JP4969449B2 - 二つのプレートから構成される流体容器 - Google Patents
二つのプレートから構成される流体容器 Download PDFInfo
- Publication number
- JP4969449B2 JP4969449B2 JP2007538553A JP2007538553A JP4969449B2 JP 4969449 B2 JP4969449 B2 JP 4969449B2 JP 2007538553 A JP2007538553 A JP 2007538553A JP 2007538553 A JP2007538553 A JP 2007538553A JP 4969449 B2 JP4969449 B2 JP 4969449B2
- Authority
- JP
- Japan
- Prior art keywords
- ridge
- plate
- cover plate
- structured
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/04—Closures and closing means
- B01L2300/041—Connecting closures to device or container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0803—Disc shape
- B01L2300/0806—Standardised forms, e.g. compact disc [CD] format
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4825—Pressure sensitive adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/484—Moisture curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/526—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by printing or by transfer from the surfaces of elements carrying the adhesive, e.g. using brushes, pads, rollers, stencils or silk screens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/548—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by capillarity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
- B29C66/7465—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Micromachines (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04105340.6 | 2004-10-27 | ||
| EP04105340 | 2004-10-27 | ||
| PCT/IB2005/053361 WO2006046164A1 (en) | 2004-10-27 | 2005-10-13 | Fluid container composed of two plates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008518225A JP2008518225A (ja) | 2008-05-29 |
| JP2008518225A5 JP2008518225A5 (https=) | 2011-09-22 |
| JP4969449B2 true JP4969449B2 (ja) | 2012-07-04 |
Family
ID=35501130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538553A Expired - Fee Related JP4969449B2 (ja) | 2004-10-27 | 2005-10-13 | 二つのプレートから構成される流体容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8916111B2 (https=) |
| EP (1) | EP1807341A1 (https=) |
| JP (1) | JP4969449B2 (https=) |
| CN (1) | CN101048338B (https=) |
| WO (1) | WO2006046164A1 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100254858A1 (en) * | 2007-11-14 | 2010-10-07 | Prawin Paulraj | Microchannel structures having bonded layers including height control features |
| HUE043133T2 (hu) | 2007-11-21 | 2019-07-29 | Smith & Nephew | Sebkötözés |
| GB0723855D0 (en) | 2007-12-06 | 2008-01-16 | Smith & Nephew | Apparatus and method for wound volume measurement |
| CN101952731A (zh) * | 2008-02-15 | 2011-01-19 | 柯尼卡美能达精密光学株式会社 | 微芯片及其制造方法 |
| KR100919400B1 (ko) * | 2008-04-07 | 2009-09-29 | 삼성전자주식회사 | 미세유동장치 및 그 제조방법 |
| DE102009024048B3 (de) * | 2009-05-08 | 2010-08-19 | Institut für Bioprozess- und Analysenmesstechnik e.V. | Montier- und demontierbares Mikrofluidiksystem und Verfahren zur Flutung des Systems |
| DE102010002915B4 (de) * | 2010-03-16 | 2012-10-18 | Senslab-Gesellschaft Zur Entwicklung Und Herstellung Bioelektrochemischer Sensoren Mbh | Mikrofluidischer Sensor |
| GB201015656D0 (en) | 2010-09-20 | 2010-10-27 | Smith & Nephew | Pressure control apparatus |
| US9067003B2 (en) | 2011-05-26 | 2015-06-30 | Kalypto Medical, Inc. | Method for providing negative pressure to a negative pressure wound therapy bandage |
| US9084845B2 (en) | 2011-11-02 | 2015-07-21 | Smith & Nephew Plc | Reduced pressure therapy apparatuses and methods of using same |
| CN107260398B (zh) | 2012-03-12 | 2021-03-16 | 史密夫及内修公开有限公司 | 用于减压伤口治疗的伤口敷料装置 |
| CN104507513B (zh) | 2012-03-20 | 2017-04-12 | 史密夫及内修公开有限公司 | 基于动态占空比阈值确定的减压治疗系统的控制操作 |
| US9427505B2 (en) | 2012-05-15 | 2016-08-30 | Smith & Nephew Plc | Negative pressure wound therapy apparatus |
| DK2969479T3 (da) | 2013-03-13 | 2021-08-02 | Illumina Inc | Væskeanordninger i flere lag og fremgangsmåder til deres fremstilling |
| US8846416B1 (en) * | 2013-03-13 | 2014-09-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming biochips and biochips with non-organic landings for improved thermal budget |
| KR101585329B1 (ko) * | 2014-06-03 | 2016-01-15 | 주식회사 나노엔텍 | 플라스틱 마이크로칩 |
| JP2016017890A (ja) * | 2014-07-09 | 2016-02-01 | キヤノン株式会社 | 流体デバイス及び流体デバイスの製造方法 |
| KR102279239B1 (ko) * | 2014-07-25 | 2021-07-19 | 삼성전자주식회사 | 임프린트 공정을 이용한 역상 패턴 전사방법 |
