JP4986545B2 - 水晶振動子 - Google Patents

水晶振動子 Download PDF

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Publication number
JP4986545B2
JP4986545B2 JP2006237061A JP2006237061A JP4986545B2 JP 4986545 B2 JP4986545 B2 JP 4986545B2 JP 2006237061 A JP2006237061 A JP 2006237061A JP 2006237061 A JP2006237061 A JP 2006237061A JP 4986545 B2 JP4986545 B2 JP 4986545B2
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JP
Japan
Prior art keywords
lid
metal film
crystal resonator
metal
base material
Prior art date
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Expired - Fee Related
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JP2006237061A
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English (en)
Japanese (ja)
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JP2008061048A (ja
JP2008061048A5 (https=
Inventor
宏和 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Priority to JP2006237061A priority Critical patent/JP4986545B2/ja
Publication of JP2008061048A publication Critical patent/JP2008061048A/ja
Publication of JP2008061048A5 publication Critical patent/JP2008061048A5/ja
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Publication of JP4986545B2 publication Critical patent/JP4986545B2/ja
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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2006237061A 2006-08-31 2006-08-31 水晶振動子 Expired - Fee Related JP4986545B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006237061A JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006237061A JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

Publications (3)

Publication Number Publication Date
JP2008061048A JP2008061048A (ja) 2008-03-13
JP2008061048A5 JP2008061048A5 (https=) 2009-10-15
JP4986545B2 true JP4986545B2 (ja) 2012-07-25

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ID=39243275

Family Applications (1)

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JP2006237061A Expired - Fee Related JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

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JP (1) JP4986545B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102362430B (zh) * 2009-04-03 2016-08-17 株式会社大真空 封装构件组件及其制造方法、封装构件以及使用了封装构件的压电振动器件的制造方法
JP5554092B2 (ja) * 2010-03-05 2014-07-23 セイコーインスツル株式会社 電子デバイスパッケージの製造方法
JPWO2015151514A1 (ja) * 2014-03-31 2017-04-13 ナガセケムテックス株式会社 中空部を有する回路部材および実装構造体、ならびに実装構造体の製造方法
CN108735890A (zh) * 2018-05-25 2018-11-02 张琴 准气密性声表面波元件封装结构及制作方法
WO2021117272A1 (ja) * 2019-12-09 2021-06-17 株式会社村田製作所 共振装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472474B2 (ja) * 1998-03-30 2003-12-02 京セラ株式会社 薄型圧電共振子及びその実装構造
JP2006080380A (ja) * 2004-09-10 2006-03-23 Seiko Epson Corp 電子部品用パッケージの封止方法

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Publication number Publication date
JP2008061048A (ja) 2008-03-13

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