JP4954402B2 - 半導体チップの取付装置 - Google Patents

半導体チップの取付装置 Download PDF

Info

Publication number
JP4954402B2
JP4954402B2 JP2001266469A JP2001266469A JP4954402B2 JP 4954402 B2 JP4954402 B2 JP 4954402B2 JP 2001266469 A JP2001266469 A JP 2001266469A JP 2001266469 A JP2001266469 A JP 2001266469A JP 4954402 B2 JP4954402 B2 JP 4954402B2
Authority
JP
Japan
Prior art keywords
light
optical sensor
lens
optical element
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001266469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002184794A (ja
JP2002184794A5 (https=
Inventor
オイゲン・マンハート
シャン・トッチェン
トーマス・ギュンター
フェリックス・リュウ
Original Assignee
エセック・アーゲー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エセック・アーゲー filed Critical エセック・アーゲー
Publication of JP2002184794A publication Critical patent/JP2002184794A/ja
Publication of JP2002184794A5 publication Critical patent/JP2002184794A5/ja
Application granted granted Critical
Publication of JP4954402B2 publication Critical patent/JP4954402B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2001266469A 2000-09-13 2001-09-03 半導体チップの取付装置 Expired - Fee Related JP4954402B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00810824A EP1191831A1 (de) 2000-09-13 2000-09-13 Vorrichtung für die Montage von Halbleiterchips
EP00810824.3 2000-09-13

Publications (3)

Publication Number Publication Date
JP2002184794A JP2002184794A (ja) 2002-06-28
JP2002184794A5 JP2002184794A5 (https=) 2008-10-02
JP4954402B2 true JP4954402B2 (ja) 2012-06-13

Family

ID=8174905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001266469A Expired - Fee Related JP4954402B2 (ja) 2000-09-13 2001-09-03 半導体チップの取付装置

Country Status (4)

Country Link
EP (1) EP1191831A1 (https=)
JP (1) JP4954402B2 (https=)
AT (1) ATE447318T1 (https=)
DE (1) DE50115193D1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122535A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Pellet bonding device
JPH0797599B2 (ja) * 1990-04-27 1995-10-18 株式会社芝浦製作所 基板検出装置
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
JP3982597B2 (ja) * 1998-10-09 2007-09-26 日本電産トーソク株式会社 ダイボンダのチップ吸着機構

Also Published As

Publication number Publication date
JP2002184794A (ja) 2002-06-28
EP1191831A1 (de) 2002-03-27
ATE447318T1 (de) 2009-11-15
DE50115193D1 (de) 2009-12-10

Similar Documents

Publication Publication Date Title
US8081299B2 (en) Distance measuring apparatus
CN112752984B (zh) 用于lidar的波导扩散器
US6839958B2 (en) Apparatus for mounting semiconductor chips
US6392247B1 (en) Sensor and detection system having wide diverging beam optics
CN109454324A (zh) 激光光束分析仪单元和激光加工装置
JP4954402B2 (ja) 半導体チップの取付装置
JPH0837339A (ja) 反射光防止型半導体レーザダイオード装置
JP4303120B2 (ja) 半導体ウェハキャリア用マッピングセンサ
CN110140060B (zh) 用于激光雷达系统的光学组件、激光雷达系统和工作装置
JP2018040748A (ja) レーザー距離計測装置
JP2008535236A (ja) 発光ダイオード装置及び発光ダイオード装置を有する紙幣鑑別機用光学式検出装置
JP4064358B2 (ja) 光学素子の能動的整合用装置及び方法
US6857554B2 (en) Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
CN117405022A (zh) 校准系统以及校准方法
JP4473497B2 (ja) 光学式間隔スイッチならびに該光学式間隔スイッチを使用して構成素子を基板に取り付けるための取り付けヘッド、自動取り付け機械および方法
JPH06281740A (ja) 距離測定装置
KR20050009155A (ko) 누락 다이 검출
KR101739833B1 (ko) 다이본더 및 본딩 툴과 반도체 다이와의 상대 위치의 검출 방법
EP1189496B1 (de) Vorrichtung für die Montage von Halbleiterchips
JP7465376B2 (ja) 固浸レンズユニット、半導体検査装置
JPS6225210A (ja) 距離検出装置
JPH11230713A (ja) 光学式測定装置
JPH1164719A (ja) 焦点検出手段を備えた顕微鏡および変位計測装置
KR20240054363A (ko) 경통 부착 렌즈 및 광원 장치
CN100472744C (zh) 测量引线接合器上的无空气球的尺寸的设备

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20080627

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080717

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080717

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110406

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110711

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120214

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120314

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150323

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150323

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees