JP4954365B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4954365B2
JP4954365B2 JP2000361905A JP2000361905A JP4954365B2 JP 4954365 B2 JP4954365 B2 JP 4954365B2 JP 2000361905 A JP2000361905 A JP 2000361905A JP 2000361905 A JP2000361905 A JP 2000361905A JP 4954365 B2 JP4954365 B2 JP 4954365B2
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Japan
Prior art keywords
film
source line
insulating film
wiring
conductive film
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Expired - Fee Related
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JP2000361905A
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English (en)
Japanese (ja)
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JP2002222954A5 (enExample
JP2002222954A (ja
Inventor
徹 高山
達也 荒尾
智史 村上
真之 坂倉
敏次 浜谷
崇 浜田
洋介 塚本
裕之 小川
拓哉 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Sharp Corp
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Semiconductor Energy Laboratory Co Ltd
Sharp Corp
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Priority to JP2000361905A priority Critical patent/JP4954365B2/ja
Publication of JP2002222954A publication Critical patent/JP2002222954A/ja
Publication of JP2002222954A5 publication Critical patent/JP2002222954A5/ja
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Publication of JP4954365B2 publication Critical patent/JP4954365B2/ja
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  • Liquid Crystal (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
JP2000361905A 2000-11-28 2000-11-28 半導体装置の作製方法 Expired - Fee Related JP4954365B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000361905A JP4954365B2 (ja) 2000-11-28 2000-11-28 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000361905A JP4954365B2 (ja) 2000-11-28 2000-11-28 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2002222954A JP2002222954A (ja) 2002-08-09
JP2002222954A5 JP2002222954A5 (enExample) 2008-01-24
JP4954365B2 true JP4954365B2 (ja) 2012-06-13

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JP2000361905A Expired - Fee Related JP4954365B2 (ja) 2000-11-28 2000-11-28 半導体装置の作製方法

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JP (1) JP4954365B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW525216B (en) 2000-12-11 2003-03-21 Semiconductor Energy Lab Semiconductor device, and manufacturing method thereof
SG111923A1 (en) 2000-12-21 2005-06-29 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
JP4275644B2 (ja) * 2004-06-23 2009-06-10 シャープ株式会社 アクティブマトリクス基板およびその製造方法、並びに電子装置
US8149346B2 (en) 2005-10-14 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
JP5572757B2 (ja) 2011-02-28 2014-08-13 シャープ株式会社 電極基板並びにそれを備えた表示装置及びタッチパネル

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2720470B2 (ja) * 1988-08-26 1998-03-04 富士通株式会社 薄膜トランジスタマトリクスの製造方法
JPH03260631A (ja) * 1990-03-12 1991-11-20 Fujitsu Ltd 薄膜トランジスタマトリクスとその製造方法
JPH04313729A (ja) * 1991-04-09 1992-11-05 Mitsubishi Electric Corp 液晶表示装置
JP2556262B2 (ja) * 1993-07-07 1996-11-20 日本電気株式会社 液晶表示パネル
JPH10198292A (ja) * 1996-12-30 1998-07-31 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法

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JP2002222954A (ja) 2002-08-09

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