JP4949626B2 - 2つの板状の形状の物体を接着するための方法及び装置 - Google Patents
2つの板状の形状の物体を接着するための方法及び装置 Download PDFInfo
- Publication number
- JP4949626B2 JP4949626B2 JP2004533704A JP2004533704A JP4949626B2 JP 4949626 B2 JP4949626 B2 JP 4949626B2 JP 2004533704 A JP2004533704 A JP 2004533704A JP 2004533704 A JP2004533704 A JP 2004533704A JP 4949626 B2 JP4949626 B2 JP 4949626B2
- Authority
- JP
- Japan
- Prior art keywords
- curing chamber
- heating element
- plate
- curing
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 230000005855 radiation Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Replacement Of Web Rolls (AREA)
Description
2 支持テーブル
3 熱遮蔽部材
5 2つの板状の形状の物体
6 支持棒
11 硬化室
12 紫外線ランプ
13 加熱要素
Claims (6)
- 硬化処理の第1期間において紫外線光照射によって硬化され、及び、前記硬化処理の第1期間に続く期間において加熱によって硬化される接着剤で、2つの板状の形状の物体を接着するための方法において、
間に前記接着剤がある前記2つの板状の形状の物体は、紫外線ランプ及び加熱要素を備える硬化室内に搬送され、
少なくとも前記硬化処理の第1期間中、移動可能な熱遮蔽部材が、前記物体と前記加熱要素との間に一時的に存在することを特徴とする方法。 - 前記移動可能な熱遮蔽部材は、前記硬化処理の第1期間に続く期間中、熱遮蔽部材の冷却が可能となるように、前記硬化室の外部に配置されていることを特徴とする請求項1記載の方法。
- 前記熱遮蔽部材は、前記物体を前記硬化室内に搬送するための搬送装置の一部であることを特徴とする請求項1又は2記載の方法。
- 前記硬化処理の間、前記搬送装置は、少なくとも30秒間、前記硬化室にとどまり、続いて、前記搬送装置は、前記物体が少なくとも60秒間、前記硬化室にとどまっている間に、前記硬化室の外部に移動させられることを特徴とする請求項3記載の方法。
- 前記搬送装置が前記硬化室の外部に移動させられた後、前記物体は、前記加熱要素の方向に移動させられることを特徴とする請求項4記載の方法。
- 次のステップ、
(a)間に前記接着剤がある前記2つの板状の形状の物体を、前記紫外線照射ランプ及び前記加熱要素を備える前記硬化室内に移動させることと、
(b)前記物体が紫外線照射に曝されている間、少なくとも30秒間、前記物体と前記加熱要素との間に、前記熱遮蔽部材を保持することと、
(c)前記物体が前記加熱要素によって加熱させられている間、少なくとも60秒間、前記熱遮蔽部材を取り除くことと、
(d)前記物体を前記硬化室の外部に移動させることと
を備えることを特徴とする請求項1乃至5のいずれかに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02078629 | 2002-09-04 | ||
EP02078629.9 | 2002-09-04 | ||
PCT/IB2003/003423 WO2004022662A1 (en) | 2002-09-04 | 2003-08-04 | A method and a device for bonding two plate-shaped objects |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005538205A JP2005538205A (ja) | 2005-12-15 |
JP4949626B2 true JP4949626B2 (ja) | 2012-06-13 |
Family
ID=31970387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004533704A Expired - Fee Related JP4949626B2 (ja) | 2002-09-04 | 2003-08-04 | 2つの板状の形状の物体を接着するための方法及び装置 |
Country Status (9)
Country | Link |
---|---|
US (2) | US7271075B2 (ja) |
EP (1) | EP1537184B1 (ja) |
JP (1) | JP4949626B2 (ja) |
KR (1) | KR101016979B1 (ja) |
AT (1) | ATE362965T1 (ja) |
AU (1) | AU2003250435A1 (ja) |
DE (1) | DE60313980T2 (ja) |
TW (1) | TWI289154B (ja) |
WO (1) | WO2004022662A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100467021B1 (ko) * | 2002-08-20 | 2005-01-24 | 삼성전자주식회사 | 반도체 소자의 콘택 구조체 및 그 제조방법 |
JP2011040476A (ja) * | 2009-08-07 | 2011-02-24 | Lintec Corp | エネルギー付与装置およびエネルギー付与方法 |
KR102512276B1 (ko) * | 2016-03-07 | 2023-03-22 | 삼성디스플레이 주식회사 | 합착장치 및 이를 이용한 합착방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54105774A (en) | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
US5705232A (en) * | 1994-09-20 | 1998-01-06 | Texas Instruments Incorporated | In-situ coat, bake and cure of dielectric material processing system for semiconductor manufacturing |
DE19538468B4 (de) * | 1995-10-16 | 2007-10-11 | Siemens Ag | Verfahren zur flächigen Verklebung von Werkstücken, geklebter Verbund und Verwendung davon |
JP2000501551A (ja) | 1995-12-06 | 2000-02-08 | シーメンス アクチエンゲゼルシヤフト | 導電性反応樹脂混合物 |
JP4833386B2 (ja) | 1997-11-26 | 2011-12-07 | エヌエックスピー ビー ヴィ | 2つの板状物体を接着するための方法及び装置 |
JP2000167569A (ja) | 1998-12-07 | 2000-06-20 | Mesco Inc | 銅含有酸性排水の処理方法および処理設備 |
IT1313118B1 (it) * | 1999-08-25 | 2002-06-17 | Morton Int Inc | Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello |
JP2002167569A (ja) * | 2000-11-29 | 2002-06-11 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
JP3627011B2 (ja) * | 2001-02-13 | 2005-03-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 接合方法 |
JP5079949B2 (ja) * | 2001-04-06 | 2012-11-21 | 東京エレクトロン株式会社 | 処理装置および処理方法 |
US7279069B2 (en) * | 2002-07-18 | 2007-10-09 | Origin Electric Company Limited | Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus |
-
2003
- 2003-08-04 AT AT03793937T patent/ATE362965T1/de not_active IP Right Cessation
- 2003-08-04 KR KR1020057003659A patent/KR101016979B1/ko active IP Right Grant
- 2003-08-04 AU AU2003250435A patent/AU2003250435A1/en not_active Abandoned
- 2003-08-04 JP JP2004533704A patent/JP4949626B2/ja not_active Expired - Fee Related
- 2003-08-04 US US10/526,191 patent/US7271075B2/en not_active Expired - Lifetime
- 2003-08-04 EP EP03793937A patent/EP1537184B1/en not_active Expired - Lifetime
- 2003-08-04 WO PCT/IB2003/003423 patent/WO2004022662A1/en active IP Right Grant
- 2003-08-04 DE DE60313980T patent/DE60313980T2/de not_active Expired - Lifetime
- 2003-09-01 TW TW092124093A patent/TWI289154B/zh not_active IP Right Cessation
-
2007
- 2007-07-03 US US11/773,149 patent/US7845378B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7845378B2 (en) | 2010-12-07 |
ATE362965T1 (de) | 2007-06-15 |
KR101016979B1 (ko) | 2011-02-28 |
EP1537184B1 (en) | 2007-05-23 |
TWI289154B (en) | 2007-11-01 |
US20050245047A1 (en) | 2005-11-03 |
US7271075B2 (en) | 2007-09-18 |
JP2005538205A (ja) | 2005-12-15 |
KR20050057122A (ko) | 2005-06-16 |
DE60313980T2 (de) | 2008-01-17 |
AU2003250435A1 (en) | 2004-03-29 |
US20080011427A1 (en) | 2008-01-17 |
WO2004022662A1 (en) | 2004-03-18 |
TW200415223A (en) | 2004-08-16 |
EP1537184A1 (en) | 2005-06-08 |
DE60313980D1 (de) | 2007-07-05 |
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