrocarbons and carbon dioxide (CO2). The endpoint can be inferred from intensity variations caused by changes in the concentration of CO2 or other organic degradation products generated from the photoresist. The one or more wavelengths emitted by the laser may be about 500-4000 nm. In one embodiment, if carbon dioxide condensation is detected, the wavelength of the laser is about 1960 nm, which can be easily achieved with conventional laser diodes. In another embodiment, the wavelength of the beam emitted by the laser is 4230 nm.

  [00246] FIG. 12A is a side view of a bake chamber, PEB chamber, HMDS processing chamber (see element 199). These processing chambers include a laser 191 that emits a beam that intersects just above the surface of the photoresist included on the surface of the substrate. In this configuration, the laser 191 and the detector 192 can travel in close proximity to the photoresist layer on the surface of the substrate “W” on which the emitted beam is held on the plate assembly 193. It is mounted in the form. The plate assembly 193 may be, for example, a PEB plate assembly 133 or a bake plate assembly 93 that is used to process substrates during the bake, PEB, and HMDS processing steps described above. In this configuration, the endpoint detection system 190 generally reacts best to changes in the concentration of by-products in the gas or vapor because the concentration of by-products produced is highest just above the surface of the photoresist. To do. The advantage of this configuration is that by projecting the beam onto the surface of the photoresist, the detected intensity change is represented by the total amount of by-products that pass through the entire length of the beam. This method provides a lower signal-to-noise ratio and corrects for process variations during the different stages of the process.

  [00247] In another embodiment of the endpoint detector, a laser is used to determine the thickness of the photoresist layer and / or the change in the reflectance index of the photoresist layer to determine the processing endpoint. Sense. FIG. 12B illustrates one embodiment of an endpoint detection system 198 that can be used to measure the thickness of the photoresist layer and / or sense changes in the reflectance index of the photoresist layer. In general, the endpoint detection system 198 includes a laser 194, a beam splitter 195, and a detector 196. In one embodiment shown in FIG. 12B, endpoint detection system 198 further includes a fiber optic cable 197. This fiber optic cable 197 allows the laser 194, beam splitter 195, and detector 196 to be positioned at a desired distance from the processing region 199A on the surface of the substrate.

  [00248] In one embodiment of the endpoint detection process, the laser is designed to emit multiple wavelengths so that changes in photoresist thickness and / or reflection index can be monitored during the process. Photoresist thickness is measured by detecting changes in the multi-wavelength interference pattern that change as changes in photoresist thickness and reflection index during processing. In one embodiment of the endpoint detection process, when the laser 194 emits radiation to the beam splitter 195, a certain percentage of the radiation emitted from the laser 194 passes directly through the beam splitter 195 and reaches the fiber optic cable 197. A fiber optic cable 197 then directs the released energy to the surface of the substrate. The emitted radiation is then reflected, scattered or absorbed at the surface of the photoresist layer (reference “P”) and / or the surface of the substrate. Next, a certain percentage of the reflected radiation is returned to the fiber optic cable 197 where the radiation is directed to the beam splitter 195. The beam splitter 195 reflects a certain proportion of the reflected radiation to the detector 196, where incident radiation is detected.

  [00249] Using any of the embodiments described above, the detected signal is compared with the signal or data collected from the previously processed substrate to detect when the processing endpoint has occurred. May be. In one embodiment, post-process measurements need to be obtained before confident endpoint detection can occur. FIG. 12C illustrates a method for optimizing the endpoint detection process using data collected from previously processed wafers. In this method, endpoint signals from two or more substrates need to be recorded for reference or stored in the memory of the system controller 101 (see reference A). Next, two or more substrates are fully processed and inspected (see reference B) to determine how to compare the endpoint signal with ideal processing. This inspection data is then used to determine the ideal processing time and actual endpoint signal, which in turn is used for subsequent substrates that are processed in the chamber, Determined (see symbol C).

Improved heat transfer design with minimal contact
[00250] In order to increase the system throughput by reducing the processing time of the refrigeration chamber, bake chamber, PEB chamber, and / or HMDS processing chamber, various methods are employed to couple the thermocouples of the substrate and heat exchanger. increase. Increasing contact between the surface of the substrate and the surface of the plate assembly (eg, PEB plate assembly 133, refrigerated plate assembly 83, etc.) increases the thermocouple and reduces the time for the substrate to reach the desired processing temperature. The However, on the other hand, increasing contact is often undesirable because increasing the number of particles produced on the backside of the substrate affects the result of the exposure process and further the productivity of the apparatus.

  [00251] To reduce the production of particles on the backside of the substrate, a row of protrusions that separate the substrate from the surface of the plate assembly can be used to minimize contact between the substrate and the surface of the plate assembly. . The protrusions tend to reduce the thermocouple between the substrate and plate assembly while reducing the number of particles produced. Thus, in many cases, it is desirable to minimize the height of the protrusions from the surface of the plate assembly to improve the thermocouple while still preventing the substrate from touching the surface of the plate assembly. Prior art applications have typically used sapphire spheres that are pushed or placed into holes machined in the surface of the plate assembly to act as protrusions. It is often difficult to achieve sufficiently good height control between the surface of the sapphire and the plate assembly by machining. This is because this technique requires that the substrate be very flat so that it does not contact the surface of the plate assembly. These problems occur because all of the machining operations required to create the surface features that maintain the spheres or pins refer to some reference data and do not take into account variations in the surface topology of the plate assembly. This problem becomes particularly important when the height of the protrusion is about 30 micrometers from the surface of the plate assembly.

[00252] Referring to FIG. 13A, to solve these competing problems, in one embodiment, a row of precisely controlled small contact area projections 171 is formed on the surface of the plate assembly 170, and Biasing the substrate toward the plate assembly improves the thermocouple between the substrate and the plate assembly. The substrate can be biased using a vacuum chuck device, an electrostatic chuck device, or other conventional method of forcing the substrate against the plate assembly. A row of precisely controlled small contact area protrusions 171 can be formed using CVD and / or PVD deposition processes. Also, CVD and / or PVD deposition processes can be used to deposit a controlled size thin film material evenly at the desired height on the surface of the plate assembly. The materials to be deposited to form the protrusions 171 on the surface of the plate assembly 170 are silicon oxide (SiO ₂ ), silicon (Si), metal (eg, nickel, titanium, titanium nitride, molybdenum, tungsten, etc.), ceramic material, heavy It is a coalesced material (for example, polyimide, Teflon, etc.) or has sufficient hardness that can withstand the urging force with almost no deformation, and the back surface of the substrate (for example, diamond, diamond-like hard carbon, boron nitride) It may be a material that is not easily abraded by the interaction with the. This approach is advantageous because the height of the protrusions located above the plate assembly surface can be controlled to a height that is approximately one tenth (eg, 1/10) of the protrusion height of the current structure. By reducing the height of the protrusions, the heat transfer rate can be increased, allowing the wafer to be heated much faster, which reduces the time it takes for the wafer to transition to the final temperature. And dispersion of chemical diffusion and chemical reaction can be reduced. Furthermore, the closer thermocouple between the wafer and the heating air reduces the non-uniform thermal shock of other chambers. Another advantage of this approach is that the substrate bow size can be reduced by using more protrusions 171. This is because the substrate bow is inversely proportional to the fourth force of the distance between the protrusions when an external pressure is applied to the substrate. The height of each protrusion 171 from the surface of the plate assembly is nominally the same, and the substrate is evenly held at a position above the surface of the assembly with a minimum bow between the protrusions. Therefore, the heat transfer from the plate assembly to the substrate becomes uniform. This design thus minimizes particle generation on the backside of the substrate that is typical of ordinary vacuum chucks, while the substrate temperature is quickly and evenly targeted.

  [00253] In one embodiment, the protrusion 171 is formed by placing a mask (not shown) at a position above the surface of the plate assembly. This allows CVD or PVD material to be deposited over a specific defined area using features or holes formed in the mask. This allows the size to be controlled by the features formed on the mask and the height of the protrusions so that a specific amount of material is deposited on the surface of the plate assembly using conventional PVD or CVD process deposition rates. Thus, the height of the protrusion can be controlled. In one embodiment, the protrusion 171 deposited by PVD or CVD process has a thickness of about 100 micrometers.

  [00254] FIGS. 13C and 13D illustrate an embodiment in which a selective CVD deposition process is used to deposit protrusions of a desired height. In this configuration, for example, a silicon dioxide or diamond seed crystal 182A layer is embedded in the plate assembly surface 170A of a plate assembly 170 made of Teflon-coated aluminum. In this configuration, a conventional CVD process can be adapted to selectively deposit a silicon dioxide or diamond film 182B on the seed crystal 182A. In this embodiment, seed crystal 182A may be embedded in plate assembly 170A such that its top surface is substantially flush with plate assembly surface 170A. In one aspect of the present invention, an insertion tool is used to repeatedly install the seed crystal 182A so that it is flush with the surface 170A of the plate assembly. The insertion tool should be made of a material that is relatively uncompressed, has a flat, polished surface. The insertion tool should also have a working surface (not shown) that contacts the seed crystal during insertion into a plate assembly having at least the same hardness as the material of the seed crystal 182A.

  [00255] FIG. 13A illustrates one embodiment of a heating / cooling assembly 180 that may be used in the refrigeration chamber 80, bake chamber 90, PEB chamber 130, and / or HMDS processing chamber 70. In one embodiment, the heating / cooling assembly 180 includes a plate assembly 170 and a vacuum source 175 that are mounted within the processing chamber 186. In general, the plate assembly 170 includes a plate 170B, a plate assembly surface 170A, a protrusion 171 and a vacuum source port assembly 172. In this configuration, the vacuum source 175 creates a negative pressure in the vacuum port plenum 172B, causing air to flow into the plurality of vacuum ports 172A formed on the surface of the plate assembly 170. This reduces the pressure created on the surface of the substrate and biases the substrate toward the surface of the protrusion 171. Plate 170B can be made from a thermally conductive material, such as aluminum, copper, graphite, aluminum nitride, boron nitride, and / or other materials, and is in communication with heat exchanger 183A. FIG. 13A illustrates a heat exchanging device 183A having a different shape from that of the refrigeration chamber 80, bake chamber 90, PEB chamber 130, and / or HMDS processing chamber 70 described above. This embodiment is intended to incorporate all the features described above.

  [00256] In one embodiment, the plate assembly 170 further includes a gas source port assembly 173 and a gas source 174 to reduce the pressure generated behind the substrate by cleaning the edge of the substrate during processing. This prevents vaporized solution vapor from depositing on the plate assembly surface 170A or the back surface of the substrate. (Eg, vacuum chuck configuration) In this configuration, gas source 174 is used to create a positive pressure in gas port plenum 173B and outflow gas from a plurality of gas ports 173A formed on the surface of plate assembly 170. I am letting. In one embodiment, the gas source 174 is adapted to deliver an inert gas such as argon, xenon, helium, nitrogen, and / or krypton to the edge of the substrate. In one embodiment, the gas source 174 is also adapted to deliver fluid to the edge of the substrate.

  [00257] FIG. 13B illustrates a plan view of the surface of the plate assembly 170 with no substrate resting on top of the protrusions 171 so that protrusions 171 (33 shown), vacuum ports 172A (up to 367 are shown). Illustrated), one possible configuration of a gas port 173A (maximum 360 illustrated) is illustrated. In general, the plurality of protrusions 171 are spaced apart from the surface of the plate assembly 170 to minimize the contact area and substantially equalize the gap between the substrate and the plate assembly surface 170A. The plurality of vacuum ports 172A are spaced across and around the surface of the plate assembly 170, thereby biasing the substrate toward the plate assembly 170, thereby substantially equalizing the gap between the substrate and the plate assembly surface 170A. be able to. In one embodiment shown in FIG. 13B, the vacuum port internal array 172A (symbol “A”) is mirrored with the gas port external array 173A (symbol “B”). In this case, the inner array “A” has a diameter smaller than the substrate diameter, and the outer array “B” has a diameter equal to or larger than the substrate diameter. In one embodiment, a small ridge (not shown) of deposited CVD or PVD material used to form the protrusion 171 is placed between the internal array 172A of vacuum ports and the external array 173A of gas ports. This minimizes the amount of gas required to clean the edges of the plate. 13A-13B also illustrate a configuration having a lift assembly 87 and lift pin holes 189 extending to the plate assembly surface 170A to lift the substrate from the plate assembly surface 170A.

  [00258] In one embodiment, the gas delivered from gas source 174 is heated prior to exiting gas port 173A to prevent the edges of the substrate from being cooled during processing. In another embodiment, the length of the gas port plenum 173B in the plate assembly 170 is long enough for the gas injected into the gas port plenum to approximately reach the plate temperature before exiting the gas port 173A. Designed to exist within a gas port plenum.

Support chamber
[00259] Support chamber 65 (FIGS. 4C, 4F, 4H) is used to support containers, pumps, valves, filters, and more, other than that used to complete the processing sequence within cluster tool 10. Components can be stored.

  [00260] In one embodiment, to detect defects in the processed substrate, to perform statistical process control, and / or to allow the system to correct for variations in incoming substrate quality. To this end, support chamber 65 includes various metrology tools such as particle measurement tools, OCD spectroscopic analyzers, spectroreflectometers, and various scatterometry instruments. In one case, non-contact visible and / or DUV reflectometer techniques can be used to perform measurements of film thickness and film uniformity on a substrate in a cluster tool. The reflectometer tool can be purchased from Nanometrics Incorporated (Milpitas, Calif.).

  [00261] Integrated OCD spectroscopic tools can be used to complete film features and closed-loop control during lithographic processing without moving the wafer to a stand-alone metrology tool, thus saving transfer time In addition, contamination and damage due to potential handling can be eliminated. Various control measures and functions are integrated directly into the cluster tool to help improve CD control and CoO. The OCD spectroscopic analysis tool can be purchased from Nanometrics Incorporated (Milpitas, Calif.).

Wafer sequencing / parallel processing
[00262] Electronic device manufacturers are often competitive in the market and, in an effort to reduce CoOw, often achieve maximum substrate throughput assuming cluster tool architecture limitations and chamber processing times Attempts have been made to optimize the processing sequence and chamber processing time by spending a great deal of time. With track lithography type cluster tools, the chamber processing time tends to be quite short (eg, about 1 minute to complete the process) and the number of processing steps required to complete a typical track system process is high. A significant portion of the time taken to process a single substrate is spent on substrate transfer processing between the various processing chambers in the cluster tool. Therefore, in one embodiment of the cluster tool 10, a plurality of substrates are grouped together, and CoO is reduced by transporting and processing each of two or more groups. This parallel processing format increases system throughput and reduces the number of operations that the robot takes to transfer substrate batches between processing chambers, thus reducing robot fatigue and increasing system reliability.

  [00263] In one aspect of the present invention, the track architecture is such that two or more substrates are again removed from the cassette 106 mounted in the pod assemblies 105A-D one by one and after processing at the first processing station is completed. Designed to be grouped together into groups of substrates. For example, if the processing sequence shown in FIG. 3A is used, the substrates are grouped after the BARC coat step 5120 is completed. In this configuration, a single blade robot can be used as a robot corresponding to the cassette 106 and installing each substrate in the first processing station. However, a robot that picks up a substrate from the first processing station and installs it in a subsequent substrate processing station (for example, the central robot 107) includes a robot including the same number of substrate holding devices (for example, robot blades) as the substrates to be grouped. used. For example, as shown in FIG. 16A, when two substrates are grouped together, a two-blade type central robot 107 can be used. In another aspect of the invention, the substrates are ungrouped before being transferred into the stepper / scanner 5 and regrouped after execution of PEB step 540. The substrates are further ungrouped before being picked up by the front end robot 108 at the final processing station.

  [00264] In one aspect of the invention, the substrates are grouped together in a pod assembly 105, using multiple blade type front end robot 108, central robot 107, rear robot 109 and grouping via a cluster tool. It is transferred every time. 16A-16D illustrate one embodiment of a plurality of blade robots. In this case, when a substrate is mounted on each blade of the front end robot 108, all transfer processing via the cluster tool is completed for each group. It will be noted that the stepper / scanner 5 should ungroup the substrates, i.e. the substrates should be transported one by one.

  [00265] In one embodiment, the substrates are grouped in pairs. Therefore, the transfer process consists of a grouping step of transferring one substrate into the first processing chamber, a grouping step of transferring two substrates through the system, and then transferring one substrate back and forth between the stepper / scanner 5. And a grouping step of transferring two substrates through the system, and a grouping step of transferring one substrate from the final chamber to the cassette. In one embodiment, the central robot 107 shown at the bottom of FIGS. 16A-16B includes a two blade assembly 705 for transferring substrates in groups of two. The two-blade assembly 705 includes at least one robot blade 711A resting on the first blade assembly 715A and at least one robot blade 711B resting on the second blade assembly 715B. . In this configuration, the first blade assembly 715A and the second blade assembly 715B are spaced apart by a fixed distance from the vertical space of the two chambers that internally group the substrates. For example, if the substrates are grouped in pairs after performing the BARC coat step 510 in CD1, CD2 of the front processing rack 52 shown in FIG. 4A, the C12 refrigeration chamber in the first central processing rack 152, The space of the transfer position in the CD1 chamber and the CD2 chamber is configured so that it can be transferred to the C9 refrigerator chamber, or the B5 bake chamber and B2 bake chamber. Thus, after completion of the post-BARC refrigeration step 514, the central robot 107 can convert the substrate pair into one pair of coater / developer chambers 60 held in the second central processing rack 154, eg, CD1 and CD2, CD2. Can be transferred to CD3, CD3 and CD4.

  [00266] In one embodiment of the two-blade assembly 705, the horizontal space of the first blade assembly 715A relative to the second blade assembly 715B is spaced apart by a fixed distance, which is the two groups within which the substrate grouping takes place. It corresponds to the horizontal space of the chamber. In this configuration, the first blade assembly 715A and the second blade assembly 715B are aligned on a horizontal plane such that the two-blade assembly 705 can access a horizontally spaced chamber.

  [00267] Referring to FIG. 16D, in another embodiment, the first blade assembly 715A and the second blade assembly 715B are separated by a variable distance using an actuator 722 mounted on the two-blade assembly 705. Yes. In general, the actuator 722 is adapted to change the space between various numbers of grouped substrates to match the desired space of the chamber in which the grouped substrates are transferred. In one aspect, the actuator 722 is mounted on the support 720 and is adapted to position the second blade assembly 715B attached to the second surface 720B. In this configuration, the actuator 722 can change the space “A” between the first blade assembly 715A and the second blade assembly 715B by positioning the second surface 720B in the direction “B”. In one embodiment, the actuator 722 is a direct drive brushless linear servomotor that can be used with Danaher Motion (Wooddale, Ill.), Or Aerotech, Inc. (Pittsburgh, Pennsylvania).

  [00268] In one embodiment, the substrate can be subjected to a batch development process. In this case, the substrates are grouped and transported, ungrouped to perform the development process, and then grouped again and group transported.

Sequencing without buffer station
[00269] In one aspect of the invention, the substrate processing sequence and the cluster tool are configured such that a substrate transfer step performed during the processing sequence is performed and completed for a chamber that performs the next processing step of the processing sequence. Designed with. In prior art cluster tool configurations, a temporary station or buffer chamber is usually installed during the processing sequence so that the robot that lowered the substrate can complete other transfer steps and / or other robots are waiting. The substrate can be picked up and transferred to another desired location in the system. Placing a substrate in a chamber where the next processing step is not performed is a waste of time, which reduces the availability of the robot (s) and wastes space in the cluster tool, (One or more) fatigue increases. Adding a buffering step increases the number of substrate handoffs and increases the amount of backside particle contamination, which adversely affects device productivity. Further, unless the time spent in the buffer chamber is controlled for each substrate, the substrate processing sequence including the buffer step inherently has different substrate wafer histories. Controlling the buffering time increases the complexity of the system by adding processing variables, thereby making it easier to hit the maximum substrate throughput that can be achieved. If the robot limits system throughput, the maximum substrate throughput of the cluster tool is governed by the total number of operations that the robot performs to complete the processing sequence and the time it takes to operate the robot. Typically, the time it takes for a robot to perform a desired action is limited by limitations such as robot hardware, distance between processing chambers, substrate cleanliness issues, and system control. Typically, robot operating times are not very different from robot to robot and are almost consistent throughout the industry. As a result, the system throughput of a cluster tool that has an inherently lower number of robot operations to complete the processing sequence is less than other cluster tools that require more operations to complete the processing sequence, such as multiple buffering steps. It is higher than the system throughput of the containing cluster tool.

  [00270] Because the various embodiments of the cluster tool shown in FIGS. 2A-2G and 14A-14B require fewer operations and robots to transfer substrates across the system, prior art configurations include: There are no specific advantages. One example is accessing the cassette (s) 106, placing the substrate directly in a first processing chamber (eg, coater chamber 60A), and after processing in the first processing chamber, the substrate is placed in the next processing chamber ( For example, it is the ability of the front end robot 108 to send to the bake chamber 90). Prior art configurations require the use of multiple temporary stations between cassettes, processing chambers, and / or steppers / scanners, and multiple robots for completing the processing sequence via the cluster tool. In some prior art configurations, for example, it is common for a first robot to place a substrate in a first position, where the second robot picks up the substrate and places it in a second position within the processing chamber. . The substrate that has been processed in the processing chamber is then returned again to the first position by the second robot, where it is picked up by the first or third robot and transferred to another position in the system. This transfer process or transfer path is wasteful because it requires a separate robot to complete the transfer between the first position and the second position, and two value-free operations are required to transfer the substrate. It is. The addition of additional robots and / or increased value-added operations can be costly due to reduced substrate throughput, reducing the reliability of the cluster tool. The importance of this aspect can be better understood by knowing that the reliability of the continuous sequence is proportional to the product reliability of each component in the sequence. Thus, one robot with 99% start-up time will always be better than two robots with 99% start-up time, which is a continuous with 99% start-up time each This is because the startup time of the two robots is only 98.01%. Track lithography chamber processing times tend to be much shorter, and more processing steps are required to complete a typical processing sequence, resulting in system reliability, number of wafer handoffs, and robot added value. Operation greatly affects system throughput.

  [00271] One advantage of the cluster tool configuration described herein is that two or more robots have processing chambers (eg, refrigeration chamber 80, bake chambers) in different main modules (eg, front end module 306, central module 310, etc.). 90). For example, in the embodiment shown in FIG. 2F, the front end robot 108 can access the processing chambers in the first central processing rack 312 and the second central processing rack 314, and the central robot 107 can access the first processing rack 308 and the second processing rack 309. Access to the processing chamber inside. The ability of a robot to access a processing chamber in another major module, or “robot overlap”, prevents the obstacles associated with system robot transfer because only the robot in use can assist a robot that limits system throughput This is an important aspect. Therefore, the load balancing action performed by each robot during the substrate sequence can increase the substrate throughput, further repeat the wafer history of the substrate, and improve the system reliability. In one aspect, the system controller 101 is adapted to adjust the substrate transfer path based on optimized throughput or to work around a processing chamber that has become inoperable. The feature of the system controller 101 that enables throughput optimization is known as a logical scheduler. The logical scheduler determines priorities for tasks and board operations based on input from users and input from various sensors distributed throughout the cluster tool. The logical scheduler reviews the list of feature tasks required for each of the various robots (eg, front end robot 108, central robot 107, rear robot 109, one or more shuttle robots 110, etc.), thereby Adapted to assist in load balancing added to each. This feature task is held in the memory of the system controller. By using the cluster tool architecture and system controller 101 together to improve CoO, maximizing the use of the cluster tool increases the repeatability of the wafer history and improves the system reliability.

  [00272] In one aspect, the system controller 101 may be configured with a system (eg, a two-blade assembly 705 (FIGS. 16A- 16A) to allow robots to operate simultaneously, avoid collisions between robots, and improve system throughput. FIG. 16C), further programmed to monitor and control the operation of the end effectors of all robots provided in blade assembly 706 (FIGS. 16F-16G, etc.). A so-called “collision avoidance system” can be realized by a plurality of methods. Generally, the system controller 101 uses various sensors positioned on the robot or in the cluster tool for the purpose of collision avoidance. Monitor the position of each robot inside. In one aspect, the system controller is adapted to actively change the motion and / or trajectory of each robot to avoid collisions and minimize the length of the transfer path. In one embodiment, a “zone avoidance” system is used to prevent collisions between multiple robots. In one aspect of the zone avoidance system, the system controller uses its own hardware and software components to continuously monitor, update, and “open” or internal safe areas around each robot, and Can be defined. Thus, a defined “open” or safe area is an area where a robot can enter or traverse without colliding with another robot. In another embodiment of the collision avoidance system, the system controller includes a plurality of sensors (eg, encoders, position sensors, etc. on various robot axes) distributed around the cluster tool mainframe and on the robot (s). And the emitter are adapted to continuously track the actual position of each robot in the cluster tool and to monitor and control the movement of two or more robots from entering and colliding in the same space. In one aspect, the sensors are optical sensors positioned in various vertical and / or horizontal orientations within the cluster tool to monitor the position of each robot. In another aspect, a sensing system is used to monitor each robot and its components. The sensing system can triangulate the position of each of the various robot components by using emitters positioned relative to multiple sensors in the main frame on the various robot components. In one aspect, the sensing system includes an emitter and a sensor that are RF transmitters and receivers.

  [00273] FIG. 14A schematically illustrates a substrate transfer path to illustrate an example of a substrate flowing through the cluster tool 10. FIG. In this example, the number of buffer steps is minimized or completely eliminated. In general, the transfer path is a schematic representation of the path traveled when a substrate moves from one position to another so that various processing recipe steps can be performed on the substrate (one or more). Show. FIG. 14A illustrates a substrate transfer path after the processing sequence described in FIG. 3A. In this embodiment, the substrate is removed from the pod assembly 105 (reference numeral 105A) by the front end robot 108 and transferred to the coater chamber 60A (eg, CD1, CD2, etc. (FIG. 4A)) following the transfer path A1. The BARC coat step 510 can be completed on the substrate. Once the BARC process is complete, the central robot 107 follows the transfer path A2 and transfers the substrate to the bake chamber 90 (eg, B1, B3, etc.) (FIG. 4B). Here, the baking step 512 after BARC on the substrate can be completed. After completion of the post-BARC bake step 512, the shuttle robot 110 follows the transfer path A3 and transfers the substrate to the post-BARC refrigeration step 514 (eg, C1, C2, etc. (FIG. 4B)). After execution of the post-BARC refrigeration step 514, the central robot 107 follows the transfer path A4 and transfers the substrate to the coater chamber 60A (eg, CD1, CD2, etc. (FIG. 4C)). Here, a photoresist coating step 520 is performed on the substrate. After execution of the photoresist coating step 520, the central robot 107 follows the transfer path A5 and transfers the substrate to the bake chamber 90 (for example, B2, B4, etc. (FIG. 4B)). Here, a post-photoresist baking step 522 is performed on the substrate. After execution of the baking step 522 after the photoresist coating, the shuttle robot 110 follows the transfer path A6 and transfers the substrate to the refrigeration chamber 80 (for example, C1, C2, etc. (FIG. 4B)). Here, a refrigeration step 524 after photoresist is performed on the substrate. After execution of the refrigeration step 524 after photoresist, the central robot 107 follows the transfer path A7 and transfers the substrate to the OEBR chamber 62 (for example, OEBR1 or the like (not shown in FIG. 14A, see FIG. 4D)). . Here, OEBR step 536 is performed on the substrate. Next, the rear robot 109 follows the transfer path A <b> 8 and transfers the substrate to the stepper / scanner 5. After completion of the exposure step 538, the rear robot 109 follows the transfer path A9 and transfers the substrate to the PEB chamber 130 (FIG. 4D). After execution of the PEB step 540, the shuttle robot 110 follows the transfer path A10 and transfers the substrate to the refrigeration chamber 80. Here, a refrigeration step 542 after PEB is performed on the substrate. After execution of the refrigeration step 542 after PEB, the rear robot 109 (or the central robot 107) follows the transfer path A11 and transfers the substrate to the developer chamber 60B. Here, a development step 550 is performed on the substrate. After executing the developing step 550, the central robot 107 follows the transfer path A12 and transfers the substrate to the refrigeration chamber 80. Here, the front end robot 108 picks up the substrate, follows the transfer path A <b> 13, and transfers it to the pod assembly 105.

  [00274] In one embodiment of the cluster tool 10 illustrated in FIG. 14A, in order to transfer substrates in groups of two or more, grouped substrates are grouped into one group and transfer paths A1-A7, A10-A12 are defined. Have moved through. As mentioned above, this parallel processing format increases system throughput and reduces the number of robot operations that transfer substrate batches between processing chambers, resulting in reduced robot fatigue and increased system reliability. To do.

  [00275] In one embodiment of the cluster 10 illustrated in FIG. 14A, the transfer paths A3, A6, and / or A10 are completed by the central robot 107. In one embodiment, the transfer path A11 is completed by a shuttle robot 110 adapted to transfer substrates between the refrigeration chamber 80 and the developer chamber 60B.

  [00276] FIG. 14B schematically illustrates an example of a substrate transfer path through the configuration of the cluster tool 10 of FIG. 2F that can minimize or eliminate the number of buffer steps. FIG. 14B illustrates a substrate transfer path following the processing procedure illustrated in FIG. 13A. In the present embodiment, the front end robot 108 in FIG. 3 removes the substrate from the pod assembly 105 (reference numeral 105C), and transfers the substrate to the coater chamber 60A following the transfer path A1. This completes the BARC coating step 510 on the substrate. When the BARC process is completed, the front end robot 108 follows the transfer path A2 and transfers the substrate to the bake chamber 90 (for example, B1, B2, B3, etc. (FIG. 4G)). The post-BARC bake step 512 is completed on the substrate. After completion of the post-BARC bake step 512, the shuttle robot 514 follows the transfer path A3 and transfers the substrate to the post-BARC refrigeration step 514 (eg, C1, C2, etc. (FIG. 4G)). After performing the refrigeration step 514 after BARC, the front end robot 108 or the central robot 107 follows the transfer path A4 and the substrate is configured as a coater chamber 60A (eg, CD1, CD2, CD3, etc. (FIG. 4J)). In step 370, a photoresist coating step 520 is performed on the substrate in the processing chamber 370. After execution of the photoresist coating step 520, the central robot 107 follows the transfer path A5 and transfers the substrate to the baking chamber 90 (for example, B2, B4, etc. (FIG. 4I)), where the baking step 522 after the photoresist coating is performed. Is executed. After performing the photoresist coating bake step 522, the shuttle robot 110 follows the transfer path A6 and transfers the substrate to the refrigeration chamber 80 (eg, C1, C2, etc. (FIG. 4I)), where A refrigeration step 524 is performed. After performing the post-photoresist refrigeration step 524, the central robot 107 follows the transfer path A7 to transfer the substrate to the OEBR chamber 62 (eg, OEBR1 etc. (FIG. 4I)), where the OEBR step 536 is executed. . Next, the central robot 107 follows the transfer path A8 and transfers the substrate to the stepper / scanner 5. After completion of the exposure step 538, the central robot 107 follows the transfer path A9 and transfers the substrate to the PEB chamber 130. After execution of PEB step 540, shuttle robot 110 follows transfer path A10 to transfer the substrate to refrigeration chamber 80, where refrigeration step 542 after PEB is executed. After execution of the refrigeration step 542 after PEB, the central robot 107 follows the transfer path A11 and transfers the substrate to a processing chamber 370 configured as a developer chamber 60B (eg, CD1, CD2, CD3, etc. (FIG. 4J)), Here, the developing step 550 is executed. After executing the developing step 550, the front end robot 108 follows the transfer path A12 and transfers the substrate to the pod assembly 105. In one aspect, the transfer path A12 is completed by using the central robot 107 to pick up the substrate from the developer chamber 60B, transfer it to the front end robot 108, and then transfer it to the pod assembly 105.

  [00277] In one aspect, the transfer path A12 is such that the central robot 107 transfers the substrate to the refrigeration chamber 80 in the first processing rack 308, and then uses the front end robot 108 to transfer the substrate to the cassette. It is divided into one step (not shown). In this configuration, the refrigeration chamber 80 acts as a “safe” position where the substrate can reside without being exposed to thermal energy or processing fluid that can affect the wafer history and the amount of contamination on the processing substrate. . The “safe” position coincides with the holding of the substrate on the raised lift pins 87D (shown in the lower position of FIG. 10A) or the holding of the substrate on the cold plate block 83B (FIG. 10A).

  [00278] In one aspect, transfer path A12 is completed by central robot 107 picking up a substrate from developer chamber 60B and transferring it to pod assembly 105. In this configuration, the central robot 107 translates the full length distance of the cluster tool 10 using a slide assembly (not shown) and a translation actuator (for example, a linear servo motor (not shown)) to Up to the desired reachable range.

  [00279] In one aspect of cluster 10 illustrated in FIG. 14B, transfer paths A3, A6, and / or A10 are completed by central robot 107 or front end robot 108. In another aspect of the cluster tool 10 shown in FIG. 14B, in order to move the grouped substrates as a group along the transfer paths A1 to A7 and A10 to A12, two or more substrates are grouped and transferred. Is done.

Cluster robot design Vertical rail robot design
[00280] FIG. 15A is an isometric view of the cluster tool 10 illustrating one embodiment of the central robot 107. FIG. This central robot 107 embodiment transfers substrates between various processing chambers included in the front processing rack 52, the first central processing rack 152, the second central processing rack 154, and / or the rear processing rack 202. A frog-leg type robot (hereinafter FLR or FL-type robot) assembly 602 adapted to do so is included. The second central processing rack 154 has been removed from FIG. 15A for the purpose of highlighting and clarifying the components included in this embodiment. Referring to FIGS. 15A-15D, the FLR assembly 602 generally includes an upper frog leg (FL) robot assembly 610, a lower flogg leg (FL) robot assembly 620, and a lift rail assembly 626. In general, lift rail assembly 626 includes a front rail 614 and a back rail 612. Thus, this configuration includes two robot assemblies, an upper FL robot assembly 610 and a lower FL robot assembly 620, which are adapted to operate independently of each other in both vertical and horizontal planes. . In this embodiment, each of the independent upper FL robot assembly 610 or the independent lower FL robot assembly 620 can move in a vertical plane (ie, along the lift rail assembly 626), and the FL robot 625 can be moved to the system controller. By moving according to the command from 101, a board | substrate can be transferred to the arbitrary positions of a horizontal surface. 15A-15D illustrate a configuration that includes two robot assemblies, an upper FL robot assembly 610 and a lower FL robot assembly 620. Other embodiments of the cluster tool 10 may include more than two robot assemblies. In another embodiment of the cluster tool 10, a single FL robot assembly is utilized to transfer the substrate through the cluster tool.

  [00281] FIG. 15B is a plan view of the cluster tool 10 in which the substrate from the processing chamber contained within the back processing rack 202 is moved by the lower FL robot assembly 620 of the FL robot assembly 602. Exchanged.

  [00282] FIG. 15C is an isometric view of the central robot 107 highlighting various components of the upper FL robot assembly 610 and the lower FL robot assembly 620. FIG. The lift rail assembly 626 is typically mounted on a central module frame (not shown) that is part of the central module 150. 15A to 15D, the FL type robot 625 in the upper FL type robot assembly 610 or the lower FL type robot assembly 620 faces each other (that is, the upper FL type robot faces downward and the lower FL type robot faces upward. The upper FL robot assembly 610 or the lower FL robot assembly 620 are both upward or downward within the scope of the present invention, but not different from the scope of the present invention. A suitable configuration can also be used.

  [00283] FIG. 15D is a plan view of the lower FL robot assembly 620 and is intended to illustrate various components commonly found within the upper FL robot assembly 610 or the lower FL robot assembly 620. FIG. In general, the upper FL robot assembly 610 or the lower FL robot assembly 620 includes an FL robot 625 and a support assembly 624. In one embodiment shown in FIGS. 15A-15D, FL-type robot 625 has two substrate transporters (i.e., 611A, 611B) adapted to transfer substrates between various processing stations, however, This configuration is also intended to limit the scope of the invention, as the number of substrate transport devices or the use of a frog-leg type configuration is not intended to limit the various aspects of the invention described herein. is not. An example of an exemplary FL robot having two substrate transport devices that can be adapted to obtain the benefits of the present invention is shown in US patent application Ser. No. 5 filed Apr. 11, 1994, filed on the same application. No. 447, 409 “Robot Assembly”. The entirety of the above application is incorporated herein. Other examples of FL-type robot designs that can be adapted to benefit from the present invention include, but are not limited to, US Patent Application No. 5,469,035 “Two” filed on August 30, 1994 by the same applicant. -Axis magnetically coupled robot ", U.S. Patent Application No. 6,379,095 filed April 14, 2000," Robot For Handling Semiconductor Substrates ". The entirety of the above application is incorporated herein.

  [00284] In one embodiment, where the FL-type robot 625 has two substrate transporters 611A-611B, the FL-type robot 624 typically includes a two-axis motor 615, primary arms 618A-B, and secondary arms 619A-D. , Wrist assemblies 621A-B, and substrate transport devices 611A-B. In general, as the various axes of the biaxial motor 615 operate, the primary arms 618A-B rotate in the opposite direction and the substrate transporters 611A-B extend or retract or rotate in the same direction. Then, the substrate transport devices 611A-B are rotated to desired positions. The FL type robot 625 is mounted on a support portion 613 of a support assembly 624 that supports and holds the robot assembly 625.

  [00285] Referring to FIGS. 15C-15D, the support assembly 624 generally includes a support 613, a motor assembly 617A in communication with the front rail 614, and a motor assembly in communication with the back rail 612. These are both attached to the support 613. In general, the motor assembly 617A and the motor assembly 617B include an actuator 630 and a guide mechanism 631. In one embodiment, actuator 630 is a direct drive brushless linear servomotor. This servomotor is connected to a base robot component 616A-B (eg, a secondary coil or “rotor” portion) mounted on a lift rail assembly 626 component, and is attached to an FL type robot assembly component (eg, symbol 610 or 620) is adapted to move up and down independently. In one embodiment, from a cost and ease of control perspective, only one of the lift rails (ie, front rail 614 and back rail 612) has one actuator 630 and the other rail has only guide mechanism 631. It is advantageous to have it. Direct-drive brushless linear servo motors are available from Danaher Motion (Wooddale, Ill.), Or Aerotech, Inc. (Pittsburgh, Pennsylvania). In another embodiment, actuator 630 may be a stepper motor or another type of actuator that can be used to raise and lower various FL robot assembly 610 or 620 components.

  [00286] The guide mechanism 631 supports the FL robot assembly 610 or the FL robot assembly 610 or the FL robot assembly 620 component by supporting and accurately guiding them on the lift rail when the FL robot assembly 610 component or the FL robot assembly 620 component is raised or lowered. The position and accuracy of the movement of the FL robot assembly 620 is well controlled and adapted for consistent movement and transfer of the substrate. In one embodiment (not shown), the guide mechanism 631 includes a linear guide that supports and holds the FL robot assembly 610 component or the FL robot assembly 620 component. Linear guides can be purchased from Danaher Motion (Wooddale, IL). In another embodiment shown in FIGS. 15C-15D, wheels 619 are attached to motor assemblies 617A-B in an orthogonal configuration, and when the wheels 619 roll over a T-shaped rail structure 618, an FL robot assembly. Positioning and precise control of the 610 component or FL robot assembly 620 component is performed.

  [00287] In one aspect of the invention, FL robot assembly 602 includes two or more FL robot assemblies (eg, 610, 620) synchronized to allow substrate grouping and group transfer. To do. This configuration is advantageous because it improves the substrate throughput within the cluster tool. In one aspect, two or more FL robot assemblies are physically coupled so that the movements of each blade of the FL robot assembly are grouped together. In this case, the robot assembly 610 is separated by a fixed distance and operates synchronously. In another aspect, the FL robot assemblies (eg, 610, 620) are mechanically coupled and are therefore maintained at a fixed distance, but the respective FL robots 625 are independent of each other. (E.g., operate independently on a horizontal plane).

  [00288] In another aspect, the system controller 101 is used to control and synchronize the operation of each of the two or more FL robot assemblies so that the substrates can be transferred in groups of two or more. ing. For example, if the central robot 107 is an FL robot assembly 602 that includes two robots, the upper FL robot assembly 610 and the lower robot assembly 620 are used to coat the coater chamber 60A (eg, CD1, CD2 (FIG. 4A)). ), And then lowering the substrate into the desired bake chamber 90 (eg, B1, B5 (FIG. 4B)) approximately simultaneously, the transfer path A2 described in FIG. 14A can be completed. This configuration is advantageous because it improves throughput by moving in groups and allows each robot to move independently if necessary to complete another desired task.

B. Joint robot
[00289] FIG. 16A is an isometric view of one embodiment of a central robot 107 that includes an articulated robot assembly 702 (hereinafter AR assembly 702). The AR assembly 702 transfers substrates between various processing chambers contained within the front end processing rack 52, the first central processing rack 152, the second central processing rack 154, and / or the rear processing rack 202. Have been adapted. In order to emphasize and clarify the components included in this embodiment, the second central processing rack 154 has been removed from FIG. 16A. In general, the AR assembly 702 includes an articulated robot 710 and a two-blade assembly 705. In general, the articulated robot 710 is a 6-axis articulated robot, which is described in Mitsubishi Electric Corporation (Tokyo, Japan), Kawasaki Robotics (USA), Inc. (Wixom, Michigan), Staubli Corp. (Duncan, South Carolina). In one embodiment, the 6-axis articulated robot is a Stable Corp. Model number TX90 available from (Duncan, South Carolina). The articulated robot 710 has a robot base 713A and a machine interface 713B that connect the robot to the cluster tool and end effector assemblies (eg, two blade assembly 705 and blade assembly 706) to the robot. In general, a 6-axis articulated robot is advantageous because of its multi-axis and multi-joint design, the reach of the articulated robot is far superior to that of conventional robots, and The reachable range of the multi-joint robot is that the movement of the end effector that holds and transfers the substrate (one or more) can be more efficiently avoided by the robot base 713A during the substrate transfer. It is easier to “overlap” because they are not linked and / or because the reliability of articulated robots exceeds most conventional robots.

  [00290] The two-blade assembly 705 generally includes a support 720, two or more blade assemblies 715 (eg, a first blade assembly 715A, a second blade assembly 715B, etc.). The support unit 720 is attached to the joint robot 710, and is guided by the support robot 710. As a result, the blades in the first blade assembly 715A and the blades in the second blade assembly 715B pick up the substrates, respectively, and take them in the processing rack Can be installed in two different processing chambers. The pitch (see “A”) or distance between the robot blades is fixed by the distance between the first support surface 720A and the second support surface 720B, and between the processing chambers held in the processing rack. Designed to match the pitch of Thus, for example, the distance between the transfer positions of the bake chambers labeled B1 and B4 in the first central processing rack 152 is the same as that of the coater / developer chamber labeled CD1 and CD2 in the front end processing rack 52. After completion of the BARC coating step 510, the substrate can be transferred to a baking chamber labeled B1, B4 to complete the post-BARC baking step 512. Referring to FIG. 16B, pitch “A” is generally defined as the distance or space between blades 711A-B in a direction perpendicular to substrate receiving surfaces 712A-B. In one embodiment, the pitch (reference “A”) is a distance of about 100-1200 mm, preferably about 300-700. Although the two-blade assembly 705 is illustrated with respect to the articulated robot assembly 702, other configurations would allow the two-blade assembly 705 to be mounted on another type of robot without changing the basic scope of the present invention. Can be used.

  [00291] In one aspect, substrate receiving surfaces 712A-B hold a substrate positioned on a blade (not shown) using an edge gripping mechanism that secures the substrate in place on the robot blade. Is adapted to be. The edge gripping mechanism catches the edge of the substrate at a plurality of points (for example, three points), and holds and holds the substrate.

  [00292] Referring to FIG. 16B, in one embodiment, each blade assembly 715 (eg, the first blade assembly 715A or the second blade assembly 715B) is typically one or more robot blade actuators 721 (reference numerals 721A-721B). And one or more robot blades 711 (see reference numerals 711A to 711B). The robot blade actuator 721 may be a direct drive brushless linear servo motor or other equivalent device capable of controlling the operation and position of the robot blade 711. In general, the pitch between robot blades is not affected by the movement or translation of one robot blade relative to another robot blade. This is because the actuated blade is preferably translated in one plane parallel to the other robot blades.

  [00293] FIG. 16C shows a pair of blade assemblies 715A, 715C mounted on a support bracket 722A positioned on a support surface 720A and a support bracket 722B positioned on a second support surface 720B. One embodiment of a two-blade assembly 705 is shown that includes a second pair of blade assemblies 715B, 715D. FIG. 16C further illustrates a configuration shown with the robot blade 711B in the operating position and the other blades (eg, 715A, 715C-D) in the retracted position. One aspect of the two-blade assembly 705 is contained within each blade assembly 715 (eg, 715A-D) by using a system controller (not shown) and its robot blade actuator 721 (eg, 721A-D). In addition, each robot blade 711 (for example, 711A to D) can be operated independently. In one aspect shown in FIG. 16C, the robot blades 711 in each pair of robot blades are aligned approximately horizontally above each other in horizontally spaced orientations (often referred to as “over / under” configurations). Since it can be physically positioned, the substrate can be held on each blade simultaneously. The over / under blade configuration is, for example, when the robot needs to remove the previous substrate from it to another chamber before placing the next substrate to be processed in the same processing chamber without leaving the reference position. Is advantageous. In another aspect, this configuration allows the robot to fill all the blades and then transfer them group by group to the desired location in the tool. For example, in FIG. 16C, four substrates can be transferred onto four blades. This configuration also has the additional advantage that the substrates transferred in groups can be ungrouped by dropping or picking up the substrates one at a time from each blade 711A-D. In another embodiment, three or more stacked substrates mounted on each support surface (eg, 720A, 720B in FIG. 16B) are used in place of robot blade “pairs” to provide multiple Transfer of groups of substrates can be further promoted.

  [00294] FIG. 16E extends a single blade (symbol 715D) to allow access to the substrate “W” in the pod assembly 105, allowing the substrate to be picked up and down in the cassette 106. A cross-sectional view of an under-type two-blade assembly 705 is shown. This arrangement allows substrates to be transported group by group through the system so that they can be lowered and / or picked up in a station (eg, cassette 106, stepper / scanner 5, etc.) that can accept only one substrate at a time. become.

  [00295] In one aspect, when performing a single substrate transfer task using a robot that includes two or more fixed robot blades, ie, does not include a robot blade actuator 721, at least one Because the robot is adapted to be “repositioned”, eg, flipped, rotated, and / or removed, the “repositioned” blade (s) will cause the substrate to be The process of transferring onto another robot blade is not interfered. In this structure, a special position or chamber (eg, a support chamber) is received in the robot blade and repositioned in the desired orientation so that another robot blade can be used to transfer the substrate. Can be adapted to do. The ability to reposition one or more robot blades allows the use of other processing chamber positions in close proximity, so that one or more processing chambers are not operating in a group-by-group transfer sequence, so the blade This is particularly effective when it is not possible to enter the processing chamber.

  [00296] FIGS. 16F and 16G are isometric views of one embodiment of the front end robot 108 or rear robot 109 that includes a single blade type articulated robot assembly 703. FIG. The single joint assembly 703 (hereinafter referred to as “SA robot assembly 703”) includes a front end processing rack 52, a pod assembly 105, a rear processing rack 202, a stepper depending on whether the robot is a front end robot or a rear end robot. / Adapted to transfer substrates between the various chambers in the scanner 5. In general, the SA robot assembly 703 includes an articulated robot 710 and a blade assembly 706. In general, the joint robot 710 is a six-axis joint robot, which is described in Mitsubishi Electric Corporation (Tokyo, Japan), Kawasaki Robotics (USA), Inc. (Wixom, Michigan), Staubli Corp. (Duncan, South Carolina).

  [00297] Referring to FIG. 16G, the blade assembly 706 generally includes the support 718 and blade assembly 715 (eg, first blade assembly 715A) described above. A support 718 is attached to the articulated robot 710 and guided by the articulated robot so that the robot blade 711 in the blade assembly 715 can pick up the substrate and place it in the processing chamber held in the processing rack. It has come to be. In one embodiment, the single blade articulated robot assembly 703 may include a pair of blade assemblies 715, such as one of the pairs shown and described in connection with FIG. 16C.

  [00298] In one embodiment, the front end robot 108 or the rear robot 109 is the two-blade assembly 705 shown and described above in connection with FIGS. 16A-16D, 14A-14B. This configuration allows the substrate to be transported through the system for each group, thus increasing throughput, CoO, and system reliability.

  [00299] FIG. 16H illustrates a mobile articulated robot (eg, showing an AR assembly) adapted to translate and position an articulated robot base 713 along the length of the cluster tool using a slide assembly 714. FIG. In this configuration, the articulated robot base 713 is connected to the actuator assembly 717 of the slide assembly 714, and the instructions from the system controller 101 can be used to move the AR assembly 702 to a desired position within the cluster tool. Has been adapted to. Slide assembly 714 generally includes an actuator assembly 717, a cover (not shown), and a base 716. Base 716 supports and mounts the AR assembly 702 component and the slide assembly component to the cluster tool. A cover (not clearly shown) is used to seal the actuator assembly 717 and other slide assembly features to prevent particles from forming before they reach the processing chamber, and Prevent damage during cluster tool maintenance. The actuator assembly 717 may generally include an actuator 719 and a guide mechanism 723 (reference numerals 723A, 723B). In one embodiment shown in FIG. 16H, actuator 719 is a direct drive brushless linear servomotor. The servo motor is adapted to move the AR assembly 702 along the length of the slide assembly 714 by disengaging the base 716 and a base component 719A mounted on a slider 719B (eg, a stator). Has been. Direct-drive brushless linear servo motors are available from Danaher Motion (Wooddale, Ill.), Or Aerotech, Inc. (Pittsburgh, Pennsylvania). In another embodiment, the actuator 719 may be a stepper motor or other type of actuator that can be used to position the robot. Guide mechanism 723 is mounted on base 716 and is used to support and guide the robot as it moves along the length of slide assembly 714. The guide mechanism 723 may be a linear ball bearing slide or a conventional linear guide well known in the art.

  [00300] Although FIG. 16H shows one robot mounted on a slide assembly 714, in another embodiment, two or more robots can be secured to the same slide assembly. In this configuration, it is possible to reduce the cost by reducing the number of redundant parts and improving the accurate operation of each robot. 16H illustrates a two-blade articulated robot mounted on a slide assembly 714, the robot type or number of blades is not intended to limit the scope of the present invention.

  [00301] FIG. 16I illustrates a cross-sectional view of one embodiment of a robot with two blades secured. The two blades are positioned to pick up two substrates in two separate pod assemblies 105 stacked vertically. In this configuration, a robot equipped with a plurality of blades takes the group positioned at the beginning and / or end of a substrate transfer sequence by picking up and / or lowering the substrates positioned in two cassettes (reference numerals 106A-B). It is adapted to be able to carry out the transfer process of the structured substrate. In one aspect, the cassette and pod assembly are separated by a distance “A” so that the robot can access the substrate at a similar location in all of the cassettes. In one aspect, when at least one cassette (e.g., 106A) is not required, various regions (e.g., 731A, 731B, etc.) are formed above and / or below another cassette to provide a blade The first fixed robot blade of the robot to which is fixed can access the first cassette without colliding with the second fixed robot blade and the cluster tool wall 731C. Thereby, in one aspect, the region 731B is formed such that the first blade 711A accesses a certain position in the lower cassette 106B and at the same time the lower blade 711B enters the region 731B without colliding with the wall 731C. Is possible. FIG. 16I illustrates a configuration in which the robot blades 711A to 711B are fixed to the support surfaces 720A to 720B of the support portion 720, and thus the robot blade actuator 721 is not used, but without changing the basic scope of the present invention, Other embodiments having robot blade actuators can also be used.

C. Shuttle robot
[00302] FIGS. 17A-17C illustrate various embodiments of a shuttle robot 110 that can be adapted to transfer substrates between chambers in various adjacent processing racks. The design here is used during subsequent processing steps, for example, between a post-BARC bake step 512 and a post-BARC refrigeration step 514, a post-photoresist bake step 522 and a post-photoresist refrigeration step 524. This is advantageous for use in transferring a substrate between a bake process chamber (eg, bake chamber 90, HMDS process chamber 70, PEB chamber 130, etc.) and a cooling chamber 80. Thus, the shuttle robot 110 reduces the workload on various system robots including the front end robot 108, central robot 107, and rear robot 109, thereby allowing the system to complete while another processing step is completed on the substrate. Used to cause the robot to perform another task.

  [00303] FIG. 17A is an isometric view of one configuration using the shuttle robot 110 to transfer substrates between three adjacent processing chambers, eg, between two bake chambers and a refrigeration chamber 80. FIG. Therefore, this configuration can be used, for example, between the baking chamber B1, the refrigeration chamber C1, and the baking chamber B2 in the central processing rack 152 shown in FIG. 4B.

  [00304] FIG. 17B is an isometric view of one configuration using the shuttle robot 110 to transfer substrates between two adjacent processing chambers, eg, a bake chamber 90 and a refrigeration chamber 80. Therefore, this configuration is, for example, between the bake chamber B1 and the refrigeration chamber C7 included in the front end processing rack 52 shown in FIG. 4A, and between the PEB bake chamber PEB1 and the refrigeration chamber C3 included in the rear processing rack 202 shown in FIG. 4D. 4A can be used between the HMDS processing chamber P1 and the refrigeration chamber C1 included in the front end processing rack 52 shown in FIG. 4A.

  [00305] FIG. 17C is an isometric view of the back side of the adjacent processing chamber shown in FIG. 17A or FIG. 17B. This isometric view is intended to illustrate one embodiment of shuttle robot 110. The shuttle robot 110 generally includes a robot blade 111 and a shuttle robot actuator assembly 120. The shuttle robot actuator assembly 120 generally includes a robot blade actuator 112, a slide assembly 113, and a robot drive assembly 119. The robot blade 111 generally includes a substrate holding range 111A and a mounting area 111B. The attachment area 111B is a range of the robot blade 111 used for attaching the robot blade 111 to the robot blade actuator 112 (see the mounting portion 112A). The substrate holding range 111A is adapted to act as a conventional vacuum chuck attached to a vacuum generation source (not shown) to hold the substrate during the substrate transfer process. The robot blade actuator 112 is an apparatus used to raise and lower the robot blade 111 to transfer a substrate from one processing chamber to another processing chamber. In one embodiment, robot actuator 112 is an air cylinder. In one embodiment, a linear actuator (eg, a brushless linear servo motor (not shown)) is mounted between the robot blade actuator 112 and the robot blade 111 to extend and / or retract the robot blade 111 (chamber). The substrate transfer process can be completed by lift pins or other substrate holding features within the processing chamber.

  [00306] In one embodiment, the slide assembly 113 is a linear ball bearing slide that guides the shuttle robot 110 as it transfers substrates between the various processing chambers. Generally, the slide assembly 113 includes a shuttle 113A, to which a robot blade actuator 112 can be attached. The clamp 118 is used to attach the shuttle 113A to the belt 117 of the robot drive assembly 119 to move the robot blade 111 between the various processing chambers.

  [00307] In one embodiment shown in FIG. 17C, the robot drive assembly 119 is a belt and pulley type system and is used to move the robot along the length of the slide assembly 113. In this configuration, the robot drive assembly 119 generally includes two or more idler pulleys 116A-B, a belt 117, and a motor 115, and is adapted to drive and control the position of the robot. In one embodiment, since the motor 115 is a DC servo motor with an integrated encoder, the system controller 101 can follow the position of the shuttle robot 110 and control it. In another embodiment of the robot drive assembly 119, a belt and pulley type system is substituted with a direct drive brushless linear servomotor that can be purchased from Danaher Motion (Wooddale, Ill.).

Integrated bake / refrigerated chamber
[00308] FIG. 18A illustrates one embodiment of an integrated bake / refrigeration chamber 800 that can be shared with various embodiments of the cluster tool. In general, the integrated bake / refrigeration chamber 800 has three main processing areas: an input area 830, a refrigeration area 810, and a bake area. These regions are subjected to various baking method steps (eg, post-BARC bake step 512, PEB step 540, etc.) and / or refrigeration method steps (eg, post-BARC refrigeration step 514, post-PEB refrigeration step 542, etc.). Can be adapted to execute a processing sequence. The integrated bake / refrigeration chamber 800 may include two or more access ports 802 (two are shown in FIG. 18A) within the enclosure 804, and these access ports 802 may include external robots (eg, Front end robot 108, central robot 107, etc. (not shown) are adapted to access input area 830 and / or refrigeration area 810 to pick up or lower the substrate. In general, the enclosure 804 includes an input station station 804A, a refrigerated chamber enclosure 804B, and a bake chamber enclosure 804C. These chambers are adapted to isolate various areas of the integrated bake / refrigeration chamber 800.

  [00309] In one embodiment, the input area 830 is used to remove the substrate from the external robot. In general, input region 830 is a sealed region that includes a substrate changer, such as lift pins 836 or other similar devices. The substrate changer is adapted to allow an external robot to pick up and lower a substrate in an integrated bake / refrigeration chamber 800. The input area 830 is also configured to allow the refrigerated transfer arm assembly 832 to pick up the substrate from the lift pins 836 and to lower the substrate to the lift pins 836.

  [00310] The refrigerated transfer arm assembly 832 generally includes a refrigerated blade 833 having a blade receiving surface 834 and a plurality of cutouts 835. The blade receiving surface 834 and the plurality of cutouts 835 pick up and hold substrates from various substrate changers in which the refrigerated blades 833 are in various processing regions of the integrated bake / refrigeration chamber 800. It is adapted so that it can be lowered there. In one embodiment, the refrigerated blades 833 of the refrigerated transfer arm assembly 832 are in thermal communication with the blade receiving surface 834 to allow temperature control of the temperature of the substrate positioned on the blade receiving surface 834. It includes an exchange device 837 (FIG. 18B). In one aspect, the temperature controller 838 (FIG. 18B) in communication with the system controller 101 is used to monitor and control the temperature of the heat exchange device 837. The heat exchange device 837 may be a thermoelectric device and / or an embedded thermal element to control the temperature of the substrate. In one aspect, the heat exchange device 837 includes a plurality of fluid channels (not shown). The fluid channel is incorporated in a refrigerated blade 833 and is configured such that a temperature-controlled heat exchange fluid flows through it. The blade receiving surface 834 may include mechanical features (not shown) for holding the substrate on the receiving surface. In one aspect, the blade receiving surface 834 may include a plurality of vacuum ports (not shown) that are connected to a vacuum source (not shown) to hold the substrate, Intimate contact between the substrate and the blade receiving surface 834 can be ensured.

  [00311] FIG. 18B illustrates one embodiment of a refrigerated transfer arm assembly 832 utilizing a refrigerated blade actuator assembly 839. The refrigerated blade actuator assembly 839 is similar to the shuttle robot actuator assembly 120 described above with respect to FIG. 17C and is refrigerated in any of the various processing areas of the integrated bake / refrigeration chamber 800. Used to control the position of the blade assembly 832. It will be noted that, for reasons of clarity, the common components used in the refrigerated blade actuator set 839 and shuttle robot actuator assembly 120 have not been changed in sign. In one aspect of the refrigerated transfer arm assembly 832, the system controller 101 is utilized to move the refrigerated blade assembly 832 vertically and horizontally in any of the various processing areas of the integrated bake / refrigeration chamber. Position in both directions. The positioning of the refrigerated blade 833 is performed using a refrigerated blade actuator assembly 839 on which one or more faces of the integrated bake / refrigeration chamber 800 are mounted. Referring to FIGS. 18A-B, the enclosure 804 includes a plurality of enclosure cutouts 806. The enclosure cutout 806 can allow a refrigerated blade 833 to transfer substrates between various processing regions of the integrated bake / refrigeration chamber 800.

  [00312] Referring to FIG. 18A, the refrigeration region 810 includes the refrigeration chamber 80 component shown and described with respect to FIG. 10A. In one aspect of the refrigerated region 810, the enclosure 804B may include one or more enclosures in order for the refrigerated transfer arm assembly 832 to facilitate substrate transfer between the various processing regions of the integrated bake / refrigerated chamber 800. A cutout 806 is included.

  [00313] Bake region 820 includes all components of bake chamber 90, HMDS process chamber 70, and PEB chamber 130 shown or described with respect to FIGS. 10B-10D. In one aspect of the bake region 820, the enclosure 804C has one or more cutouts to allow the refrigerated transfer arm assembly 832 to transfer substrates between the various processing regions of the integrated bake / refrigeration chamber 800. Part 806 is included.

  [00314] When using the integrated bake / refrigeration chamber 800, an external robot transfers the substrate through the access port 802 to the lift pins 836 in the input area. The refrigerated blade 833 positioned below the ribs and pins 836 moves vertically to remove the substrate from the lift pins 836 and position it on the blade receiving surface 834. Subsequently, the refrigerated blade 833 is moved to the bake area 820 and exits the bake area 820 after placing the substrate thereon. As a result, the baking process can be performed on the substrate. After performing the bake process, the refrigerated blade 834 picks up the substrate from the bake region 820, transfers it to the substrate changer in the refrigerated region 810, and exits the refrigerated region 810. When the refrigeration process is complete, the substrate is removed from the refrigerated area 810 through the access port 802 using an external robot. In one aspect, after performing the refrigeration process, the refrigerated blade 833 removes the substrate from the refrigerated area 810 and places it on lift pins 836 in the input area. This configuration is advantageous because the refrigerated area 810 is adapted to complete the refrigeration process on a new substrate and / or allows an external robot to pick up the substrate from the same location where it was placed. is there.

Integrated scanner / stepper using PEB cluster tool configuration
[00315] FIG. 19A is a plan view of one embodiment of the present invention in which the cluster tool includes a cluster tool 10A and a stepper / scanner 5A. In this configuration, PEB chamber 5C (ie, element 130 (FIG. 10D) described above) is integrated into stepper / scanner 5A, and the stepper / scanner can be removed from cluster tool 10A. In many cases, the throughput of a stepper / scanner is several times greater than the throughput of a track system type cluster tool, so having a single stepper / scanner dedicated to a single track system wastes the excess throughput capacity of the stepper / scanner. Therefore, this configuration is advantageous as compared with the prior art. This embodiment allows a single stepper / scanner to support multiple track systems, while also performing PEB step 540 and post-PEB refrigeration step 542 within the stepper / scanner. The photoresist becomes stable after the exposure process is executed.

  [00316] In one embodiment shown in FIG. 19A, the cluster tool 10A can include a front end module 50, a center module 150, a rear module 200 as shown and described above in connection with FIG. 1B. In this configuration, the cluster tool 10A is not integrated with the stepper / scanner, so the rear robot 109 (shown in FIG. 2E) is removed from the rear module 200 to reduce cost and system complexity. In another embodiment, the cluster tool 10A can include a different number of processing chambers and / or processing racks without departing from the basic scope of the present invention.

  [00317] In this configuration, the stepper / scanner 5A typically includes one or more PEB chambers 5C and one or more refrigeration chambers 5B (ie, reference numeral 80 (FIG. 10A) above). The number of PEB chambers and refrigeration chambers required depends on the throughput required by the stepper / scanner 5A and the processing time in the PEB and refrigeration chambers. In actual use, the PEB chamber 5C and / or the refrigeration chamber 5B acts as an input stage and / or output stage for the stepper / scanner so that the stepper / scanner robot (not shown) has a place to pick up and return the substrate. become. In one embodiment, if the PEB chamber 5C is adapted to both heat and cool the substrate (described above), at least two PEB chambers may be installed in a stepper / scanner not shown in FIG. 19A. It can be integrated into positions 5B and 5C. In one embodiment, only one PEB chamber is integrated into the stepper / scanner 5 when the PEB chamber 5C is adapted to both heat and cool the substrate (described above).

  [00318] FIG. 19B illustrates one embodiment of method step 504 that includes various process recipe steps that can be used in connection with the cluster tool 10A and stepper / scanner 5A illustrated in FIG. 19A. In this embodiment, the processing sequence is divided into three distinct parts: cluster tool stage 1, stepper / scanner stage, and cluster tool stage 2. Cluster tool phase 1 includes all processing steps that are completed before transfer to the stepper / scanner tool. This processing step includes removing the substrate from the pod 508A, BARC coating step 510, base step 512 after BARC, refrigeration step 514 after BARC, photoresist coating step 520, baking step 522 after photoresist coating, photo Step 524 after resist refrigeration, optical edge bead removal (OEBR) step 536, and installation step 508B in the pod are included. Next, the substrate pod is removed from the cluster tool 10A and placed on the stepper / scanner 5A to remove the substrate from the pod 508A, exposure step 538, post exposure bake (PEB) step 540, PEB. Processing steps including the subsequent refrigeration step 542 and the installation step 508B in the pod can be executed. Next, when the substrate pod is removed from the stepper / scanner 5A, a cluster tool stage 2 step including an installation step in the pod 508A, a development step 550, a refrigeration step 554 after development, and an installation step 508B in the pod. Will be able to complete. In another embodiment, the sequence of method step 504 can be rearranged or changed without changing the basic scope of the invention, one or more steps can be removed, and two or more steps can be combined into one step. Is possible.

Oval system configuration
[00319] FIGS. 20A-20B show the interior of the processing chambers contained within the various processing racks shown in FIGS. 4A-4K (eg, front-end processing rack 52, first central processing rack 152, etc.). FIG. 4 illustrates another embodiment of the cluster tool 10 positioned around a common center point in the system rather than being oriented in One drawback associated with linear orientation of the chamber is that it is difficult for the robot to reach the top and bottom positions in the processing rack, and the arm extension is large to utilize all available space. A large robot is required. This problem is particularly difficult to solve when a 6-axis joint robot is used, because the reach of the 6-axis joint robot is limited by the distance from the center point. This problem is accentuated when the chambers are at the top or end of a linearly arranged rack because they are furthest away from the center of the robot. In some cases, the height of the processing rack may not be fully available because all chambers outside the reach of the robot are inaccessible. This problem therefore requires additional chambers and / or robots to access these chambers, increasing the cost and throughput of the tool.

  [00320] In one embodiment shown in FIG. 20A, the use of another orientation allows the robot to access a processing chamber that may be considered oval or hemispherical. FIG. 20A is a side view of an oval cluster tool configuration that allows robot R1 to access the processing chambers (PM1-12). In this configuration, moving the top and bottom stations of the corner stack towards the center of the track further reduces the distance that the robot must travel to accommodate these stations. In this case, the stack of corners are linked in a stepwise pattern from the center to the top and from the center to the bottom. As a result, a small robot using a shorter reach can be used, and the number of times the robot is handled decreases due to the reduced reach.

  [00321] FIG. 20B shows a plurality of vertically spaced processing chambers (PM1-18) arranged around the center point of the robot (R1). This configuration utilizes a spherical work area. A spherical working range is provided by making it easier for a six-axis articulated robot to reach the robot by bringing the “corner” stack closer to the track center.

  [00322] In one aspect of the invention, the configurations illustrated in FIGS. 20A and 20B are combined to form a complete sphere, partial sphere, or hemisphere orientation processing chamber. The processing chamber is formed around the robot to reduce the distance that the robot moves to accommodate the processing chamber and to reduce transfer time between the processing chambers.

Gantry robot design configuration
[00323] FIGS. 21A-21D illustrate another embodiment of a cluster tool 10 that uses multiple robots configured in a parallel processing configuration around various processing racks so that a desired processing sequence can be performed. Show. In one embodiment, this parallel processing configuration includes three robots (reference numbers 420, 430, 450 shown in FIG. 21B), which are arranged in a parallel manner in a processing rack. Move in the vertical direction (hereinafter defined as the z-direction) and parallel direction to access the complete processing chamber. One advantage of this system configuration is that if one of the robots in the central area 425 fails or is disassembled for response purposes, the system can continue to process substrates using two other robots. . Another advantage of this configuration is that flexibility and modular architecture allow the user to configure as many processing chambers, processing racks, and processing robots as they need to meet their throughput needs.

  [00324] FIG. 21A illustrates one embodiment of a cluster tool 10 that includes three robots adapted to access various processing chambers stacked vertically within a first processing rack 460 and a second processing rack 480. FIG. FIG. 21A does not show the stepper / scanner 5 typically attached to the rear region 445.

