DE50115193D1 - Vorrichtung für die Montage von Halbleiterchips - Google Patents

Vorrichtung für die Montage von Halbleiterchips

Info

Publication number
DE50115193D1
DE50115193D1 DE50115193T DE50115193T DE50115193D1 DE 50115193 D1 DE50115193 D1 DE 50115193D1 DE 50115193 T DE50115193 T DE 50115193T DE 50115193 T DE50115193 T DE 50115193T DE 50115193 D1 DE50115193 D1 DE 50115193D1
Authority
DE
Germany
Prior art keywords
light
gripper
boring
lengthwise
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50115193T
Other languages
German (de)
English (en)
Inventor
Eugen Mannhart
Thomas Guenther
Felix Leu
Tsing Dschen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec AG filed Critical Esec AG
Application granted granted Critical
Publication of DE50115193D1 publication Critical patent/DE50115193D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE50115193T 2000-09-13 2001-08-07 Vorrichtung für die Montage von Halbleiterchips Expired - Lifetime DE50115193D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00810824A EP1191831A1 (de) 2000-09-13 2000-09-13 Vorrichtung für die Montage von Halbleiterchips

Publications (1)

Publication Number Publication Date
DE50115193D1 true DE50115193D1 (de) 2009-12-10

Family

ID=8174905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50115193T Expired - Lifetime DE50115193D1 (de) 2000-09-13 2001-08-07 Vorrichtung für die Montage von Halbleiterchips

Country Status (4)

Country Link
EP (1) EP1191831A1 (https=)
JP (1) JP4954402B2 (https=)
AT (1) ATE447318T1 (https=)
DE (1) DE50115193D1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122535A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Pellet bonding device
JPH0797599B2 (ja) * 1990-04-27 1995-10-18 株式会社芝浦製作所 基板検出装置
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
JP3982597B2 (ja) * 1998-10-09 2007-09-26 日本電産トーソク株式会社 ダイボンダのチップ吸着機構

Also Published As

Publication number Publication date
JP2002184794A (ja) 2002-06-28
EP1191831A1 (de) 2002-03-27
ATE447318T1 (de) 2009-11-15
JP4954402B2 (ja) 2012-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition