ATE447318T1 - Vorrichtung für die montage von halbleiterchips - Google Patents

Vorrichtung für die montage von halbleiterchips

Info

Publication number
ATE447318T1
ATE447318T1 AT01203005T AT01203005T ATE447318T1 AT E447318 T1 ATE447318 T1 AT E447318T1 AT 01203005 T AT01203005 T AT 01203005T AT 01203005 T AT01203005 T AT 01203005T AT E447318 T1 ATE447318 T1 AT E447318T1
Authority
AT
Austria
Prior art keywords
light
gripper
boring
lengthwise
semiconductor chips
Prior art date
Application number
AT01203005T
Other languages
German (de)
English (en)
Inventor
Eugen Mannhart
Thomas Guenther
Felix Leu
Tsing Dschen
Original Assignee
Esec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Ag filed Critical Esec Ag
Application granted granted Critical
Publication of ATE447318T1 publication Critical patent/ATE447318T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AT01203005T 2000-09-13 2001-08-07 Vorrichtung für die montage von halbleiterchips ATE447318T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00810824A EP1191831A1 (de) 2000-09-13 2000-09-13 Vorrichtung für die Montage von Halbleiterchips

Publications (1)

Publication Number Publication Date
ATE447318T1 true ATE447318T1 (de) 2009-11-15

Family

ID=8174905

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01203005T ATE447318T1 (de) 2000-09-13 2001-08-07 Vorrichtung für die montage von halbleiterchips

Country Status (4)

Country Link
EP (1) EP1191831A1 (https=)
JP (1) JP4954402B2 (https=)
AT (1) ATE447318T1 (https=)
DE (1) DE50115193D1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122535A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Pellet bonding device
JPH0797599B2 (ja) * 1990-04-27 1995-10-18 株式会社芝浦製作所 基板検出装置
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
JP3982597B2 (ja) * 1998-10-09 2007-09-26 日本電産トーソク株式会社 ダイボンダのチップ吸着機構

Also Published As

Publication number Publication date
JP2002184794A (ja) 2002-06-28
EP1191831A1 (de) 2002-03-27
JP4954402B2 (ja) 2012-06-13
DE50115193D1 (de) 2009-12-10

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee