JP4954836B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4954836B2
JP4954836B2 JP2007243507A JP2007243507A JP4954836B2 JP 4954836 B2 JP4954836 B2 JP 4954836B2 JP 2007243507 A JP2007243507 A JP 2007243507A JP 2007243507 A JP2007243507 A JP 2007243507A JP 4954836 B2 JP4954836 B2 JP 4954836B2
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layer
laser beam
laser
light
insulating layer
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JP2007243507A
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Japanese (ja)
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JP2008100285A (ja
JP2008100285A5 (https=
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洋正 大石
幸一郎 田中
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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JP2007243507A 2006-09-21 2007-09-20 半導体装置の作製方法 Expired - Fee Related JP4954836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007243507A JP4954836B2 (ja) 2006-09-21 2007-09-20 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006255863 2006-09-21
JP2006255863 2006-09-21
JP2007243507A JP4954836B2 (ja) 2006-09-21 2007-09-20 半導体装置の作製方法

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JP2008100285A JP2008100285A (ja) 2008-05-01
JP2008100285A5 JP2008100285A5 (https=) 2010-08-26
JP4954836B2 true JP4954836B2 (ja) 2012-06-20

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JP2007243507A Expired - Fee Related JP4954836B2 (ja) 2006-09-21 2007-09-20 半導体装置の作製方法

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5983407B2 (ja) * 2010-09-15 2016-08-31 住友電気工業株式会社 レーザ加工方法
WO2013035136A1 (ja) * 2011-09-08 2013-03-14 パナソニック株式会社 発光装置およびその製造方法
KR102401010B1 (ko) * 2014-02-27 2022-05-24 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법
KR20150102180A (ko) 2014-02-27 2015-09-07 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR102183530B1 (ko) * 2014-08-14 2020-11-27 엘지디스플레이 주식회사 유기발광표시패널
JP6134914B2 (ja) * 2014-09-08 2017-05-31 パナソニックＩｐマネジメント株式会社 コンフォーマルマスク材料のレーザ加工方法
KR101668629B1 (ko) * 2015-07-16 2016-10-24 포항공과대학교 산학협력단 2차원 구조의 질화물 반도체를 이용한 심자외선 발광 소자 및 그 제조 방법
CN109085152B (zh) * 2018-10-18 2024-05-14 吉林大学 一种多通道光纤式气体拉曼散射测量系统
CN111774732A (zh) * 2020-05-18 2020-10-16 武汉翔明激光科技有限公司 一种多激光头烧蚀集成控制系统及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2658809B2 (ja) * 1992-08-27 1997-09-30 三菱電機株式会社 レーザ加工装置
JP2833614B2 (ja) * 1994-06-30 1998-12-09 澁谷工業株式会社 レーザ加工機
JP3159906B2 (ja) * 1995-10-23 2001-04-23 アルプス電気株式会社 液晶表示素子の製造方法
JPH11773A (ja) * 1997-06-11 1999-01-06 Nec Corp レーザ加工装置およびその方法
JP2003179360A (ja) * 2001-12-11 2003-06-27 Victor Co Of Japan Ltd プリント基板の製造方法
JP4006994B2 (ja) * 2001-12-18 2007-11-14 株式会社リコー 立体構造体の加工方法、立体形状品の製造方法及び立体構造体
DE112004001527T5 (de) * 2003-08-19 2006-07-06 Electro Scientific Industries, Inc., Portland Verfahren und Lasersysteme zur Verbindungsbearbeitung unter Verwendung von Laserimpulsen mit speziell zugeschnittenen Leistungsprofilen
JP4977412B2 (ja) * 2006-07-13 2012-07-18 株式会社ディスコ レーザー加工装置

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JP2008100285A (ja) 2008-05-01

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