JP4969100B2 - 半導体蛍光体の製造方法 - Google Patents
半導体蛍光体の製造方法 Download PDFInfo
- Publication number
- JP4969100B2 JP4969100B2 JP2005370937A JP2005370937A JP4969100B2 JP 4969100 B2 JP4969100 B2 JP 4969100B2 JP 2005370937 A JP2005370937 A JP 2005370937A JP 2005370937 A JP2005370937 A JP 2005370937A JP 4969100 B2 JP4969100 B2 JP 4969100B2
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- JP
- Japan
- Prior art keywords
- semiconductor phosphor
- semiconductor
- phosphor
- light
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Description
3・・・被覆層
5・・・蛍光体
9・・・マトリックス
11・・・波長変換器
13・・・発光素子
15・・・発光素子用配線基板
17・・・発光装置
Claims (1)
- AgBrおよびAgIの少なくとも一種以上と、
InCl3およびInI3の少なくとも一種以上と、
ジメチルジチオカルバミン酸亜鉛またはジエチルジチオカルバミン酸亜鉛とを液体中にて加熱することを特徴とする半導体蛍光体の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005370937A JP4969100B2 (ja) | 2005-12-22 | 2005-12-22 | 半導体蛍光体の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005370937A JP4969100B2 (ja) | 2005-12-22 | 2005-12-22 | 半導体蛍光体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007169525A JP2007169525A (ja) | 2007-07-05 |
JP4969100B2 true JP4969100B2 (ja) | 2012-07-04 |
Family
ID=38296511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005370937A Expired - Fee Related JP4969100B2 (ja) | 2005-12-22 | 2005-12-22 | 半導体蛍光体の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4969100B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5604835B2 (ja) * | 2008-09-30 | 2014-10-15 | 東レ株式会社 | 半導体ナノ粒子及びその製造方法 |
WO2010131402A1 (ja) * | 2009-05-15 | 2010-11-18 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
WO2012132239A1 (ja) * | 2011-03-31 | 2012-10-04 | パナソニック株式会社 | 蛍光フィルムおよび表示フィルム |
CN102903829B (zh) * | 2011-07-26 | 2015-01-07 | 展晶科技(深圳)有限公司 | 发光二极管光源装置 |
DE102013104776A1 (de) * | 2013-05-08 | 2014-11-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Wellenlängenkonversionselements, Wellenlängenkonversionselement und Bauelement aufweisend das Wellenlängenkonversionselement |
JP6466979B2 (ja) * | 2016-09-06 | 2019-02-06 | 国立大学法人名古屋大学 | 半導体ナノ粒子および半導体ナノ粒子の製造方法ならびに発光デバイス |
JP7007671B2 (ja) * | 2018-06-22 | 2022-01-24 | 国立大学法人東海国立大学機構 | 半導体ナノ粒子、その製造方法及び発光デバイス |
WO2021065782A1 (ja) * | 2019-10-03 | 2021-04-08 | Nsマテリアルズ株式会社 | 量子ドット、及び、その製造方法 |
CN112756000B (zh) * | 2019-11-04 | 2023-06-23 | 商丘师范学院 | 一种硫空位缺陷制备硫化物半导体/金属纳米粒子的方法及其应用 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5136877B2 (ja) * | 2004-07-16 | 2013-02-06 | 独立行政法人産業技術総合研究所 | 蛍光体、及びその製造方法 |
WO2007026746A1 (ja) * | 2005-09-02 | 2007-03-08 | National University Corporation Nagoya University | 半導体ナノ粒子及びその製造方法 |
JP2007169605A (ja) * | 2005-11-24 | 2007-07-05 | National Institute Of Advanced Industrial & Technology | 蛍光体、及びその製造方法 |
-
2005
- 2005-12-22 JP JP2005370937A patent/JP4969100B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2007169525A (ja) | 2007-07-05 |
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