  [00325] FIGS. 21B-21C are top and side views of the embodiment of the cluster tool 10 shown in FIG. 21A. 21A-21C are intended to illustrate some of the various robot and process chamber configurations that can be used with this embodiment. Generally in this configuration, the cluster tool 10 includes a front end region 405, a central region 425, and a rear region 445. Also generally, the front end region 405 includes one or more pod assemblies 105 and a front end robot 410. One or more pod assemblies 105 or FOUPs are adapted to receive one or more cassettes 106 that may include one or more substrates “W” or wafers to be processed within the cluster tool 10. ing. The central region 425 generally includes a first central robot 420, a second central robot 430, a third central robot 440, a first processing rack 460, and a second processing rack 480. The first processing rack 460 and the second processing rack 480 may include various processing chambers (eg, coater / developer chamber 60, bake chamber 90, refrigeration chamber 80, adapted to perform various processing steps found in the substrate processing sequence. Etc.). The front end robot 410 transfers the substrate between the cassette mounted in the pod assembly 105 and one or more processing chambers in the first processing rack 460 or the second processing rack 480 that abut the front end region 405. It is adapted to.

  [00326] The first central robot 420, the second central robot 430, and the third central robot 440 transfer the substrates to various processing chambers contained within the first processing rack 460 and the second processing rack 480. Have been adapted. In one embodiment, the second central robot 430 is adapted to transfer substrates between the first processing rack 460 and the second processing rack 480.

  [00327] Referring to FIG. 21B, in one aspect of the present invention, the first central robot 420 enters the processing chamber within the first processing rack 460 from at least one side, such as the first side 471 shown. Adapted to access. In another aspect, the second central robot 430 may access the processing chamber in the first processing rack 460 from at least one side and into the processing chamber in the second processing rack 480. It is adapted to be accessed from the second side 472 of 480 and the first side 473 of the second processing rack 480. In one aspect, the third central robot 450 is adapted to access the processing chamber in the second processing rack 480 from at least one side, such as the second side 474 shown. In one aspect, the first side 471 of the first processing rack 460, the second side 472 of the first processing rack 460, the first side 473 of the second processing rack 480, and the second side of the second processing rack 480. The parts 474 are all along one direction parallel to the respective horizontal motion assembly 490 (described below) of the various robot assemblies (ie, the first central robot 420, the second central robot 430, and the third central robot 450). Aligned.

  [00328] In one embodiment, the rear region 445 is adapted to transfer substrates between the processing chambers in the first processing rack 460 and the second processing rack 480 that abut the rear region 445 and the stepper / scanner 5. A rear robot 440.

  [00329] FIG. 21D illustrates a side view of one embodiment of the first processing rack 460 standing on the side closest to the third central robot 440 and facing the first processing rack 460. FIG. . Therefore, FIG. 21D corresponds to the diagrams shown in FIGS. 21A to 21C. Generally, the first processing rack 460 includes one or more coater / developer chambers 60, one or more refrigeration chambers 80, one or more bake chambers 90, one or more OEBR chambers 62, and one or more PEB chambers. 130, one or more support chambers 65, and / or one or more HMDS chambers 70. In one embodiment shown in FIG. 21D, the first processing rack 460 includes eight coater / developer chambers 60 (labeled CD1-8), 18 refrigerated chambers 80 (labeled C1-18), 8 this bake chamber 90 (labeled B1). -8), six PEB chambers 130 (labeled PEB1-6), two OEBR chambers 62 (62), and / or six HMDS processing chambers 70 (labeled P1-6).

  [00330] FIG. 21E illustrates a side view of one embodiment of the second processing rack 480 standing on the side nearest the third central robot 440 and facing the second processing rack 80. FIG. Therefore, FIG. 21E corresponds to the diagrams shown in FIGS. 21A to 21C. In general, the second processing rack 480 includes one or more coater / developer chambers 60, one or more refrigeration chambers 80, one or more bake chambers 90, one or more OEBR chambers 62, and one or more PEB chambers. 130, one or more support chambers 65, and / or one or more HMDS chambers 70. In one embodiment shown in FIG. 21E, the second processing rack 480 includes four coater / developer chambers 60 (labeled CD1-4), 24 refrigerated chambers 80 (labeled C1-24), and 12 bake chambers 90. (Labels B1-12), six PEB chambers 130 (Labels PEB1-6), and / or six support chambers 65 (Labels S1-6).

  [00331] The orientation, positioning, and number of processing chambers shown in FIGS. 21A-21E are not intended to limit the scope of the invention, but are intended to illustrate various embodiments of the invention.

  [00332] FIG. 21F illustrates the processing steps corresponding to each cluster tool robot to complete the method step 501 illustrated in FIG. 3A using the cluster tool configuration illustrated in FIGS. 21A-21D. . The front end robot 410 corresponds to the method steps 508A, 510, 550, and 508B surrounded by the box indicated by the symbol “A”. In one embodiment, the BARC coat step 510 is completed in the coater chamber 60A mounted in the processing rack 460 that abuts the front end region 405. Referring to FIGS. 21B, 21D, and 21F, the front end robot 410 removes the substrate from the pod assembly 105 and places it in one of the coater chambers 60A with CD1 or CD2 in the first processing rack 460. In another embodiment, the BARC coating step 510 is completed in the coater chamber 60A mounted in the first processing rack 460 or the second processing rack 480 that abuts the front end region 405. In this embodiment, the development step 550 can be completed in the refrigerated chamber 80 mounted in the second processing rack 480 that contacts the front end region 405.

  [00333] In one embodiment, the process of transferring a substrate between method steps 510-536 surrounded by a dashed line "B" is included in a first processing rack 460 and a first central robot 420 and a second central robot. And completed chamber. In another embodiment, the second central robot 430 can be used to transfer substrates between the first processing rack 460 and the second processing rack 480 so that the available chambers in these racks can be used as needed. It is possible to satisfy the processing sequence request.

  [00334] In one embodiment, the process of transferring the substrate between process steps 536-550 enclosed by box "C" is completed using the rear robot 450. In one embodiment, the OEBR step 536 is completed in the OEBR chamber 62 mounted in the first processing rack 460 that abuts the rear region 445. Referring to FIGS. 21B and 21D, the rear robot 450 removes the substrate from the OEBR chamber 62 and replaces the substrate in the stepper / scanner 5 that completes the exposure step 538. After completion of the exposure step 538, the rear robot 450 removes the substrate from the stepper / scanner 5, and one of the PEB chambers designated PEB1-6 included in the first processing rack 460 or the second processing rack 480. Install in one.

  [00335] In one embodiment, the process of transferring substrates between process steps 540-550 enclosed by box "D" is included in the second central robot 430 and third robot 440 and the second processing rack 480. And completed chamber. In another embodiment, the second central robot 430 is used to transfer substrates from the first processing rack 460 to the second processing rack 480, so that the available chambers in these racks are used as needed. The processing sequence request can be satisfied.

  [00336] Referring to FIGS. 21B, 21D, and 21F, after completion of process step 550, front end robot 410 removes the substrate from the developer chamber, designated CD1 or CD2, and places it in the corresponding pod assembly 105. .

  [00337] FIG. 21G illustrates one embodiment of a robot assembly 411 that can be adapted for use as the front end robot 410, the first central robot 420, the second central robot 430, the third central robot 440, and / or the rear robot 450. Illustrated. In general, the robot assembly 411 includes a robot hardware assembly 485, a horizontal motion assembly 490, and two vertical motion assemblies 495. The robot hardware assembly 485 generally includes a conventional selectively compliant articulated robot arm (SCARA) robot that includes two arms / blades that can be independently controlled. In another embodiment shown in FIG. 21H, a single blade type robot hardware assembly 485 is used to transfer the substrate. A two blade type robot is advantageous, for example, when the robot must remove a substrate from the same processing chamber before placing the next substrate in the processing chamber. An exemplary two-blade type robot can be purchased from Asyst Technologies (Fremont, CA).

  [00338] In one embodiment of the cluster tool 10, the front end robot 410, the first central robot 420, the second central robot 430, the third central robot 440, and / or the rear robot 450 are grouped with two or more substrates. Can be adapted to be transported as As a result, the substrate is processed in parallel, thereby improving the system throughput. For example, in one aspect, a robot including multiple arms / blades capable of independent control is used to pick up multiple substrates from multiple processing chambers and place them in subsequent multiple processing chambers. In one aspect, the robot is adapted to simultaneously pick up and lower the substrate using an arm having a plurality of blades spaced at a desired distance or pitch. For example, the front end robot 410, the first central robot 420, the second central robot 430, the third central robot 440, and / or the rear robot 450 have a pair of blade assemblies 715A, 715B. This pair of blade assemblies is mounted on a support 720 (shown in FIGS. 16A-16B) attached to one end of an independently controllable arm / blade of the SCARA robot. In another aspect, the robot is adapted to pick, transfer, and lower multiple substrates separately. For example, a two-arm robot can pick up a substrate from a first chamber using a first arm or blade, then move to a second processing chamber and pick up a substrate using a second arm or blade. , It is possible to transfer the substrates in groups and lower them.

  [00339] Referring to FIGS. 21G-21I, the horizontal motion assembly 490 generally includes an enclosure 491, a robot actuator 489, a robot support interface 487, a linear slide 488, and a cable guide assembly 492. The linear slide 488 can include one or more linear ball bearing slides or conventional linear guides that are used to transfer a substrate between various processing chambers, such as a robot support interface 487 (eg, a robot base interface) and The robot hardware assembly 485 is guided. In one embodiment, the robot actuator 489 is a direct-drive brushless linear servomotor illustrated in FIG. 21I and associates the robot support interface 487 with the linear slide 488 mounted on the support structure 486 of the enclosure 491. Adapted to move. FIG. 21H illustrates one embodiment of a horizontal motion assembly 490, in which a motor 489A (eg, a DC servo motor, stepper motor, etc.) and a motor to allow transfer of substrates between processing chambers; A belt (not shown) and pulley system (not shown) running horizontally along the length of the horizontal motion assembly 490 are adapted to transfer and position the robot support interface 487.

  [00340] FIG. 21H illustrates an isometric view of one embodiment of the robot assembly 411 illustrated in FIG. 21G and is intended to illustrate the internal components contained within the horizontal motion assembly 490 and the vertical motion assembly 495. Yes. Generally, the vertical motion assembly 495 includes a lift rail assembly 495A, a lift actuator 495B, and a vertical enclosure 495D (see FIG. 21G, not shown in FIG. 21H). The lift rail assembly 495A includes a structural support 496 and a guide mechanism 494 for accurately raising and lowering the horizontal motion assembly. The structural support 496 is a conventional structural member, such as an I-beam or other common structural component, to connect the robot assembly 411 to a frame member (not shown) in the cluster tool 10 and to operate vertically. It is designed to support the weight of the components of assembly 495 and horizontal motion assembly 490 and the loads created thereby. The guide mechanism 494 may be a linear ball bearing slide or a conventional linear guide that can align with the horizontal motion assembly 490 and accurately guide it as it moves vertically along the guide mechanism 494. Good.

  [00341] Referring to FIG. 21H, in one embodiment of the vertical motion assembly 495, the lift actuator 495B is used with a belt and pulley configuration (not shown) for lifting and lowering the horizontal motion assembly 490 and its components. A motor 495C (for example, a DC servo motor, a stepper motor, or other type of actuator) is included. In another embodiment of vertical motion assembly 495 (not shown), lift actuator 495B is a direct-drive brushless linear servomotor that can be purchased from Danaher Motion (Wooddale, IL). In one embodiment of the robot assembly 411, each vertical motion assembly includes a lift actuator 495B for lifting and lowering the horizontal motion assembly 490 and other support components. In another embodiment of the robot assembly 411, the single lift actuator 495B mounted on one of the two vertical motion assemblies 495 and the other vertical motion assembly 495 includes only the guide mechanism 494.

  [00342] FIG. 21I illustrates an isometric view of one embodiment of an enclosure 491 included within a horizontal motion assembly 490. FIG. Enclosure 491 is adapted to cover and support components in horizontal motion assembly 490 for safety and contamination reduction reasons. If particle generation is normally generated by multiple mechanical components that rotate, slide, or contact, in the horizontal motion assembly 490 and in the vertical motion assembly 495 while the substrate is transferred through the cluster tool. It is important that the component does not cause defects in the substrate. In general, the enclosure 491 includes a plurality of walls (FIGS. 491A-F) and a support structure 486 that minimizes the chance that particles generated within the enclosure will advance to the surface of the substrate. Forming an enclosed region for The support structure 486 is a structural member to which the walls 491A to 491F, the robot actuator 489, the robot hardware assembly 485, and the linear slide 488 are all attached.

  [00343] The fan unit 493 draws air from the enclosure 491 through the fan port 491G into one of the walls of the enclosure 491 and pushes the air containing the particles into a filter (not shown), thereby It is adapted to remove particles before the air is exhausted into the cluster tool 10 (see reference “A”). In this configuration, the fan 493A included in the fan unit 493 creates a negative pressure inside the enclosure 491 so that air outside the enclosure 491 is drawn into the enclosure, and particles generated inside the enclosure 491 are generated. Designed to prevent the possibility of leakage. In one embodiment, the filter (not shown) is a HEPA type filter or other type of filter that can remove the generated particles from the air. The configuration shown in FIG. 21I illustrates one embodiment that uses three fan units 493 to draw air from the enclosure. In another embodiment, one or two fan unit systems can be used in place of the three fan unit 493 configuration shown without departing from the scope of the present invention.

  [00344] In one embodiment of the lift rail assembly 495A, the fan unit 493 (not shown) draws air from the interior of the respective vertical enclosure 495D so that particles generated within the vertical motion assembly 495 are substrated. It is adapted to minimize the chance of causing defects in the device formed on the surface.

Device to find the center of the board
[00345] Electronic device manufacturers are often competitive in the market and in an effort to reduce CoOw, often reducing substrate scrap and increasing total system throughput (ie, weekly wafer start) Attempts have been made to improve system startup time and reliability by spending a great deal of time. One factor that affects system start-up time and reliability is substrate misalignment within the various processing chambers that cause substrate damage (eg, chipping, substrate breakage, etc.). If a substrate is damaged, the user stops the ongoing process, discards all partially processed substrates, cleans the affected chamber (s), and then proceeds with the processing sequence. All of these add to the system downtime and cost, which must be restarted. In order to prevent variability in substrate processing from one substrate to another and damage to the substrate, typically caused by substrate misalignment in the processing chamber or one of the other chambers, the robot can move the substrate from the transfer position. It is repeatedly calibrated for picking up and down. The transfer position may be, for example, the center point between the process chamber lift pins or the center point of the chuck.