| SG11201704255WA (en) | 2014-12-22 | 2017-07-28 | Smith & Nephew | Negative pressure wound therapy apparatus and methods |
| WO2016207075A1 (en) | 2015-06-26 | 2016-12-29 | Novo Nordisk A/S | Method of forming an adhesive bond between first and second components of a device and a device formed by the method |
| NL1041407B1 (en) | 2015-07-24 | 2017-02-07 | Qmicro B V | Microfluidic device. |
| US20180156426A1 (en) * | 2016-12-07 | 2018-06-07 | GE Lighting Solutions, LLC | Led module bonding |
| JP6939415B2 (ja) * | 2017-10-27 | 2021-09-22 | ウシオ電機株式会社 | マイクロチップ |
| KR101976082B1 (ko) * | 2018-01-25 | 2019-05-07 | (주)인텍바이오 | 진단 칩의 제작 방법 |
| CN109334028A (zh) * | 2018-11-28 | 2019-02-15 | 常州工程职业技术学院 | 一种微流控芯片贴片结构及贴片工艺 |
| WO2021061966A1 (en) * | 2019-09-25 | 2021-04-01 | The Charles Stark Draper Laboratory Inc. | Systems and methods for manufacturing closed microfluidic devices |
| KR102591840B1 (ko) * | 2020-12-30 | 2023-10-27 | 한양대학교 산학협력단 | 면역분석실험 자동화 장치 |
| EP4129479A1 (en) * | 2021-08-06 | 2023-02-08 | Microliquid SL | Self-filling structure for sealing microfluidic architectures, microfluidic device, method and associated uses thereof |
| CN117902051B (zh) * | 2024-02-06 | 2024-08-30 | 南京航空航天大学 | 采用埋入式微通道阵列的进气道及其设计方法 |
| CN120268471A (zh) * | 2025-05-21 | 2025-07-08 | 中山市佳创生物科技有限公司 | 一种微流控芯片的封装方法和微流控芯片 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU642444B2 (en) | 1989-11-30 | 1993-10-21 | Mochida Pharmaceutical Co., Ltd. | Reaction vessel |
| JPH03223674A (ja) * | 1989-11-30 | 1991-10-02 | Mochida Pharmaceut Co Ltd | 反応容器 |
| US5458852A (en) * | 1992-05-21 | 1995-10-17 | Biosite Diagnostics, Inc. | Diagnostic devices for the controlled movement of reagents without membranes |
| US6905882B2 (en) | 1992-05-21 | 2005-06-14 | Biosite, Inc. | Diagnostic devices and apparatus for the controlled movement of reagents without membranes |
| JP3376495B2 (ja) * | 1992-08-18 | 2003-02-10 | ソニー株式会社 | 接着剤の塗布方法及び接着治具 |
| DE19524795C2 (de) | 1995-07-07 | 1997-06-12 | Danfoss As | Chemische Analysevorrichtung |
| JPH09205126A (ja) * | 1996-01-25 | 1997-08-05 | Fujikura Ltd | ワークとベースの接着方法 |
| US5932315A (en) * | 1997-04-30 | 1999-08-03 | Hewlett-Packard Company | Microfluidic structure assembly with mating microfeatures |
| US6878540B2 (en) * | 1999-06-25 | 2005-04-12 | Cepheid | Device for lysing cells, spores, or microorganisms |
| JP4503897B2 (ja) * | 1999-07-07 | 2010-07-14 | スリーエム イノベイティブ プロパティズ カンパニー | 流体制御フィルムを有する検出物品 |
| SE0000300D0 (sv) | 2000-01-30 | 2000-01-30 | Amersham Pharm Biotech Ab | Microfluidic assembly, covering method for the manufacture of the assembly and the use of the assembly |
| DE10201640A1 (de) | 2002-01-17 | 2003-08-07 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer Folie mit Oberflächenstrukturen im Mikro- und Nanometerbereich sowie eine diesbezügliche Folie |
| EP1467945A2 (en) | 2002-01-18 | 2004-10-20 | Avery Dennison Corporation | Covered microchamber structures |
| JP3842681B2 (ja) * | 2002-03-25 | 2006-11-08 | 株式会社東芝 | 化学分析装置 |
| JP3880930B2 (ja) * | 2002-07-26 | 2007-02-14 | 株式会社エンプラス | プレートの接着部構造 |
| JP3880931B2 (ja) * | 2002-08-23 | 2007-02-14 | 株式会社エンプラス | プレートの組立構造 |
| EP1415707A1 (en) * | 2002-10-29 | 2004-05-06 | Corning Incorporated | Method and microfluidic reactor for photocatalysis |
| US7413709B2 (en) * | 2003-02-12 | 2008-08-19 | Agilent Technologies, Inc. | PAEK-based microfluidic device with integrated electrospray emitter |
| JP3768486B2 (ja) * | 2003-03-20 | 2006-04-19 | 株式会社エンプラス | 微小流体取扱装置 |
-
2005
- 2005-10-13 JP JP2007538553A patent/JP4969449B2/ja not_active Expired - Fee Related
- 2005-10-13 EP EP20050790197 patent/EP1807341A1/en not_active Withdrawn
- 2005-10-13 WO PCT/IB2005/053361 patent/WO2006046164A1/en not_active Ceased
- 2005-10-13 US US11/577,819 patent/US8916111B2/en not_active Expired - Fee Related
- 2005-10-13 CN CN2005800367753A patent/CN101048338B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1807341A1 (en) | 2007-07-18 |
| CN101048338B (zh) | 2013-10-30 |
| JP2008518225A (ja) | 2008-05-29 |
| US20090129986A1 (en) | 2009-05-21 |
| CN101048338A (zh) | 2007-10-03 |
| US8916111B2 (en) | 2014-12-23 |
| WO2006046164A1 (en) | 2006-05-04 |
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