JP4986529B2 - 水晶発振器 - Google Patents

水晶発振器 Download PDF

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Publication number
JP4986529B2
JP4986529B2 JP2006207965A JP2006207965A JP4986529B2 JP 4986529 B2 JP4986529 B2 JP 4986529B2 JP 2006207965 A JP2006207965 A JP 2006207965A JP 2006207965 A JP2006207965 A JP 2006207965A JP 4986529 B2 JP4986529 B2 JP 4986529B2
Authority
JP
Japan
Prior art keywords
space
connection electrode
substrate
integrated circuit
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006207965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008035345A (ja
JP2008035345A5 (enExample
Inventor
宗高 副島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP2006207965A priority Critical patent/JP4986529B2/ja
Publication of JP2008035345A publication Critical patent/JP2008035345A/ja
Publication of JP2008035345A5 publication Critical patent/JP2008035345A5/ja
Application granted granted Critical
Publication of JP4986529B2 publication Critical patent/JP4986529B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
JP2006207965A 2006-07-31 2006-07-31 水晶発振器 Expired - Fee Related JP4986529B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006207965A JP4986529B2 (ja) 2006-07-31 2006-07-31 水晶発振器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006207965A JP4986529B2 (ja) 2006-07-31 2006-07-31 水晶発振器

Publications (3)

Publication Number Publication Date
JP2008035345A JP2008035345A (ja) 2008-02-14
JP2008035345A5 JP2008035345A5 (enExample) 2009-09-03
JP4986529B2 true JP4986529B2 (ja) 2012-07-25

Family

ID=39124279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006207965A Expired - Fee Related JP4986529B2 (ja) 2006-07-31 2006-07-31 水晶発振器

Country Status (1)

Country Link
JP (1) JP4986529B2 (enExample)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2974622B2 (ja) * 1996-09-20 1999-11-10 松下電器産業株式会社 発振器
JP3423255B2 (ja) * 1999-06-04 2003-07-07 日本電波工業株式会社 表面実装水晶発振器
JP2005065104A (ja) * 2003-08-19 2005-03-10 Murata Mfg Co Ltd 表面実装型圧電振動子およびその製造方法
JP4284142B2 (ja) * 2003-09-26 2009-06-24 京セラ株式会社 圧電発振器
JP4284143B2 (ja) * 2003-09-26 2009-06-24 京セラ株式会社 圧電発振器
JP4578231B2 (ja) * 2004-11-25 2010-11-10 京セラ株式会社 圧電発振器及びその製造方法

Also Published As

Publication number Publication date
JP2008035345A (ja) 2008-02-14

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