  [00346] To solve these problems, one embodiment of the cluster tool 10 uses a substrate position error detection and correction system 1200 (hereinafter SPEDAC 1200) shown in FIG. 22A. FIG. 22A illustrates an isometric view of two adjacent processing chambers 1220 (eg, bake chamber 90, refrigeration chamber 80, coater / developer chamber 60, etc.) held in a processing rack. Two separate substrate position detection and correction systems 1200 are mounted outside each opening 88 in each processing chamber 1220. FIG. 22A illustrates one embodiment of a SPEDAC system 1200 with a transmitter 1206 mounted on the top support 1204 and a detector 1205 mounted on the bottom support 1203, all of which are connected to the processing chamber 1220. is doing.

  [00347] The SPEDAC system 1200 determines whether there is a substrate thereon as the substrate transfer robot blade enters or exits the openings 88 found in various processing chambers, and in subsequent transfer steps. The error is corrected by repositioning the robot blade 1210. The SPEDAC system 1200 uses a pair of beams (symbol “A”) sent from the two pairs of transmitters 1206 to the detector 1205 to detect the position of the substrate passing through the beams, and to determine the robot position. Adjust to correct board position errors. When the system detects an error in the substrate position, it determines the degree of misalignment, and if such misalignment can be corrected, the system can detect this by moving the robot blade position or alerting the operator. Correct it. In addition, a description of an illustrative method for detecting and correcting substrate misalignment on a robot blade is described in further detail in the following patent: US Pat. No. 5, issued Oct. 8, 1996. No. 5,563,798, “Wafer Positioning System”, U.S. Pat. No. 5,483,138, issued on Jan. 9, 1996, “System and Method for Automated Positioning in A Processing in 1999” U.S. Patent Application No. 5,980,194 issued to Freaks et al. The entirety of these patents is incorporated into the present disclosure without conflict. An example of an exemplary control robot position control method is further described in U.S. Patent Application No. 6,556,887 issued April 29, 2003 to Freeman et al. The entirety of this patent is incorporated into the present disclosure without conflict.

Global positioning
[00348] Another embodiment that can be used to improve system startup time and reliability by preventing substrate damage (eg, chipping, substrate failure) is a Global Positioning System (GPS) (not shown). ) To track and correct errors in the position of the robot blade and / or the position of the substrate. In this configuration, a global positioning system is used to define the location of a robot blade (substrate or robot end effector) in relation to a given system location reference. Typically, by incorporating an encoder on the shaft of the drive motor for each control axis, position feedback of the robot blade value is provided. This encoder reports the position of the motor, not the actual position of the robot blade. The actual position changes from the reported position due to loose coupling between various drive components that may occur, incorrect robot parameter settings, robot position control drift, undetected motion failures, hardware collisions. May end up. Therefore, in order to solve these problems, an embodiment of the present invention can be used to track the actual position of the robot blade and also the position of the substrate. In one embodiment, the global positioning device 1300 and the communication system (eg, RF transmitter 1302, cable, etc.) are integrated into a robot blade or robot to measure its position and feed it back to the system controller. . Therefore, the system controller uses the 3D coordinate system measurements for each transfer position previously collected using a GPS sensor or another device to adjust the position of the various robot parts to adjust blade position errors. Will be able to fix. The robot parts are positioned using conventional control means including an encoder or other feedback type device used to control the position of the robot.

  [00349] In one embodiment, the global positioning device 1300 is communicating with an RF transmitter 1302 that is in communication with an RF transmitter 1302 mounted in the vicinity of the robot blade, i.e., with an RF receiver 1303 that is communicating with the system controller 101. Real-time position feedback of position can be achieved. The global positioning device 1300 can compare the actual position of the robot blade with the commanded position and eliminate failures caused by position skidding and undetected hardware failures.

  [00350] In one embodiment, the system controller 101 uses the GPS system and the SPEDAC system 1200 (described above) to correct misalignment errors in the placement of the robot and the placement of the substrate on the robot blade. Therefore, this embodiment is used to correct substrate placement errors or substrate operating errors relative to robot blades.

  [00351] While the foregoing description is of embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. This basic range is determined by the claims.

1 is an isometric view illustrating a cluster tool according to one embodiment of the present invention. FIG. FIG. 1B is a plan view of the processing system illustrated in FIG. 1A that enables advantageous use of the present invention. FIG. 1B is another isometric view illustrating a view of the cluster tool shown in FIG. 1A from the opposite side. FIG. 6 is a plan view illustrating another embodiment of a cluster tool including a front end module adapted to communicate with a stepper / scanner tool. FIG. 6 is a plan view illustrating another embodiment of a cluster tool that includes only a stand-alone front end module. FIG. 6 is a plan view illustrating another embodiment of a cluster tool that includes a front end module and a central module adapted to communicate with a stepper / scanner tool. FIG. 6 is a plan view illustrating another embodiment of a cluster tool including a front end module, a center module, and a rear module. In this case, the rear module includes a first rear processing rack and a second rear processing rack, and the rear robot is adapted to communicate with a stepper / scanner tool. 1B is a plan view of the processing system illustrated in FIG. 1A that includes a twin coater / developer chamber 350 and incorporates a bake / refrigeration chamber 800 that enables advantageous use of the present invention. FIG. FIG. 5 is a plan view illustrating another embodiment of a cluster tool that includes a front end module and a central processing module, each including two processing racks. FIG. 6 is a plan view illustrating another embodiment of a cluster tool that includes a front end module, a central processing module, and a rear processing module, each including two processing racks. FIG. 6 is a plan view illustrating another embodiment of a cluster tool including a front end module and a center module. Each of both modules includes two processing racks and a slide assembly that translates the base of the front end robot and the central robot. FIG. 6 is a plan view illustrating another embodiment of a cluster tool including a front end module, a central processing module, and a rear processing module. Each module includes two processing racks and two slide assemblies that can translate the bases of the front end robot, central robot, and rear robot. FIG. 4 illustrates one embodiment of a process sequence that includes various process recipe steps that can be used with various embodiments of the cluster tool described herein. FIG. 4 illustrates another embodiment of a process sequence that includes various process recipe steps that can be used with various embodiments of the cluster tool described herein. FIG. 4 illustrates another embodiment of a process sequence that includes various process recipe steps that can be used with various embodiments of the cluster tool described herein. It is a side view illustrating one embodiment of the front end processing rack 52 according to the present invention. FIG. 6 is a side view illustrating an embodiment of a first processing rack 152 according to the present invention. FIG. 6 is a side view illustrating an embodiment of a second processing rack 154 according to the present invention. FIG. 6 is a side view illustrating one embodiment of a rear processing rack 202 according to the present invention. FIG. 3 is a side view illustrating an embodiment of a first rear processing rack 302 according to the present invention. FIG. 6 is a side view illustrating one embodiment of a second rear processing rack 304 according to the present invention. 2 is a side view illustrating an embodiment of a first processing rack 308 according to the present invention. FIG. FIG. 6 is a side view illustrating an embodiment of a second processing rack 309 according to the present invention. FIG. 6 is a side view illustrating an embodiment of a first central processing rack 312 and a first rear processing rack 318 according to the present invention. FIG. 6 is a side view illustrating an embodiment of a second central processing rack 314 and a second rear processing rack 319 according to the present invention. 2 is a side view illustrating an embodiment of a first processing rack 322 according to the present invention. FIG. FIG. 3 is a side view illustrating one embodiment of a coater chamber that enables advantageous use of the present invention. FIG. 3 is a side view illustrating one embodiment of a coater chamber that enables advantageous use of the present invention. FIG. 2 is a side view illustrating one embodiment of a coater / developer chamber that includes a showerhead assembly that enables advantageous use of the present invention. FIG. 4 is a side view illustrating one embodiment of a developer chamber that enables advantageous use of the present invention. 2 is an exploded isometric view of one embodiment of a fluid source assembly. FIG. 2 is an exploded isometric view of one embodiment of a fluid source assembly. FIG. FIG. 3 is a plan view of one embodiment of a coater chamber that includes a fluid distribution arm having one degree of freedom. FIG. 6 is a plan view of one embodiment of a coater chamber that includes a fluid distribution arm having two degrees of freedom. FIG. 6B is a side view of one embodiment of a developer chamber 60B that includes a developer endpoint detector assembly 1400. 8B is a processing method step used to improve the endpoint detection process described in connection with FIG. 8A. FIG. 6B is a side view of one embodiment of a developer chamber 60B that includes a developer endpoint detector assembly 1400. 2 is a plan view of a twin coater / developer chamber 350 according to the present invention. FIG. 2 is a plan view of a twin coater / developer chamber 350 according to the present invention. FIG. FIG. 2 is a side view illustrating one embodiment of a refrigeration chamber that enables advantageous use of the present invention. FIG. 3 is a side view illustrating one embodiment of a bake chamber that enables advantageous use of the present invention. FIG. 2 is a side view illustrating one embodiment of a HMDS processing chamber that enables advantageous use of the present invention. FIG. 2 is a side view illustrating one embodiment of a post-exposure bake (PEB) chamber that enables advantageous use of the present invention. 1 is a side view illustrating one embodiment of a plate assembly that can be used to rapidly heat and cool a substrate. FIG. 1 is a side view of a bake chamber, PEB chamber, HMDS processing chamber that includes one embodiment of a processing endpoint detection system. FIG. FIG. 4 is a side view of a bake chamber, PEB chamber, HMDS processing chamber that includes another embodiment of a processing endpoint detection system. 13 is a processing method step used to improve the endpoint detection process described in connection with FIGS. 12A-12B. 1 is a side view of a processing chamber illustrating one embodiment of a plate assembly with improved thermal coupling and reduced contact with the surface of a substrate. FIG. FIG. 13B is a plan view of the top of the plate assembly shown in FIG. 13A. FIG. 13B is a cross-sectional view of a seed crystal embedded in the surface of the plate assembly shown in FIG. 13A. FIG. 13B is a cross-sectional view of a seed crystal embedded in the surface of the plate assembly shown in FIG. 13A, with a layer selectively deposited on the surface of the seed crystal. FIG. 3B is a plan view of the processing system illustrated in FIG. 1B and illustrates a transfer path through which the substrate passes the cluster tool after the processing sequence illustrated in FIG. 3A is completed. 2F is a plan view of the processing system illustrated in FIG. 2F and illustrates a transfer path through which the substrate passes the cluster tool after the processing sequence illustrated in FIG. 3A is completed. 1 is an isometric view illustrating one embodiment of a cluster tool of the present invention that includes a frog-leg type robot. FIG. FIG. 15B is a plan view of the processing system according to the present invention illustrated in FIG. 15A. 1 is an isometric view illustrating one embodiment of a frog-leg type robot assembly according to the present invention. FIG. It is a top view of the frog leg robot assembly of the present invention. 1 is an isometric view illustrating one embodiment of a two-blade six-axis articulated robot assembly according to the present invention. FIG. FIG. 16B is an isometric view illustrating one embodiment of the two blade assembly shown in FIG. 16A. FIG. 16B is an isometric view illustrating one embodiment of the two blade assembly shown in FIG. 16A. FIG. 16B is an isometric view illustrating one embodiment of the two blade assembly shown in FIG. 16A that allows for variable pitch between robot blades. FIG. 6 illustrates a cross-sectional view of an over / under type two blade assembly with one blade extended to access a substrate provided in a cassette within the pod assembly. FIG. 2 is an isometric view illustrating one embodiment of a single blade, six axis articulated robot assembly that enables advantageous use of the present invention. FIG. 16D is an isometric view illustrating one embodiment of the single blade assembly shown in FIG. 16F. 2 is an isometric view illustrating one embodiment of a two-blade six-axis articulated robot assembly and slide assembly according to the present invention. FIG. FIG. 6 illustrates a cross-sectional view of a two-blade assembly with blades positioned to transfer a substrate from within a pair of cassettes. FIG. 3 is an isometric view of one embodiment of a bake chamber, a refrigeration chamber, and a robot adapted to transfer a substrate between chambers. FIG. 3 is an isometric view of one embodiment of a bake chamber, a refrigeration chamber, and a robot adapted to transfer a substrate between chambers. FIG. 17B is an isometric view showing the opposite side of the view shown in FIG. 17A illustrating a robot adapted to transfer a substrate between chambers. 2 is an isometric view of one embodiment of a bake / refrigerated chamber 800. FIG. FIG. 18B is an isometric view showing the opposite side shown in the view of FIG. 18A illustrating a robot adapted to transfer a substrate between chambers. FIG. 6 is a plan view illustrating another embodiment of a cluster tool and a stepper / scanner tool, wherein the stepper / scanner is separate from the cluster tool. The stepper / scanner has at least one PEB chamber integrated within the stepper / scanner. FIG. 19B illustrates one embodiment of a process sequence that includes various process recipe steps that can be used with the various embodiments of the cluster tool shown in FIG. 19A. FIG. 16B is a side view of the robot illustrated in FIG. 16A, which is used within a processing rack configuration configured to match its reachable range. FIG. 6 is an isometric view of another embodiment of a processing rack configuration that is adapted to match the reach of a robot having a central mounting point. FIG. 3 is an isometric view illustrating another embodiment of the cluster tool of the present invention. FIG. 21B is a plan view of the processing system illustrated in FIG. 21A in accordance with the present invention. FIG. 21B is a side view of the processing system illustrated in FIG. 21A in accordance with the present invention. FIG. 21B is a side view illustrating an embodiment of the first processing rack 460 of the cluster tool illustrated in FIG. 21A. FIG. 6 is a side view illustrating an embodiment of a second processing rack 480 according to the present invention. FIG. 4 illustrates one embodiment of a process sequence that includes various process recipe steps that can be used with various embodiments of the cluster tool described herein. 2 is an isometric view illustrating one embodiment of a robot that can be adapted to transfer substrates in various embodiments of a cluster tool. FIG. FIG. 21C is an isometric view illustrating one embodiment of the robot shown in FIG. 21G utilizing a single arm robot. In this figure, the enclosure component has been removed. FIG. 21B is an isometric view illustrating one embodiment of the horizontal motion assembly shown in FIGS. 21G and 21H. An isometric view of the processing chamber held in the processing rack is shown, and a substrate position error detection and correction system is mounted outside each opening provided in the processing chamber.

Explanation of symbols

5 ... Stepper / scanner, 10 ... Cluster tool, 50 ... Front end module, 52 ... Front end processing rack, 105 ... Pod assembly, 107 ... Central robot, 108 ... Front end robot, 109 ... Rear robot, 110 ... Shuttle robot, 150 ... Center Modules 152 ... first central processing rack 154 ... second central processing rack 200 ... rear module 202 ... rear processing rack

Claims (23)

  A cluster tool for processing substrates,
  A first group of processing chambers comprising M stacked processing chambers, where M is 3 or more;
  A first robot assembly having N robot arms, where N is less than M and 2 or more;
  A vertical motion assembly adapted to position N robot arms relative to a predetermined N of the M stacked processing chambers;
With
  N robot arms respectively place or remove substrates from the N processing chambers simultaneously;
Cluster tool. The first processing chamber group includes:
A first substrate processing chamber;
A second substrate processing chamber, the second substrate processing chamber positioned at a first vertical distance from the first substrate processing chamber;
Including
The cluster tool further includes a second processing chamber group that is horizontally separated from the first processing chamber group, and the second processing chamber group includes:
A third substrate processing chamber;
A fourth substrate processing chamber, the fourth substrate processing chamber positioned at a second vertical distance from the third substrate processing chamber;
With
The first robot assembly includes a first robot arm having a first substrate receiving surface and a second substrate receiving surface, and a second robot arm having a first substrate receiving surface and a second substrate receiving surface,
The first substrate receiving surface of the first robot arm is adapted to receive a substrate from the first substrate processing chamber, and the first substrate receiving surface of the second robot arm is substrate from the second substrate processing chamber. The cluster tool of claim 1, wherein the cluster tool is adapted to receive Each of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, and the fourth substrate processing chamber is aligned along a first direction substantially orthogonal to a vertical direction. Has one side,
The first substrate processing chamber and the third substrate processing chamber are positioned at a fixed distance from each other in the first direction, and the second substrate processing chamber and the fourth substrate processing chamber are in the first direction. The cluster tool of claim 2 , wherein the cluster tools are positioned at a fixed distance from each other. Said first robot assembly further comprises a adapted horizontal motion assembly so as to position the first direction substantially perpendicular to the vertical direction, the horizontal motion assembly, the first robot assembly, the first substrate Adapted to transport the first robot assembly in the first direction so that a second substrate can be placed in the third substrate processing chamber and substantially simultaneously in the fourth substrate processing chamber. The cluster tool according to claim 2 . Each of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, and the fourth substrate processing chamber has a first side aligned along the first direction;
The first robot assembly is disposed at a central position between the first substrate processing chamber and the third substrate processing chamber;
The horizontal motion assembly, during the substrate transfer process, the position of the first side near the first substrate processing chamber, to the position of the first side portion adjacent the third substrate processing chamber, said first robot assembly The cluster tool according to claim 4 , wherein the cluster tool is adapted to move the robot in the first direction by a distance. The cluster tool according to claim 4 , wherein a distance between the first substrate receiving surface of the first robot arm and the first substrate receiving surface of the second robot arm is adjustable using an actuator. The first robot assembly comprises:
A robot adapted to position the substrate at one or more points substantially contained within a horizontal plane;
A vertical motion assembly having a vertical actuator assembly adapted to position the robot in a direction substantially parallel to the vertical direction;
A horizontal motion assembly having a motor adapted to position the robot in a direction substantially parallel to the first direction;
The cluster tool according to claim 3 , comprising: The horizontal motion assembly of the first robot assembly comprises:
One or more walls forming an interior region surrounding the motor;
One or more fan assemblies in fluid communication with the interior region, wherein the fan assembly is adapted to depressurize the interior region below atmospheric pressure ;
The cluster tool according to claim 7 , further comprising: A filter,
The cluster tool of claim 8 , wherein depressurizing the interior region below atmospheric pressure includes moving air from the interior region through the filter. The first substrate processing chamber and the second substrate processing chamber are included in a first processing rack,
The third substrate processing chamber and the fourth substrate processing chamber are included in a second processing rack,
The first substrate receiving surface of the first robot arm receives the substrate from the first substrate processing chamber, and the first substrate receiving surface of the second robot arm receives the substrate from the second substrate processing chamber substantially simultaneously. The cluster tool according to claim 2 adapted. The cluster tool of claim 8 , wherein the horizontal motion assembly further comprises a slide assembly coupled to the robot, disposed within the interior region, and aligned substantially parallel to the first direction. The cluster tool of claim 8 , wherein the vertical motion assembly further comprises two lift rail assemblies aligned parallel to the vertical direction and coupled to the horizontal motion assembly.   The first substrate processing chamber and the third substrate processing chamber are positioned at a fixed distance from each other in the horizontal direction;
  The second substrate processing chamber and the fourth substrate processing chamber are positioned at a fixed distance from each other in the horizontal direction;
  The first robot arm of the first robot assembly removes a first substrate from the first substrate processing chamber;
  The second robot arm of the first robot assembly simultaneously receives a second substrate from the second substrate processing chamber;
after that,
  The first robot arm of the first robot assembly places the first substrate into the third substrate processing chamber;
  The second robot arm of the first robot assembly simultaneously places the second substrate in the fourth substrate processing chamber;
  The cluster tool further comprises a second robot assembly having a first robot arm and a second robot arm,
  The first robot arm of the second robot assembly removes a third substrate from the first substrate processing chamber;
  The second robot arm of the second robot assembly simultaneously receives a fourth substrate from the second substrate processing chamber;
after that,
  The first robot arm of the second robot assembly moves the third substrate into the third substrate processing chamber;
  The second robot arm of the second robot assembly places the fourth substrate in the fourth substrate processing chamber simultaneously.
The cluster tool according to claim 2, adapted to: Further comprising a global positioning system including at least one transmitter and at least one receiver, wherein one of said at least one transmitter, at least one receiver, the first robot arm in the cluster tool The cluster tool according to claim 2 , wherein the cluster tool is connected to the first substrate receiving surface of the first robot arm so that a system controller can monitor the position of the first robot arm. The first substrate processing chamber, positioning the second substrate processing chamber and a distance away from Oite the first substrate processing chamber and the second substrate processing chamber in a first direction substantially perpendicular to the vertical direction is, a first group of two or more substrate processing chambers and stacked vertically, a first processing rack and a first substrate processing chamber, and the second substrate processing chamber, said A first group of two or more substrate processing chambers stacked vertically, the first processing rack having a first side and a second side, respectively;
Said third substrate processing chamber, said fourth substrate processing chamber, positioned away a distance from the Oite the first direction third substrate processing chamber and the fourth substrate processing chamber, vertically stacked A second group of two or more substrate processing chambers, the second processing rack including the third substrate processing chamber, the fourth substrate processing chamber, and the two stacked vertically. The second group of substrate processing chambers described above includes the second processing rack having a first side and a second side, respectively.
The first group consisting of the first substrate processing chamber, the second substrate processing chamber, and the two or more vertically stacked substrate processing chambers is adapted to access from the first side. One robot assembly;
A first group of the first substrate processing chamber, the second substrate processing chamber, and the two or more vertically stacked substrate processing chambers is accessed from the second side and the third substrate processing chamber A second robot assembly adapted to access from the first side a second group of the fourth substrate processing chamber and the two or more vertically stacked substrate processing chambers;
A third group adapted to access from the second side a second group of the third substrate processing chamber, the fourth substrate processing chamber, and the two or more vertically stacked substrate processing chambers. A robot assembly;
The cluster tool according to claim 2 , further comprising: Using said first robot assembly and the second robot assembly, a controller adapted to control the operation of the substrate passing through the pre Kimoto plate processing chamber,
A memory coupled to the controller, the memory comprising a computer readable medium having a computer readable program embodied therein for directing operation of the cluster tool;
Further comprising
The computer readable program is
Computer instructions for controlling operations of the first robot assembly and the second robot assembly, the computer instructions comprising:
(I) storing in the memory one or more command tasks for the first robot assembly and the second robot assembly;
(Ii) reviewing a command task for the first robot assembly held in the memory;
(Iii) reviewing a command task for the second robot assembly held in the memory;
(Iv) command tasks from the first robot assembly to the second robot assembly or to the second robot assembly in order to balance the availability of each of the first robot assembly and the second robot assembly; Moving to the first robot assembly;
The cluster tool according to claim 2 , comprising: A method for transferring a substrate within a cluster tool, comprising:
Using the first robot, N substrates , where N is 2 or more, in each of the N chambers of the L substrate processing chambers stacked vertically in the first processing rack. Step to insert into,
Using a second robot comprising N movable arm having at least one substrate support surface, from the N chamber of said vertically stacked and the L number of substrate processing chambers in the first processing rack a step of substantially simultaneously taking out a substrate,
Using said second robot, transferring the substrate, N-number of chambers of the M substrate processing chamber that is vertically stacked in the second processing rack, where M is larger than N, substantially simultaneously to a method comprising the steps, which use the horizontal motion assembly, comprising the step of moving a distance the second robot in the horizontal direction, pre Symbol transported simultaneously to,
Using the second robot to place the substrates in N chambers of the M vertically stacked substrate processing chambers in the second processing rack substantially simultaneously;
A method comprising: A step using a third robot, which almost simultaneously extracting the substrate from at least two of the two or more substrate processing chambers said vertically and stacked in the second processing rack,
Using the third robot to insert the substrate into at least two of the two or more vertically stacked substrate processing chambers in a third processing rack;
The method of claim 17 , further comprising: Using a second robot, the substrate, the step of taking out substantially simultaneously from at least two of the two or more substrate processing chambers said vertically and stacked in the first rack,
Using a first actuator to extend a first arm of the at least one movable arm relative to a support;
Extending a second arm of the at least one movable arm relative to the support using a second actuator;
By positioning the support portion connected to the second robot, the first substrate positioned in the first substrate processing chamber is positioned on the first arm, and the first substrate positioned in the second substrate processing chamber is positioned. Positioning two substrates on the second arm;
Retracting the first arm and the second arm;
The method of claim 17 , comprising: A method for transferring a substrate within a cluster tool, comprising:
The first and second sides aligned in the first direction to chromatic respectively, N pieces of board processing chamber included in the first array of L pieces of a substrate processing chamber that is stacked in the vertical direction Wherein N is greater than or equal to 2 and L is greater than N using the first robot assembly to transfer the substrate, wherein the first robot assembly is simultaneously substantially orthogonal to the vertical direction. a step of the said substrate is positioned in a first direction, for feeding the first through the side is adapted to position the substrate on the N substrate processing chamber, before KiUtsuri you,
Wherein for chromatic respectively first and second sides aligned in the first direction, N pieces of board processes included in the second array of M substrate processing chamber that is stacked in the vertical direction Simultaneously transferring a substrate to a chamber , where M is greater than N, using a second robot assembly, wherein the second robot assembly positions the substrate in the first direction; a step of feeding the second through the side is adapted to position the substrate on the N substrate processing chamber, before KiUtsuri,
M substrate processes stacked in the vertical direction through the second side through N substrate processing chambers included in a first array of L substrate processing chambers stacked in the vertical direction. Transferring the substrate through the first side and using a third robot assembly to N substrate processing chambers included in a second array of chambers, the third robot assembly comprising: at the same time, the is adapted to position the substrate in the first direction, the steps of feeding pre KiUtsuri,
With
The first and second sides of the first array of L substrate processing chambers stacked in the vertical direction and the second array of M substrate processing chambers stacked in the vertical direction, respectively. A portion is on opposite sides of each of the substrate processing chambers. Further comprising simultaneously transferring two or more substrates using the first robot assembly, the second robot assembly, or the third robot assembly, each comprising a robot having a first arm and a second arm;
Before Symbol step of transferring at the same time is,
In relation to the supporting portion in which the first pre-SL robot within a substrate processing chamber that is included in one of the vertically two or more substrate processing chambers and stacked it is placed in the first array or the second array Extending the first arm;
The said second arm in relation to the prior SL support portion to the second substrate processing chamber that is included in one of the vertically two or more substrate processing chambers and stacked in the first array or the second array Extending the process;
By positioning the robot, the first substrate positioned in the first substrate processing chamber is positioned on the first arm, and the second substrate positioned in the second substrate processing chamber is positioned in the second substrate. Positioning on the arm;
Retracting the first arm and the second arm;
Repositioning the first arm proximate to a third substrate processing chamber and the second arm proximate to a fourth substrate processing chamber, wherein the third substrate processing chamber and the fourth substrate processing chamber Repositioning both of which are included in the first array or the second array;
21. The method of claim 20 , comprising: Step process of repositioning the second robot assembly, to position the step of positioning the second robot assembly in a vertical direction using the vertical motion assembly, the robot assembly in a horizontal direction using the horizontal motion assembly And including
Using a fan to evacuate the interior of the enclosure in the horizontal motion assembly or the vertical motion assembly and depressurize the interior, wherein an actuator adapted to position the robot assembly includes The method of claim 21 , further comprising depressurizing the interior disposed within a region. Based on the processing sequence Yoo over THE defines, creating a first list of one or more command tasks for the first robot,
Creating a second list of one or more command tasks for a second robot based on a processing sequence defined by the user;
Storing one or more command tasks for the first robot and the second robot in a memory of a controller;
Reviewing the first list and the second list to calculate a work load imbalance between the first robot and the second robot;
Moving at least one of the one or more command tasks from the first list to the second list to balance the workload;
20. The method according to any one of claims 17 to 19, comprising :

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