JP4975581B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP4975581B2
JP4975581B2 JP2007265615A JP2007265615A JP4975581B2 JP 4975581 B2 JP4975581 B2 JP 4975581B2 JP 2007265615 A JP2007265615 A JP 2007265615A JP 2007265615 A JP2007265615 A JP 2007265615A JP 4975581 B2 JP4975581 B2 JP 4975581B2
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Japan
Prior art keywords
solder resist
resist layer
wiring pattern
layer
external connection
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Expired - Fee Related
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JP2007265615A
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Japanese (ja)
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JP2009094403A (ja
JP2009094403A5 (enExample
Inventor
和弘 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2007265615A priority Critical patent/JP4975581B2/ja
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Publication of JP2009094403A5 publication Critical patent/JP2009094403A5/ja
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Publication of JP4975581B2 publication Critical patent/JP4975581B2/ja
Expired - Fee Related legal-status Critical Current
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2007265615A 2007-10-11 2007-10-11 配線基板及びその製造方法 Expired - Fee Related JP4975581B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007265615A JP4975581B2 (ja) 2007-10-11 2007-10-11 配線基板及びその製造方法

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JP2007265615A JP4975581B2 (ja) 2007-10-11 2007-10-11 配線基板及びその製造方法

Publications (3)

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JP2009094403A JP2009094403A (ja) 2009-04-30
JP2009094403A5 JP2009094403A5 (enExample) 2010-10-21
JP4975581B2 true JP4975581B2 (ja) 2012-07-11

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JP2007265615A Expired - Fee Related JP4975581B2 (ja) 2007-10-11 2007-10-11 配線基板及びその製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5606268B2 (ja) 2010-10-27 2014-10-15 日本特殊陶業株式会社 多層配線基板の製造方法
JP6291738B2 (ja) 2013-07-25 2018-03-14 富士通株式会社 回路基板、回路基板の製造方法及び電子機器
JP6554303B2 (ja) * 2014-03-31 2019-07-31 ナミックス株式会社 多層配線基板の製造方法
JP6594264B2 (ja) * 2016-06-07 2019-10-23 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4691763B2 (ja) * 2000-08-25 2011-06-01 イビデン株式会社 プリント配線板の製造方法
JP2003046250A (ja) * 2001-02-28 2003-02-14 Furukawa Electric Co Ltd:The ビア付きビルドアップ用多層基板及びその製造方法
JP4619223B2 (ja) * 2004-12-16 2011-01-26 新光電気工業株式会社 半導体パッケージ及びその製造方法
JP4538373B2 (ja) * 2005-05-23 2010-09-08 日本特殊陶業株式会社 コアレス配線基板の製造方法、及びそのコアレス配線基板を有する電子装置の製造方法
JP2007173371A (ja) * 2005-12-20 2007-07-05 Shinko Electric Ind Co Ltd フレキシブル配線基板の製造方法及び電子部品実装構造体の製造方法

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Publication number Publication date
JP2009094403A (ja) 2009-04-30

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