JP4988908B2 - ランド・グリッド・アレイ・コネクタのためのキャリア - Google Patents
ランド・グリッド・アレイ・コネクタのためのキャリア Download PDFInfo
- Publication number
- JP4988908B2 JP4988908B2 JP2010198099A JP2010198099A JP4988908B2 JP 4988908 B2 JP4988908 B2 JP 4988908B2 JP 2010198099 A JP2010198099 A JP 2010198099A JP 2010198099 A JP2010198099 A JP 2010198099A JP 4988908 B2 JP4988908 B2 JP 4988908B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier member
- carrier
- connector
- member according
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Leads Or Probes (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
また、本出願は、1999年12月9日に出願された同時係属米国特許出願第09/457,776号、および、原出願と同時に出願された同時係属米国特許出願第xx/xxx,xxx号[HCD−107]に関し、双方とも、参照として本明細書に組み込まれている。
Claims (12)
- ランド・グリッド・アレイ用コネクタのためのキャリア部材であって、
上部、下部、前記上部と下部の間に位置する保持層、および、少なくとも1つの縁部からなり、
複数の開口部を有し、それぞれが、少なくとも1つの接触部材を受け入れるように位置し、
前記少なくとも1つの接触部材の少なくとも一部を押圧し保持するために、前記保持層の少なくとも一部が前記開口部の少なくとも1つの内に伸長し、
前記上部および下部が、エポキシ・ガラスをベースとし、FR4を含む絶縁性材料からなることを特徴とするキャリア部材 - 前記保持層が、絶縁性材料からなる、請求項1に記載のキャリア部材。
- キャリア部材が、複数のスペーサをさらに含む、請求項1に記載のキャリア部材。
- 前記複数のスペーサが、前記上部の上方に位置する、請求項3に記載のキャリア部材。
- 前記複数のスペーサが、前記下部の下方に位置する、請求項3に記載のキャリア部材。
- 前記スペーサが、絶縁性材料からなる、請求項3に記載のキャリア部材。
- 前記絶縁性材料が、エポキシ・ガラスをベースとする、請求項6に記載のキャリア部材。
- 前記絶縁性材料が、FR4を含む、請求項7に記載のキャリア部材。
- 前記開口部が、実質的に円筒形である、請求項1に記載のキャリア部材。
- キャリア部材が、位置合わせ手段をさらに含む、請求項1に記載のキャリア部材。
- キャリア部材の前記上部、下部、および、保持層が、一体で形成される、請求項1に記載のキャリア部材。
- キャリア部材が、成型、鋳造、切削、プレス加工、および、エッチングからなるグループから選択された工程によって、一体で形成される、請求項11に記載のキャリア部材。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/645,860 | 2000-08-24 | ||
US09/645,860 US6312266B1 (en) | 2000-08-24 | 2000-08-24 | Carrier for land grid array connectors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002521361A Division JP4703942B2 (ja) | 2000-08-24 | 2001-08-14 | ランド・グリッド・アレイ・コネクタのためのキャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011018654A JP2011018654A (ja) | 2011-01-27 |
JP4988908B2 true JP4988908B2 (ja) | 2012-08-01 |
Family
ID=24590776
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002521361A Expired - Lifetime JP4703942B2 (ja) | 2000-08-24 | 2001-08-14 | ランド・グリッド・アレイ・コネクタのためのキャリア |
JP2010198099A Expired - Lifetime JP4988908B2 (ja) | 2000-08-24 | 2010-09-03 | ランド・グリッド・アレイ・コネクタのためのキャリア |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002521361A Expired - Lifetime JP4703942B2 (ja) | 2000-08-24 | 2001-08-14 | ランド・グリッド・アレイ・コネクタのためのキャリア |
Country Status (6)
Country | Link |
---|---|
US (2) | US6312266B1 (ja) |
JP (2) | JP4703942B2 (ja) |
KR (1) | KR20020038761A (ja) |
CN (1) | CN1234166C (ja) |
TW (1) | TW506166B (ja) |
WO (1) | WO2002017393A1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830460B1 (en) * | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
US6939143B2 (en) * | 2000-01-20 | 2005-09-06 | Gryphics, Inc. | Flexible compliant interconnect assembly |
US6957963B2 (en) * | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
US6360431B1 (en) * | 2000-09-29 | 2002-03-26 | Intel Corporation | Processor power delivery system |
US20020093351A1 (en) * | 2001-01-18 | 2002-07-18 | Holcombe Brent A. | Method for constructing a flex-rigid laminate probe |
JP2004538602A (ja) * | 2001-01-31 | 2004-12-24 | ハイ コネクション デンシテイ インコーポレイテッド | ランド・グリッド・アレイ・コネクタ用の取外し可能締め付け手段 |
US6663399B2 (en) | 2001-01-31 | 2003-12-16 | High Connection Density, Inc. | Surface mount attachable land grid array connector and method of forming same |
US6638077B1 (en) * | 2001-02-26 | 2003-10-28 | High Connection Density, Inc. | Shielded carrier with components for land grid array connectors |
US6712621B2 (en) * | 2002-01-23 | 2004-03-30 | High Connection Density, Inc. | Thermally enhanced interposer and method |
US6551112B1 (en) | 2002-03-18 | 2003-04-22 | High Connection Density, Inc. | Test and burn-in connector |
US6853209B1 (en) * | 2002-07-16 | 2005-02-08 | Aehr Test Systems | Contactor assembly for testing electrical circuits |
TW547771U (en) * | 2002-07-23 | 2003-08-11 | Via Tech Inc | Elastic electrical contact package structure |
ATE447248T1 (de) * | 2002-10-24 | 2009-11-15 | Ibm | Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter |
US6796810B2 (en) * | 2002-12-10 | 2004-09-28 | Tyco Electronics Corporation | Conductive elastomeric contact system |
US6972958B2 (en) * | 2003-03-10 | 2005-12-06 | Hewlett-Packard Development Company, L.P. | Multiple integrated circuit package module |
US7040902B2 (en) * | 2003-03-24 | 2006-05-09 | Che-Yu Li & Company, Llc | Electrical contact |
US6897562B2 (en) * | 2003-04-11 | 2005-05-24 | Motorola Corporation | Electronic component and method of manufacturing same |
US7128592B2 (en) * | 2004-07-09 | 2006-10-31 | Che Yu Li & Company, Llc | Interconnection device and system |
US7442049B2 (en) * | 2005-02-09 | 2008-10-28 | International Business Machines Corporation | Electrical connecting device and method of forming same |
DE102005033915A1 (de) * | 2005-07-20 | 2007-02-01 | Tyco Electronics Amp Gmbh | Koaxialer Verbinder |
JP2007165149A (ja) | 2005-12-14 | 2007-06-28 | Fujitsu Ltd | Lgaコネクタ、パッケージ実装構造 |
US7473102B2 (en) * | 2006-03-31 | 2009-01-06 | International Business Machines Corporation | Space transforming land grid array interposers |
US7629541B2 (en) * | 2006-06-19 | 2009-12-08 | Endicott Interconnect Technologies, Inc. | High speed interposer |
CN102858088A (zh) * | 2011-06-28 | 2013-01-02 | 鸿富锦精密工业(深圳)有限公司 | 电路板及其制作方法及采用该电路板的电子产品 |
US8664768B2 (en) * | 2012-05-03 | 2014-03-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interposer having a defined through via pattern |
US8878072B2 (en) * | 2012-06-19 | 2014-11-04 | Lockheed Martin Corporation | High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment |
US9258907B2 (en) | 2012-08-09 | 2016-02-09 | Lockheed Martin Corporation | Conformal 3D non-planar multi-layer circuitry |
US8772745B1 (en) | 2013-03-14 | 2014-07-08 | Lockheed Martin Corporation | X-ray obscuration film and related techniques |
US10123410B2 (en) | 2014-10-10 | 2018-11-06 | Lockheed Martin Corporation | Fine line 3D non-planar conforming circuit |
CN207135349U (zh) | 2017-09-13 | 2018-03-23 | 上海莫仕连接器有限公司 | 导电模组 |
CN108258467B (zh) * | 2017-12-01 | 2020-08-28 | 番禺得意精密电子工业有限公司 | 电连接器 |
CN112186380A (zh) * | 2020-10-15 | 2021-01-05 | 浪潮商用机器有限公司 | 一种服务器主板及其lga连接器安装防护结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3073550B2 (ja) * | 1991-06-27 | 2000-08-07 | 株式会社東芝 | 半導体装置 |
JPH05152019A (ja) * | 1991-11-28 | 1993-06-18 | Nitto Denko Corp | 異方導電コネクター |
JPH05258790A (ja) * | 1992-03-13 | 1993-10-08 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造 |
JP2602623B2 (ja) * | 1993-12-17 | 1997-04-23 | 山一電機株式会社 | Icソケット |
JPH1010191A (ja) * | 1996-06-20 | 1998-01-16 | Hitachi Ltd | コネクタおよびそれを用いる半導体検査方法ならびに装置 |
US5815426A (en) * | 1996-08-13 | 1998-09-29 | Nexcom Technology, Inc. | Adapter for interfacing an insertable/removable digital memory apparatus to a host data part |
JPH1064341A (ja) * | 1996-08-19 | 1998-03-06 | Toppan Printing Co Ltd | 異方導電性フィルム及びその製造方法 |
JPH11204178A (ja) * | 1998-01-07 | 1999-07-30 | Jsr Corp | 異方導電性シート |
JPH11204177A (ja) * | 1998-01-07 | 1999-07-30 | Jsr Corp | シート状コネクター |
US6114757A (en) * | 1999-09-27 | 2000-09-05 | Thomas & Betts International, Inc. | Leadless IC socket |
-
2000
- 2000-08-24 US US09/645,860 patent/US6312266B1/en not_active Expired - Lifetime
-
2001
- 2001-05-07 US US09/851,212 patent/US6370770B1/en not_active Expired - Lifetime
- 2001-08-14 KR KR1020027003640A patent/KR20020038761A/ko not_active Application Discontinuation
- 2001-08-14 JP JP2002521361A patent/JP4703942B2/ja not_active Expired - Lifetime
- 2001-08-14 WO PCT/US2001/025407 patent/WO2002017393A1/en active Application Filing
- 2001-08-14 CN CN01802042.9A patent/CN1234166C/zh not_active Expired - Lifetime
- 2001-09-28 TW TW090124026A patent/TW506166B/zh not_active IP Right Cessation
-
2010
- 2010-09-03 JP JP2010198099A patent/JP4988908B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2011018654A (ja) | 2011-01-27 |
JP4703942B2 (ja) | 2011-06-15 |
JP2004507058A (ja) | 2004-03-04 |
US6370770B1 (en) | 2002-04-16 |
CN1234166C (zh) | 2005-12-28 |
CN1386302A (zh) | 2002-12-18 |
TW506166B (en) | 2002-10-11 |
WO2002017393A1 (en) | 2002-02-28 |
KR20020038761A (ko) | 2002-05-23 |
US6312266B1 (en) | 2001-11-06 |
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