JP2002184794A5 - - Google Patents
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- Publication number
- JP2002184794A5 JP2002184794A5 JP2001266469A JP2001266469A JP2002184794A5 JP 2002184794 A5 JP2002184794 A5 JP 2002184794A5 JP 2001266469 A JP2001266469 A JP 2001266469A JP 2001266469 A JP2001266469 A JP 2001266469A JP 2002184794 A5 JP2002184794 A5 JP 2002184794A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00810824A EP1191831A1 (de) | 2000-09-13 | 2000-09-13 | Vorrichtung für die Montage von Halbleiterchips |
| EP00810824.3 | 2000-09-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002184794A JP2002184794A (ja) | 2002-06-28 |
| JP2002184794A5 true JP2002184794A5 (https=) | 2008-10-02 |
| JP4954402B2 JP4954402B2 (ja) | 2012-06-13 |
Family
ID=8174905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001266469A Expired - Fee Related JP4954402B2 (ja) | 2000-09-13 | 2001-09-03 | 半導体チップの取付装置 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1191831A1 (https=) |
| JP (1) | JP4954402B2 (https=) |
| AT (1) | ATE447318T1 (https=) |
| DE (1) | DE50115193D1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH697294B1 (de) * | 2003-12-22 | 2008-08-15 | Oerlikon Assembly Equipment Ag | Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat. |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57122535A (en) * | 1981-01-23 | 1982-07-30 | Hitachi Ltd | Pellet bonding device |
| JPH0797599B2 (ja) * | 1990-04-27 | 1995-10-18 | 株式会社芝浦製作所 | 基板検出装置 |
| JPH1068759A (ja) * | 1996-05-31 | 1998-03-10 | Advantest Corp | 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法 |
| JP3982597B2 (ja) * | 1998-10-09 | 2007-09-26 | 日本電産トーソク株式会社 | ダイボンダのチップ吸着機構 |
-
2000
- 2000-09-13 EP EP00810824A patent/EP1191831A1/de not_active Withdrawn
-
2001
- 2001-08-07 DE DE50115193T patent/DE50115193D1/de not_active Expired - Lifetime
- 2001-08-07 AT AT01203005T patent/ATE447318T1/de not_active IP Right Cessation
- 2001-09-03 JP JP2001266469A patent/JP4954402B2/ja not_active Expired - Fee Related